Zhou YANG

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
KEEP OUT ZONE WITH HYDROPHOBIC SURFACE FOR INTEGRATED CIRCUIT (IC)...
- Publication number 20210233867
- Publication date Jul 29, 2021
- Intel Corporation
- Bassam ZIADEH
- H01 - BASIC ELECTRIC ELEMENTS