Zhiqiang Xiang

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded substrate, circuit board assembly, and electronic device
- Patent number 12,224,146
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Chao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging structure, preparation method thereof, and termi...
- Patent number 12,205,876
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level direct current converter and power supply system
- Patent number 12,095,387
- Issue date Sep 17, 2024
- Huawei Technologies Co., Ltd.
- Guolei Yu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic component package body, electronic component assembly st...
- Patent number 12,089,336
- Issue date Sep 10, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module and metal plate
- Patent number 11,955,891
- Issue date Apr 9, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply circuit, electronic component, mobile phone terminal,...
- Patent number 11,063,517
- Issue date Jul 13, 2021
- Huawei Technologies Co., Ltd.
- Yujian Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power supply bus circuit
- Patent number 9,431,916
- Issue date Aug 30, 2016
- Huawei Technologies Co., Ltd.
- Zhiqiang Xiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240178160
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND PHOTOVOLTAIC POWER OPTIMIZER
- Publication number 20240072724
- Publication date Feb 29, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Zhiqiang XIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multi-Level Direct Current Converter and Power Supply System
- Publication number 20230061103
- Publication date Mar 2, 2023
- Huawei Technologies Co., Ltd
- Guolei YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THREE-LEVEL DIRECT CURRENT CONVERTER, POWER SUPPLY SYSTEM, AND CHIP
- Publication number 20230029565
- Publication date Feb 2, 2023
- Huawei Technologies Co., Ltd
- Guolei YU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20230028233
- Publication date Jan 26, 2023
- Huawei Technologies Co., Ltd
- Chao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COT PARALLEL CIRCUIT AND POWER SUPPLY DEVICE
- Publication number 20220407422
- Publication date Dec 22, 2022
- Huawei Technologies Co., Ltd
- Junliang QIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT PACKAGE ASS...
- Publication number 20220384380
- Publication date Dec 1, 2022
- Huawei Technologies Co., Ltd
- Zhiqiang XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT ASSEMBLY ST...
- Publication number 20220256709
- Publication date Aug 11, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Zhiqiang XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING STRUCTURE, PREPARATION METHOD THEREOF, AND TERMI...
- Publication number 20220223510
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Zhiqiang XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE AND METAL PLATE
- Publication number 20210343663
- Publication date Nov 4, 2021
- Huawei Technologies Co., Ltd
- Zhiqiang XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY CIRCUIT, ELECTRONIC COMPONENT, MOBILE PHONE TERMINAL,...
- Publication number 20200161978
- Publication date May 21, 2020
- Huawei Technologies Co., Ltd
- Yujian LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Power Supply Bus Circuit
- Publication number 20150326104
- Publication date Nov 12, 2015
- Huawei Technologies Co., Ltd
- Zhiqiang Xiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Zhiqiang Xiang

Person

Patents Grantslast 30 patents

Embedded substrate, circuit board assembly, and electronic device

Embedded packaging structure, preparation method thereof, and termi...

Multi-level direct current converter and power supply system

Electronic component package body, electronic component assembly st...

Packaged module and metal plate

Lead frame, packaged integrated circuit board, power chip, and circ...

Power supply circuit, electronic component, mobile phone terminal,...

Power supply bus circuit

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND ELECTRONIC APPARATUS

ELECTRONIC APPARATUS AND PHOTOVOLTAIC POWER OPTIMIZER

Multi-Level Direct Current Converter and Power Supply System

THREE-LEVEL DIRECT CURRENT CONVERTER, POWER SUPPLY SYSTEM, AND CHIP

EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

COT PARALLEL CIRCUIT AND POWER SUPPLY DEVICE

ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT PACKAGE ASS...

ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT ASSEMBLY ST...

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

EMBEDDED PACKAGING STRUCTURE, PREPARATION METHOD THEREOF, AND TERMI...

PACKAGED MODULE AND METAL PLATE

POWER SUPPLY CIRCUIT, ELECTRONIC COMPONENT, MOBILE PHONE TERMINAL,...

Power Supply Bus Circuit