ZHONGHUA QIAN

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SHANGHAI, CN

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device with side grooves
- Patent number 11,894,343
- Issue date Feb 6, 2024
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped interconnector for stacked die package
- Patent number 11,756,932
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Die Ejector for Die Attach Ejector Devices
- Publication number 20240312808
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Simon Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY HORIZONTAL STEALTH LASING
- Publication number 20230411169
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Dicing Method
- Publication number 20230402323
- Publication date Dec 14, 2023
- Western Digital Technologies, Inc.
- Zhengjie ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE WITH SIDE GROOVES
- Publication number 20220375899
- Publication date Nov 24, 2022
- Western Digital Technologies, Inc.
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonding For Semiconductor Devices
- Publication number 20220052014
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOPED INTERCONNECTOR FOR STACKED DIE PACKAGE
- Publication number 20210407967
- Publication date Dec 30, 2021
- Western Digital Technologies, Inc.
- XIANLU CUI
- H01 - BASIC ELECTRIC ELEMENTS