Zhonghua Wu

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 11,810,850
- Issue date Nov 7, 2023
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 11,302,624
- Issue date Apr 12, 2022
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in integrated circuit packaging
- Patent number 10,734,319
- Issue date Aug 4, 2020
- Google LLC
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 9,774,156
- Issue date Sep 26, 2017
- Google Inc.
- Aaron Leiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical receptacle with lower speed signaling contacts farther f...
- Patent number 8,911,262
- Issue date Dec 16, 2014
- Google Inc.
- Aaron Leiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector and socket allowing connector to be rotated wh...
- Patent number 8,821,172
- Issue date Sep 2, 2014
- Google Inc.
- Zhonghua Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number 8,784,123
- Issue date Jul 22, 2014
- Google Inc.
- Aaron Leiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional coiling via structure for impedance tuning of imp...
- Patent number 8,723,048
- Issue date May 13, 2014
- Broadcom Corporation
- Zhonghua (Ken) Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20240105581
- Publication date Mar 28, 2024
- Google LLC
- Jin Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20220254711
- Publication date Aug 11, 2022
- Google LLC
- Jin Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20200395290
- Publication date Dec 17, 2020
- Google LLC
- Jin Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
- Publication number 20190348360
- Publication date Nov 14, 2019
- Google LLC
- Jin Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20160308318
- Publication date Oct 20, 2016
- Google Inc.
- Aaron Leiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMP...
- Publication number 20120112868
- Publication date May 10, 2012
- BROADCOM CORPORATION
- Zhonghua (Ken) Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Zhonghua Wu

Person

Patents Grantslast 30 patents

Signal routing in integrated circuit packaging

Signal routing in integrated circuit packaging

Signal routing in integrated circuit packaging

Electrical connector

Electrical receptacle with lower speed signaling contacts farther f...

Electrical connector and socket allowing connector to be rotated wh...

Electrical connector

Three-dimensional coiling via structure for impedance tuning of imp...

Patents Applicationslast 30 patents

SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING

SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING

SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING

SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING

ELECTRICAL CONNECTOR

THREE-DIMENSIONAL COILING VIA STRUCTURE FOR IMPEDANCE TUNING OF IMP...