Zhixin Cui

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device with a conductive drain-select-leve...
- Patent number 12,010,835
- Issue date Jun 11, 2024
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with separated contact regions and...
- Patent number 11,889,694
- Issue date Jan 30, 2024
- SanDisk Technologies LLC
- Hardwell Chibvongodze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including laterally-undulating memo...
- Patent number 11,877,452
- Issue date Jan 16, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
Information Patent Grant
Multilevel memory stack structure with tapered inter-tier joint reg...
- Patent number 11,621,277
- Issue date Apr 4, 2023
- SanDisk Technologies LLC
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a composite semiconductor...
- Patent number 11,600,634
- Issue date Mar 7, 2023
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including a composite semiconductor...
- Patent number 11,552,100
- Issue date Jan 10, 2023
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including laterally-undulating memo...
- Patent number 11,515,326
- Issue date Nov 29, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory block with separately driven source regions to improve perfo...
- Patent number 11,361,816
- Issue date Jun 14, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including bump-containing bit lines...
- Patent number 11,355,437
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-stack contact via structures for a three-dimensional memory...
- Patent number 11,342,245
- Issue date May 24, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die assembly including double-sided inter-die bonding conne...
- Patent number 11,335,671
- Issue date May 17, 2022
- SanDisk Technologies LLC
- Hardwell Chibvongodze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including a composite semiconductor...
- Patent number 11,302,714
- Issue date Apr 12, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including composite word lines and...
- Patent number 11,244,958
- Issue date Feb 8, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing inter-select-gate electr...
- Patent number 11,222,954
- Issue date Jan 11, 2022
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with composite charge storage struc...
- Patent number 11,114,462
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including different height memory s...
- Patent number 11,094,715
- Issue date Aug 17, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional NOR-NAND combination memory device and method of...
- Patent number 11,069,410
- Issue date Jul 20, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional device with bonded structures including a support...
- Patent number 11,069,703
- Issue date Jul 20, 2021
- SanDisk Technologies LLC
- Akio Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 11,049,876
- Issue date Jun 29, 2021
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flat NAND memory device having curved memory elem...
- Patent number 11,024,635
- Issue date Jun 1, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flat NAND memory device having curved memory elem...
- Patent number 10,930,674
- Issue date Feb 23, 2021
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-memory-level con...
- Patent number 10,903,230
- Issue date Jan 26, 2021
- SanDisk Technologies LLC
- Michimoto Kaminaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a carbon-doped source co...
- Patent number 10,903,222
- Issue date Jan 26, 2021
- SanDisk Technologies LLC
- Kiyohiko Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including composite word lines and...
- Patent number 10,818,542
- Issue date Oct 27, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing memory die bonded to integrated peripher...
- Patent number 10,811,058
- Issue date Oct 20, 2020
- SanDisk Technologies LLC
- Yanli Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory device with self-aligned vertical conducti...
- Patent number 10,777,575
- Issue date Sep 15, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with locally modulated threshold vo...
- Patent number 10,756,106
- Issue date Aug 25, 2020
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including different height memory s...
- Patent number 10,741,579
- Issue date Aug 11, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including composite word lines and...
- Patent number 10,707,233
- Issue date Jul 7, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flat NAND memory device having curved memory elem...
- Patent number 10,700,078
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DUMMY WORD LINE WITH TA...
- Publication number 20230328981
- Publication date Oct 12, 2023
- SANDISK TECHNOLOGIES LLC
- Nobuyuki Fujimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230041950
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Hardwell Chibvongodze
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230038557
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- Hiroyuki Ogawa
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH A CONDUCTIVE DRAIN-SELECT-LEVE...
- Publication number 20220344362
- Publication date Oct 27, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...
- Publication number 20220285387
- Publication date Sep 8, 2022
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...
- Publication number 20220285388
- Publication date Sep 8, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK WITH SEPARATELY DRIVEN SOURCE REGIONS TO IMPROVE PERFO...
- Publication number 20220059157
- Publication date Feb 24, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BUMP-CONTAINING BIT LINES...
- Publication number 20220045005
- Publication date Feb 10, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...
- Publication number 20220045090
- Publication date Feb 10, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...
- Publication number 20220045091
- Publication date Feb 10, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...
- Publication number 20220045092
- Publication date Feb 10, 2022
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING CONNE...
- Publication number 20210375847
- Publication date Dec 2, 2021
- SANDISK TECHNOLOGIES LLC
- Hardwell CHIBVONGODZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20210366808
- Publication date Nov 25, 2021
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INTER-SELECT-GATE ELECTR...
- Publication number 20210305384
- Publication date Sep 30, 2021
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH COMPOSITE CHARGE STORAGE STRUC...
- Publication number 20210257379
- Publication date Aug 19, 2021
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...
- Publication number 20210066347
- Publication date Mar 4, 2021
- SANDISK TECHNOLOGIES LLC
- Monica TITUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIFFERENT HEIGHT MEMORY S...
- Publication number 20200335518
- Publication date Oct 22, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE WORD LINES AND...
- Publication number 20200312875
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE WORD LINES AND...
- Publication number 20200312706
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED VERTICAL CONDUCTI...
- Publication number 20200303397
- Publication date Sep 24, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...
- Publication number 20200286875
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Akio NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING CURVED MEMORY ELEM...
- Publication number 20200286903
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING CURVED MEMORY ELEM...
- Publication number 20200286915
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...
- Publication number 20200286917
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Michimoto KAMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A CARBON-DOPED SOURCE CO...
- Publication number 20200251479
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Kiyohiko SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING MEMORY DIE BONDED TO INTEGRATED PERIPHER...
- Publication number 20200251149
- Publication date Aug 6, 2020
- SANDISK TECHNOLOGIES LLC
- Yanli ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIFFERENT HEIGHT MEMORY S...
- Publication number 20200185405
- Publication date Jun 11, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LOCALLY MODULATED THRESHOLD VO...
- Publication number 20200168623
- Publication date May 28, 2020
- SANDISK TECHNOLOGIES LLC
- Masatoshi NISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Memory Device Including Bottle-Shaped Memory Stac...
- Publication number 20200098780
- Publication date Mar 26, 2020
- SANDISK TECHNOLOGIES LLC
- Zhixin CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHODS OF MAKING THE SAME USIN...
- Publication number 20190326313
- Publication date Oct 24, 2019
- SANDISK TECHNOLOGIES LLC
- Zhixin Cui
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Three-dimensional memory device with a conductive drain-select-leve...

