Zhongyao YU

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
Active chip package substrate and method for preparing the same
- Patent number 9,730,329
- Issue date Aug 8, 2017
- Institute of Microelectronics, Chinese Academy of Sciences
- Zhongyao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded package method and structure
- Patent number 9,583,418
- Issue date Feb 28, 2017
- National Center for Advanced Packaging Co., Ltd.
- Xueping Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACTIVE CHIP PACKAGE SUBSTRATE AND METHOD FOR PREPARING THE SAME
- Publication number 20150109748
- Publication date Apr 23, 2015
- Institute of Microelectronics, Chinese Academy of Sciences
- Zhongyao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Constructing an External Circuit structure
- Publication number 20150096173
- Publication date Apr 9, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip Embedded Package Method and Structure
- Publication number 20150091155
- Publication date Apr 2, 2015
- NATIONAL CENTER FOR ADVANCED PACKING CO., LTD.
- Xueping GUO
- H01 - BASIC ELECTRIC ELEMENTS