Zhongke Wang

Person

  • Singapore, SG

Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer cutting method and a system thereof

    • Patent number 8,847,104
    • Issue date Sep 30, 2014
    • Agency for Science Technology and Research
    • Zhongke Wang
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents