Zhiyong Ma

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming secured metal gate antifuse structures
- Patent number 9,123,724
- Issue date Sep 1, 2015
- Intel Corporation
- Xianghong Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming secured metal gate antifuse structures
- Patent number 8,618,613
- Issue date Dec 31, 2013
- Intel Corporation
- Xianghong Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper resistant fuse design
- Patent number 8,242,831
- Issue date Aug 14, 2012
- Intel Corporation
- Xianghong Tong
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistor performance enhancement using engineered strains
- Patent number 7,679,145
- Issue date Mar 16, 2010
- Intel Corporation
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallurgy for Lead-Tin bump over copper pad
- Patent number 6,878,465
- Issue date Apr 12, 2005
- Intel Corporation
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Patent number 6,740,427
- Issue date May 25, 2004
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Under bump metallurgy for lead-tin bump over copper pad
- Patent number 6,703,069
- Issue date Mar 9, 2004
- Intel Corporation
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STROBOSCOPIC ELECTRON-BEAM SIGNAL IMAGE MAPPING
- Publication number 20230317408
- Publication date Oct 5, 2023
- Intel Corporation
- Xianghong Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL ELECTRON BEAM PROBER
- Publication number 20230305057
- Publication date Sep 28, 2023
- Intel Corporation
- Xianghong Tong
- G01 - MEASURING TESTING
Information Patent Application
CLADDED METAL INTERCONNECTS
- Publication number 20200098619
- Publication date Mar 26, 2020
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTROLLED MODIFICATION OF ANTIFUSE PROGRAMMING VOLTAGE
- Publication number 20180145083
- Publication date May 24, 2018
- Intel Corporation
- Xiaoghong TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SECURED METAL GATE ANTIFUSE STRUCTURES
- Publication number 20140103448
- Publication date Apr 17, 2014
- Xianghong Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SECURED METAL GATE ANTIFUSE STRUCTURES
- Publication number 20120248546
- Publication date Oct 4, 2012
- Xianghong Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER RESISTANT FUSE DESIGN
- Publication number 20110156801
- Publication date Jun 30, 2011
- Xianghong Tong
- G11 - INFORMATION STORAGE
Information Patent Application
Transistor performance enhancement using engineered strains
- Publication number 20060043579
- Publication date Mar 2, 2006
- Jun He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy for Lead-Tin bump over copper pad
- Publication number 20040060970
- Publication date Apr 1, 2004
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Publication number 20030059644
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Person

Patents Grantslast 30 patents

Cladded metal interconnects

Methods of forming secured metal gate antifuse structures

Methods of forming secured metal gate antifuse structures

Tamper resistant fuse design

Transistor performance enhancement using engineered strains

Under bump metallurgy for Lead-Tin bump over copper pad

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Under bump metallurgy for lead-tin bump over copper pad

Patents Applicationslast 30 patents

STROBOSCOPIC ELECTRON-BEAM SIGNAL IMAGE MAPPING

WAFER LEVEL ELECTRON BEAM PROBER

CLADDED METAL INTERCONNECTS

CONTROLLED MODIFICATION OF ANTIFUSE PROGRAMMING VOLTAGE

METHODS OF FORMING SECURED METAL GATE ANTIFUSE STRUCTURES

METHODS OF FORMING SECURED METAL GATE ANTIFUSE STRUCTURES

TAMPER RESISTANT FUSE DESIGN

Transistor performance enhancement using engineered strains

Under bump metallurgy for Lead-Tin bump over copper pad

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...