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Zhongwei JIANG

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  • Beijing, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate etching method
    • Patent number 9,478,439
    • Issue date Oct 25, 2016
    • Beijing NMC Co., Ltd.
    • Zhongwei Jiang
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR ETCHING SILICON WAFER
    • Publication number 20240006182
    • Publication date Jan 4, 2024
    • Beijing NAURA Microelectronics Equipment Co., Ltd.
    • Haiyun ZHU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE ETCHING METHOD
    • Publication number 20150311091
    • Publication date Oct 29, 2015
    • Beijing NMC Co., Ltd.
    • Zhongwei JIANG
    • H01 - BASIC ELECTRIC ELEMENTS