Zi Qi Wang

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Chengdu Sichuan, CN

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Patents Grantslast 30 patents

Information Patent Grant
Ball bond attachment for a semiconductor die
- Patent number 10,692,835
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire ball bonding in semiconductor devices
- Patent number 10,340,246
- Issue date Jul 2, 2019
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240258215
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mei Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE
- Publication number 20190378814
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BALL BONDING IN SEMICONDUCTOR DEVICES
- Publication number 20190221537
- Publication date Jul 18, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han ZHONG
- H01 - BASIC ELECTRIC ELEMENTS