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Patent Application
WAFER DICING DEVICES AND METHODS OF WAFER DICING
Publication number
20240375212
Publication date
Nov 14, 2024
Yangtze Memory Technologies Co., Ltd.
Wei Xie
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
Publication number
20240379578
Publication date
Nov 14, 2024
Yangtze Memory Technologies Co., Ltd.
Dongyu Fan
H01 - BASIC ELECTRIC ELEMENTS