Ziep Tran

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electromechanical power switch integrated circuits and devices and...
- Patent number 11,562,871
- Issue date Jan 24, 2023
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical power switch integrated circuits and devices and...
- Patent number 10,879,025
- Issue date Dec 29, 2020
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical power switch integrated circuits and devices and...
- Patent number 10,600,600
- Issue date Mar 24, 2020
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical power switch integrated circuits and devices and...
- Patent number 9,793,080
- Issue date Oct 17, 2017
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a stacked low temperature transistor and related...
- Patent number 9,202,756
- Issue date Dec 1, 2015
- INOSO, LLC
- Ziep Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stacked low temperature transistor and related...
- Patent number 9,087,689
- Issue date Jul 21, 2015
- INOSO, LLC
- Ziep Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a stacked low temperature diode and related devices
- Patent number 8,916,872
- Issue date Dec 23, 2014
- INOSO, LLC
- Ziep Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming an electromechanical power switch for controlling...
- Patent number 8,786,130
- Issue date Jul 22, 2014
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stackable molded packages and methods of making the same
- Patent number 8,044,494
- Issue date Oct 25, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electromechanical Power Switch Integrated Circuits And Devices And...
- Publication number 20230298840
- Publication date Sep 21, 2023
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electromechanical Power Switch Integrated Circuits And Devices And...
- Publication number 20210193422
- Publication date Jun 24, 2021
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electromechanical Power Switch Integrated Circuits And Devices And...
- Publication number 20200303148
- Publication date Sep 24, 2020
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL POWER SWITCH INTEGRATED CIRCUITS AND DEVICES AND...
- Publication number 20180122605
- Publication date May 3, 2018
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROMECHANICAL POWER SWITCH INTEGRATED CIRCUITS AND DEVICES AND...
- Publication number 20170053764
- Publication date Feb 23, 2017
- INOSO, LLC
- Kiyoshi Mori
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20100013065
- Publication date Jan 21, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME
- Publication number 20080108179
- Publication date May 8, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable molded packages and methods of making the same
- Publication number 20070141751
- Publication date Jun 21, 2007
- Addi B. Mistry
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electromechanical power switch integrated circuits and devices and...

Electromechanical power switch integrated circuits and devices and...

Electromechanical power switch integrated circuits and devices and...

Electromechanical power switch integrated circuits and devices and...

Method of forming a stacked low temperature transistor and related...

Method of forming a stacked low temperature transistor and related...

Method of forming a stacked low temperature diode and related devices

Method of forming an electromechanical power switch for controlling...

Stackable molded packages and methods of making the same

Patents Applicationslast 30 patents

Electromechanical Power Switch Integrated Circuits And Devices And...

Electromechanical Power Switch Integrated Circuits And Devices And...

Electromechanical Power Switch Integrated Circuits And Devices And...

ELECTROMECHANICAL POWER SWITCH INTEGRATED CIRCUITS AND DEVICES AND...

ELECTROMECHANICAL POWER SWITCH INTEGRATED CIRCUITS AND DEVICES AND...

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Stackable molded packages and methods of making the same