Zhuowei Wang

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Suzhuo, Jiangsu Province, CN

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Patents Grantslast 30 patents

Information Patent Grant
Image sensing chip packaging structure and packaging method
- Patent number 10,541,262
- Issue date Jan 21, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for image sensing chip
- Patent number 10,325,946
- Issue date Jun 18, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for image sensing chip
- Patent number 10,283,483
- Issue date May 7, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20200243588
- Publication date Jul 30, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20190074309
- Publication date Mar 7, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP
- Publication number 20180301434
- Publication date Oct 18, 2018
- China Water Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR IMAGE SENSING CHIP
- Publication number 20180286903
- Publication date Oct 4, 2018
- China Wafer Level CSP Co., Ltd
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS