Zhixin XIE

Person

Chandler, AZ, US

People

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...
- Publication number 20250218953
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING
- Publication number 20250218885
- Publication date Jul 3, 2025
- Intel Corporation
- Hong Seung YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...
- Publication number 20250218984
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING SYSTEM AND MOLDING METHOD
- Publication number 20250144857
- Publication date May 8, 2025
- Intel Corporation
- Zhixin XIE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...
- Publication number 20250112138
- Publication date Apr 3, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEDIA TRAY WITH SWITCHABLE ADHESION
- Publication number 20240327679
- Publication date Oct 3, 2024
- Intel Corporation
- Yuan MENG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS
- Publication number 20240210634
- Publication date Jun 27, 2024
- Intel Corporation
- Zhixin XIE
- G02 - OPTICS
Information Patent Application
MATERIAL DEPOSITION APPARATUS AND METHOD
- Publication number 20240188223
- Publication date Jun 6, 2024
- Intel Corporation
- Zhixin XIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR EMBEDDING INTERCONNECT BRIDGES HAVING THR...

Technologies for Components Embedded in a Substrate Core

PATTERNED MOLD UNDERFILL (MUF) FILMS FOR DEEP TRENCH FILLING

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...

MOLDING SYSTEM AND MOLDING METHOD

MICROELECTRONIC STRUCTURES INCLUDING GLASS SUBSTRATES WITH DIELECTR...

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

MEDIA TRAY WITH SWITCHABLE ADHESION

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

FUNCTIONALLY GRADED INDEX MOLD FOR CO-PACKAGED OPTICAL APPLICATIONS

MATERIAL DEPOSITION APPARATUS AND METHOD