Zi Qun HUA

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Self-aligned contacts in three-dimensional memory devices and metho...
- Patent number 12,074,105
- Issue date Aug 27, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of semiconductor device with exposed input/outpu...
- Patent number 11,710,730
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts in three-dimensional memory devices and metho...
- Patent number 11,664,309
- Issue date May 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts in three-dimensional memory devices and metho...
- Patent number 11,552,012
- Issue date Jan 10, 2023
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,462,503
- Issue date Oct 4, 2022
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with exposed input/output pad in recess
- Patent number 11,430,775
- Issue date Aug 30, 2022
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures having bonding contacts made of ind...
- Patent number 11,430,756
- Issue date Aug 30, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for cutting dense line patterns using self-ali...
- Patent number 11,251,043
- Issue date Feb 15, 2022
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 11,205,619
- Issue date Dec 21, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 11,049,834
- Issue date Jun 29, 2021
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and method for forming the same
- Patent number 10,840,125
- Issue date Nov 17, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jin Wen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts
- Patent number 10,833,042
- Issue date Nov 10, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures having bonding contacts made of ind...
- Patent number 10,784,225
- Issue date Sep 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding using dummy bonding contacts and dummy interconnects
- Patent number 10,748,851
- Issue date Aug 18, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for cutting dense line patterns using self-ali...
- Patent number 10,727,056
- Issue date Jul 28, 2020
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure and forming method thereof
- Patent number 10,497,708
- Issue date Dec 3, 2019
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...
- Publication number 20240332167
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...
- Publication number 20230102519
- Publication date Mar 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...
- Publication number 20220130671
- Publication date Apr 28, 2022
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210407984
- Publication date Dec 30, 2021
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...
- Publication number 20210183765
- Publication date Jun 17, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20210066274
- Publication date Mar 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20210035941
- Publication date Feb 4, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...
- Publication number 20210020566
- Publication date Jan 21, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES HAVING BONDING CONTACTS MADE OF IND...
- Publication number 20200381384
- Publication date Dec 3, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200335450
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...
- Publication number 20200321215
- Publication date Oct 8, 2020
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES HAVING BONDING CONTACTS MADE OF IND...
- Publication number 20200258857
- Publication date Aug 13, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zongliang Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS
- Publication number 20200243455
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING USING DUMMY BONDING CONTACTS
- Publication number 20200243473
- Publication date Jul 30, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200035542
- Publication date Jan 30, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jin Wen Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...
- Publication number 20190157082
- Publication date May 23, 2019
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Self-aligned contacts in three-dimensional memory devices and metho...

Fabricating method of semiconductor device with exposed input/outpu...

Self-aligned contacts in three-dimensional memory devices and metho...

Self-aligned contacts in three-dimensional memory devices and metho...

Hybrid bonding using dummy bonding contacts

Semiconductor device with exposed input/output pad in recess

Bonded semiconductor structures having bonding contacts made of ind...

Method and structure for cutting dense line patterns using self-ali...

Hybrid bonding using dummy bonding contacts and dummy interconnects

Hybrid bonding using dummy bonding contacts

Memory structure and method for forming the same

Hybrid bonding using dummy bonding contacts

Bonded semiconductor structures having bonding contacts made of ind...

Hybrid bonding using dummy bonding contacts and dummy interconnects

Method and structure for cutting dense line patterns using self-ali...

Memory structure and forming method thereof

Patents Applicationslast 30 patents

SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...

SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...

METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...

FABRICATING METHOD OF SEMICONDUCTOR DEVICE

SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

HYBRID BONDING USING DUMMY BONDING CONTACTS

SELF-ALIGNED CONTACTS IN THREE-DIMENSIONAL MEMORY DEVICES AND METHO...

BONDED SEMICONDUCTOR STRUCTURES HAVING BONDING CONTACTS MADE OF IND...

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...

BONDED SEMICONDUCTOR STRUCTURES HAVING BONDING CONTACTS MADE OF IND...

HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS

HYBRID BONDING USING DUMMY BONDING CONTACTS

MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD AND STRUCTURE FOR CUTTING DENSE LINE PATTERNS USING SELF-ALI...