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Chengdu, Sichuan, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Multi-bit resolution sub-pipeline structure for measuring jump magn...
Patent number
11,716,091
Issue date
Aug 1, 2023
NO. 24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Tao Liu
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Substrate-enhanced comparator and electronic device
Patent number
11,664,794
Issue date
May 30, 2023
NO. 24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Ting Li
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Buffer circuit and buffer
Patent number
11,394,389
Issue date
Jul 19, 2022
NO. 24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
Ting Li
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
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Patent Application
SUBSTRATE-ENHANCED COMPARATOR AND ELECTRONIC DEVICE
Publication number
20220224320
Publication date
Jul 14, 2022
No. 24 Research Institute of China Electronics Technology Group Corporation
Ting LI
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
MULTI-BIT RESOLUTION SUB-PIPELINE STRUCTURE FOR MEASURING JUMP MAGN...
Publication number
20220224350
Publication date
Jul 14, 2022
No. 24 Research Institute of China Electronics Technology Group Corporation
Tao LIU
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
BUFFER CIRCUIT AND BUFFER
Publication number
20210281269
Publication date
Sep 9, 2021
No. 24 Research Institute of China Electronics Technology Group Corporation
Ting LI
H03 - BASIC ELECTRONIC CIRCUITRY