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Zhiyong Wang
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Non-destructive 3-dimensional chemical imaging of photo-resist mate...
Patent number
10,078,204
Issue date
Sep 18, 2018
Intel Corporation
Nilanjan Z. Ghosh
G02 - OPTICS
Information
Patent Grant
Apparatus and method to monitor die edge defects
Patent number
10,026,664
Issue date
Jul 17, 2018
Intel Corporation
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inline inspection of the contact between conductive traces and subs...
Patent number
9,746,428
Issue date
Aug 29, 2017
Intel Corporation
Shuhong Liu
G02 - OPTICS
Information
Patent Grant
Apparatus and method to monitor die edge defects
Patent number
9,564,381
Issue date
Feb 7, 2017
Intel Corporation
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Inline measurement of molding material thickness using terahertz re...
Patent number
9,508,610
Issue date
Nov 29, 2016
Intel Corporation
Shuhong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metrology tool for electroless copper thickness measurement for BBU...
Patent number
9,441,952
Issue date
Sep 13, 2016
Intel Corporation
Nilanjan Ghosh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Inline inspection of the contact between conductive traces and subs...
Patent number
9,389,064
Issue date
Jul 12, 2016
Intel Corporation
Shuhong Liu
G01 - MEASURING TESTING
Information
Patent Grant
Apparatus and method to monitor die edge defects
Patent number
9,159,646
Issue date
Oct 13, 2015
Intel Corporation
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit edge protection method and apparatus
Patent number
7,678,613
Issue date
Mar 16, 2010
Intel Corporation
Lee Peng Khaw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit edge protection method and apparatus
Patent number
7,372,134
Issue date
May 13, 2008
Intel Corporation
Lee Peng Khaw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electro-optic time domain reflectometry
Patent number
7,280,190
Issue date
Oct 9, 2007
Intel Corporation
Zhiyong Wang
G01 - MEASURING TESTING
Information
Patent Grant
Bumpless die and heat spreader lid module bonded to bumped die carrier
Patent number
7,038,316
Issue date
May 2, 2006
Intel Corporation
Chuan Hu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
Publication number
20170141006
Publication date
May 18, 2017
Intel Corporation
Mayue Xie
G01 - MEASURING TESTING
Information
Patent Application
NONDESTRUCTIVE OPTICAL DETECTION OF TRACE UNDERCUT, WIDTH AND THICK...
Publication number
20170059303
Publication date
Mar 2, 2017
Robert Alan May
G01 - MEASURING TESTING
Information
Patent Application
INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...
Publication number
20160245758
Publication date
Aug 25, 2016
Intel Corporation
Shuhong Liu
G01 - MEASURING TESTING
Information
Patent Application
INLINE MEASUREMENT OF MOLDING MATERIAL THICKNESS USING TERAHERTZ RE...
Publication number
20160093540
Publication date
Mar 31, 2016
Intel Corporation
Shuhong LIU
G01 - MEASURING TESTING
Information
Patent Application
APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
Publication number
20160043011
Publication date
Feb 11, 2016
Intel Corporation
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INLINE INSPECTION OF THE CONTACT BETWEEN CONDUCTIVE TRACES AND SUBS...
Publication number
20150276375
Publication date
Oct 1, 2015
Shuhong Liu
G01 - MEASURING TESTING
Information
Patent Application
Non-Destructive 3-Dimensional Chemical Imaging Of Photo-Resist Mate...
Publication number
20150276480
Publication date
Oct 1, 2015
Nilanjan GHOSH
G01 - MEASURING TESTING
Information
Patent Application
METROLOGY TOOL FOR ELECTROLESS COPPER THICKNESS MEASUREMENT FOR BBU...
Publication number
20150092201
Publication date
Apr 2, 2015
Nilanjan Ghosh
G01 - MEASURING TESTING
Information
Patent Application
APPARATUS AND METHOD TO MONITOR DIE EDGE DEFECTS
Publication number
20140168879
Publication date
Jun 19, 2014
Mayue Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Microelectronic package and method of manufacturing same
Publication number
20080277779
Publication date
Nov 13, 2008
Abhishek Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT EDGE PROTECTION METHOD AND APPARATUS
Publication number
20080188038
Publication date
Aug 7, 2008
Lee Peng Khaw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit edge protection method and apparatus
Publication number
20060223239
Publication date
Oct 5, 2006
Intel Corporation
Lee Peng Khaw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bumpless die and heat spreader lid module bonded to bumped die carrier
Publication number
20050211749
Publication date
Sep 29, 2005
Chuan Hu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic assembly having a die with rounded corner edge portions...
Publication number
20050017371
Publication date
Jan 27, 2005
Zhiyong Wang
H01 - BASIC ELECTRIC ELEMENTS