Three-dimensional memory device with separated contact regions and...

Three-dimensional memory device including laterally-undulating memo...

Multilevel memory stack structure with tapered inter-tier joint reg...

Three-dimensional memory device including a composite semiconductor...

Three-dimensional memory device including a composite semiconductor...

Three-dimensional memory device including laterally-undulating memo...

Memory block with separately driven source regions to improve perfo...

Three-dimensional memory device including bump-containing bit lines...

Through-stack contact via structures for a three-dimensional memory...

Stacked die assembly including double-sided inter-die bonding conne...

Three-dimensional memory device including a composite semiconductor...

Three-dimensional memory device including composite word lines and...

Three-dimensional memory device containing inter-select-gate electr...

Three-dimensional memory device with composite charge storage struc...

Three-dimensional memory device including different height memory s...

Three-dimensional NOR-NAND combination memory device and method of...

Three-dimensional device with bonded structures including a support...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional flat NAND memory device having curved memory elem...

Three-dimensional flat NAND memory device having curved memory elem...

Three-dimensional memory device containing through-memory-level con...

Three-dimensional memory device containing a carbon-doped source co...

Three-dimensional memory device including composite word lines and...

Bonded assembly containing memory die bonded to integrated peripher...

Three-dimensional memory device with self-aligned vertical conducti...

Three-dimensional memory device with locally modulated threshold vo...

Three-dimensional memory device including different height memory s...

Three-dimensional memory device including composite word lines and...

Three-dimensional flat NAND memory device having curved memory elem...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A DUMMY WORD LINE WITH TA...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

THREE-DIMENSIONAL MEMORY DEVICE WITH A CONDUCTIVE DRAIN-SELECT-LEVE...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LATERALLY-UNDULATING MEMO...

MEMORY BLOCK WITH SEPARATELY DRIVEN SOURCE REGIONS TO IMPROVE PERFO...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BUMP-CONTAINING BIT LINES...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A COMPOSITE SEMICONDUCTOR...

STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING CONNE...

THROUGH-STACK CONTACT VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INTER-SELECT-GATE ELECTR...

THREE-DIMENSIONAL MEMORY DEVICE WITH COMPOSITE CHARGE STORAGE STRUC...

MULTILEVEL MEMORY STACK STRUCTURE WITH TAPERED INTER-TIER JOINT REG...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIFFERENT HEIGHT MEMORY S...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE WORD LINES AND...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COMPOSITE WORD LINES AND...

THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED VERTICAL CONDUCTI...

THREE-DIMENSIONAL DEVICE WITH BONDED STRUCTURES INCLUDING A SUPPORT...

THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING CURVED MEMORY ELEM...

THREE-DIMENSIONAL FLAT NAND MEMORY DEVICE HAVING CURVED MEMORY ELEM...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-MEMORY-LEVEL CON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A CARBON-DOPED SOURCE CO...

BONDED ASSEMBLY CONTAINING MEMORY DIE BONDED TO INTEGRATED PERIPHER...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIFFERENT HEIGHT MEMORY S...

THREE-DIMENSIONAL MEMORY DEVICE WITH LOCALLY MODULATED THRESHOLD VO...

Three-Dimensional Memory Device Including Bottle-Shaped Memory Stac...

THREE-DIMENSIONAL MEMORY DEVICE AND METHODS OF MAKING THE SAME USIN...