Zhize Zhu

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Control of processing parameters for substrate polishing with angul...
- Patent number 11,931,853
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,869,815
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via oriented wafer loading
- Patent number 11,282,755
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Eric Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tracking spectrum features in two dimensions for endpoint detection
- Patent number 8,814,631
- Issue date Aug 26, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Using optical metrology for within wafer feed forward process control
- Patent number 8,679,979
- Issue date Mar 25, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of using optical metrology for feed back and feed forward p...
- Patent number 8,579,675
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Using optical metrology for wafer to wafer feed back process control
- Patent number 8,292,693
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Using optical metrology for within wafer feed forward process control
- Patent number 8,039,397
- Issue date Oct 18, 2011
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Contact metallization scheme using a barrier layer over a silicide...
- Patent number 7,514,353
- Issue date Apr 7, 2009
- Applied Materials, Inc.
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING
- Publication number 20240087965
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
MINIMIZING SUBSTRATE BOW DURING POLISHING
- Publication number 20240033878
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Eric L. Lau
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBST...
- Publication number 20220283554
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE LEARNING FOR CLASSIFYING RETAINING RINGS
- Publication number 20220281052
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH ANGUL...
- Publication number 20220281053
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
Asymmetry Correction Via Oriented Wafer Loading
- Publication number 20220208621
- Publication date Jun 30, 2022
- Applied Materials, Inc.
- Eric Lau
- B24 - GRINDING POLISHING
Information Patent Application
Asymmetry Correction Via Oriented Wafer Loading
- Publication number 20210066142
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- Eric Lau
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR I...
- Publication number 20120034845
- Publication date Feb 9, 2012
- Xiaoyuan Hu
- B24 - GRINDING POLISHING
Information Patent Application
USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL
- Publication number 20120028377
- Publication date Feb 2, 2012
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
Tracking Spectrum Features In Two Dimensions For Endpoint Detection
- Publication number 20120021672
- Publication date Jan 26, 2012
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD P...
- Publication number 20100297916
- Publication date Nov 25, 2010
- APPLIED MATERIALS, INC.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
USING OPTICAL METROLOGY FOR WAFER TO WAFER FEED BACK PROCESS CONTROL
- Publication number 20100130100
- Publication date May 27, 2010
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL
- Publication number 20100129939
- Publication date May 27, 2010
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE...
- Publication number 20090275265
- Publication date Nov 5, 2009
- APPLIED MATERIALS, INC.
- Jun Qian
- B24 - GRINDING POLISHING
Information Patent Application
Contact metallization scheme using a barrier layer over a silicide...
- Publication number 20060251800
- Publication date Nov 9, 2006
- Timothy W. Weidman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless deposition processes and compositions for forming inter...
- Publication number 20060252252
- Publication date Nov 9, 2006
- Zhize Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless deposition process on a silicide contact
- Publication number 20060246217
- Publication date Nov 2, 2006
- Timothy W. Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective self-initiating electroless capping of copper with cobalt...
- Publication number 20050136193
- Publication date Jun 23, 2005
- APPLIED MATERIALS, INC.
- Timothy Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective self-initiating electroless capping of copper with cobalt...
- Publication number 20050095830
- Publication date May 5, 2005
- APPLIED MATERIALS, INC.
- Timothy Weidman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Control of processing parameters for substrate polishing with angul...

Asymmetry correction via oriented wafer loading

Asymmetry correction via oriented wafer loading

Tracking spectrum features in two dimensions for endpoint detection

Using optical metrology for within wafer feed forward process control

Methods of using optical metrology for feed back and feed forward p...

Using optical metrology for wafer to wafer feed back process control

Using optical metrology for within wafer feed forward process control

Contact metallization scheme using a barrier layer over a silicide...

Patents Applicationslast 30 patents

ASYMMETRY CORRECTION VIA ORIENTED WAFER LOADING

MINIMIZING SUBSTRATE BOW DURING POLISHING

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBST...

MACHINE LEARNING FOR CLASSIFYING RETAINING RINGS

CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH ANGUL...

Asymmetry Correction Via Oriented Wafer Loading

Asymmetry Correction Via Oriented Wafer Loading

TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR I...

USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL

Tracking Spectrum Features In Two Dimensions For Endpoint Detection

METHODS OF USING OPTICAL METROLOGY FOR FEED BACK AND FEED FORWARD P...

USING OPTICAL METROLOGY FOR WAFER TO WAFER FEED BACK PROCESS CONTROL

USING OPTICAL METROLOGY FOR WITHIN WAFER FEED FORWARD PROCESS CONTROL

ENDPOINT DETECTION IN CHEMICAL MECHANICAL POLISHING USING MULTIPLE...

Contact metallization scheme using a barrier layer over a silicide...

Electroless deposition processes and compositions for forming inter...

Electroless deposition process on a silicide contact

Selective self-initiating electroless capping of copper with cobalt...

Selective self-initiating electroless capping of copper with cobalt...