ZHITAO CAO

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,735,526
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,309,246
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for high compressive stress film deposition to improve ki...
- Patent number 10,115,573
- Issue date Oct 30, 2018
- Applied Materials, Inc.
- Junqi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic passive devices using magnetic film
- Patent number 10,102,962
- Issue date Oct 16, 2018
- Apple Inc.
- David P. Cappabianca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for nodule control in a titanium-tungsten target
- Patent number 9,960,023
- Issue date May 1, 2018
- Applied Materials, Inc.
- Junqi Wei
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods for depositing materials in high aspect ratio features
- Patent number 8,835,308
- Issue date Sep 16, 2014
- Applied Materials, Inc.
- Zhitao Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20230335494
- Publication date Oct 19, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20220285273
- Publication date Sep 8, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY 3D INTERCONNECT CONFIGURATION
- Publication number 20210242170
- Publication date Aug 5, 2021
- Apple Inc.
- Sanjay Dabral
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED MAGNETIC PASSIVE DEVICES USING MAGNETIC FILM
- Publication number 20190051449
- Publication date Feb 14, 2019
- Apple Inc.
- David P. Cappabianca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR NODULE CONTROL IN A TITANIUM-TUNGSTEN TARGET
- Publication number 20160189941
- Publication date Jun 30, 2016
- Applied Materials, Inc.
- Junqi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HIGH COMPRESSIVE STRESS FILM DEPOSITION TO IMPROVE KI...
- Publication number 20160104603
- Publication date Apr 14, 2016
- JUNQI WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DEPOSITING MATERIALS IN HIGH ASPECT RATIO FEATURES
- Publication number 20120156872
- Publication date Jun 21, 2012
- Applied Materials, Inc.
- ZHITAO CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW MOISTURE DIELECTRIC FILMS
- Publication number 20120058281
- Publication date Mar 8, 2012
- Applied Materials, Inc.
- Zhong Qiang Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

High density 3D interconnect configuration

High density 3D interconnect configuration

Apparatus for high compressive stress film deposition to improve ki...

Integrated magnetic passive devices using magnetic film

Methods and apparatus for nodule control in a titanium-tungsten target

Methods for depositing materials in high aspect ratio features

Patents Applicationslast 30 patents

Semiconductor Package with Local Interconnect and Chiplet Integration

High Density 3D Interconnect Configuration

High Density 3D Interconnect Configuration

HIGH DENSITY 3D INTERCONNECT CONFIGURATION

INTEGRATED MAGNETIC PASSIVE DEVICES USING MAGNETIC FILM

METHODS AND APPARATUS FOR NODULE CONTROL IN A TITANIUM-TUNGSTEN TARGET

APPARATUS FOR HIGH COMPRESSIVE STRESS FILM DEPOSITION TO IMPROVE KI...

METHODS FOR DEPOSITING MATERIALS IN HIGH ASPECT RATIO FEATURES

METHODS FOR FORMING LOW MOISTURE DIELECTRIC FILMS