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ZHIYONG SIMON SUN
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SHANGHAI, CN
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last 30 patents
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Patent Grant
Integrated package design with wire leads for package-on-package pr...
Patent number
9,960,104
Issue date
May 1, 2018
Intel Corporation
Zhiyong Simon Sun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
INTEGRATED PACKAGE DESIGN WITH WIRE LEADS FOR PACKAGE-ON-PACKAGE PR...
Publication number
20160372404
Publication date
Dec 22, 2016
INTEL CORPORATION
ZHIYONG SIMON SUN
H01 - BASIC ELECTRIC ELEMENTS