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Zhiwen CHEN

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Patents Grantslast 30 patents

  • Information Patent Grant

    Laser reflow apparatus and laser reflow method
    • Patent number 11,935,863
    • Issue date Mar 19, 2024
    • Disco Corporation
    • Satoshi Kobayashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Die bonding for chip conveying apparatus
    • Patent number 11,929,344
    • Issue date Mar 12, 2024
    • Disco Corporation
    • Hiromitsu Yoshimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,573,560
    • Issue date Feb 25, 2020
    • Disco Corporation
    • Kota Fukaya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER BEAM IRRADIATION APPARATUS
    • Publication number 20230321753
    • Publication date Oct 12, 2023
    • Disco Corporation
    • Teppei NOMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INSPECTION METHOD
    • Publication number 20230314234
    • Publication date Oct 5, 2023
    • Disco Corporation
    • Teppei NOMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER BEAM APPLYING APPARATUS
    • Publication number 20230278125
    • Publication date Sep 7, 2023
    • Disco Corporation
    • Teppei NOMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING WAFER
    • Publication number 20230261134
    • Publication date Aug 17, 2023
    • Disco Corporation
    • Teppei NOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER REFLOW METHOD
    • Publication number 20230256546
    • Publication date Aug 17, 2023
    • Disco Corporation
    • Teppei NOMURA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING LAYERED DEVICE CHIP ASSEMBLY
    • Publication number 20230096486
    • Publication date Mar 30, 2023
    • Disco Corporation
    • Shunsuke TERANISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP CONVEYING APPARATUS AND DIE BONDER
    • Publication number 20230031977
    • Publication date Feb 2, 2023
    • Disco Corporation
    • Hiromitsu YOSHIMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED DEVICE WAFER FORMING METHOD
    • Publication number 20230020620
    • Publication date Jan 19, 2023
    • Disco Corporation
    • Zhiwen CHEN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING LED DISPLAY PANEL
    • Publication number 20220336715
    • Publication date Oct 20, 2022
    • Disco Corporation
    • Zhiwen CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER REFLOW APPARATUS AND LASER REFLOW METHOD
    • Publication number 20210202431
    • Publication date Jul 1, 2021
    • Disco Corporation
    • Satoshi KOBAYASHI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190172749
    • Publication date Jun 6, 2019
    • Disco Corporation
    • Kota FUKAYA
    • H01 - BASIC ELECTRIC ELEMENTS