Zigmund R. Camacho

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 10,651,139
- Issue date May 12, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PIP with inner known goo...
- Patent number RE47923
- Issue date Mar 31, 2020
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
Information Patent Grant
Semiconductor device and method of forming package-on-package struc...
- Patent number 9,922,955
- Issue date Mar 20, 2018
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,865,554
- Issue date Jan 9, 2018
- STATS ChipPAC Ptc. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming overlapping semiconducto...
- Patent number 9,721,925
- Issue date Aug 1, 2017
- STATS ChipPAC, Pte. Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with photoimagable dielectric-d...
- Patent number 9,679,769
- Issue date Jun 13, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming prefabricated heat sprea...
- Patent number 9,666,540
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Frederick R. Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,659,897
- Issue date May 23, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 9,589,876
- Issue date Mar 7, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optical sensor and method of forming inte...
- Patent number 9,525,080
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with support structure and meth...
- Patent number 9,502,267
- Issue date Nov 22, 2016
- STATS ChipPAC Pte. Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with notched f...
- Patent number 9,472,427
- Issue date Oct 18, 2016
- STATS ChipPAC Pte. Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with photoimagable dielectric-d...
- Patent number 9,406,531
- Issue date Aug 2, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with insulated trace and method...
- Patent number 9,406,642
- Issue date Aug 2, 2016
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device having pre-molded leadframe with windo...
- Patent number 9,397,236
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 9,390,991
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer structure and m...
- Patent number 9,355,983
- Issue date May 31, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 9,337,161
- Issue date May 10, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with pre-molded leadframe and m...
- Patent number 9,331,003
- Issue date May 3, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL and vertical interco...
- Patent number 9,330,994
- Issue date May 3, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with wafer level reconfiguratio...
- Patent number 9,324,673
- Issue date Apr 26, 2016
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with routed circuit lead array...
- Patent number 9,299,644
- Issue date Mar 29, 2016
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming prefabricated heat sprea...
- Patent number 9,257,357
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Frederick R. Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a conductive via-in-via...
- Patent number 9,252,075
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,202,793
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with cut multiple lead pads
- Patent number 9,202,777
- Issue date Dec 1, 2015
- Stats Chippac Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a reconfigured stackable...
- Patent number 9,177,832
- Issue date Nov 3, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with plated leads and method of...
- Patent number 9,142,531
- Issue date Sep 22, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level die integration
- Patent number 9,142,514
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump interconnection
- Patent number 9,129,971
- Issue date Sep 8, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Ground Plane...
- Publication number 20160293558
- Publication date Oct 6, 2016
- STATS ChipPAC Pte Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Prefabricated Heat Sprea...
- Publication number 20160104681
- Publication date Apr 14, 2016
- STATS ChipPAC, Ltd.
- Frederick R. Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION A...
- Publication number 20160099222
- Publication date Apr 7, 2016
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL and Vertical Interco...
- Publication number 20150279778
- Publication date Oct 1, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD...
- Publication number 20150179602
- Publication date Jun 25, 2015
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Overlapping Semiconducto...
- Publication number 20150028496
- Publication date Jan 29, 2015
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...
- Publication number 20140284788
- Publication date Sep 25, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD...
- Publication number 20140048919
- Publication date Feb 20, 2014
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Semiconductor Device Having Pre-Molded Leadframe with Windo...
- Publication number 20140011315
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20130341789
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Prefabricated Heat Sprea...
- Publication number 20130256866
- Publication date Oct 3, 2013
- Frederick R. Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...
- Publication number 20130154115
- Publication date Jun 20, 2013
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe Interposer Ove...
- Publication number 20130154076
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Package Containing...
- Publication number 20130119559
- Publication date May 16, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD...
- Publication number 20130075883
- Publication date Mar 28, 2013
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Reconfigured Stackable...
- Publication number 20130069222
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURED M...
- Publication number 20120326286
- Publication date Dec 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Conductive Via-in-Via...
- Publication number 20120326329
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming PIP with Inner Known Goo...
- Publication number 20120326302
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Package With Stando...
- Publication number 20120326337
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUF...
- Publication number 20120326285
- Publication date Dec 27, 2012
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Package Containing...
- Publication number 20120299191
- Publication date Nov 29, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERLOCK AND METHOD OF MA...
- Publication number 20120299196
- Publication date Nov 29, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Optical Sensor and Method of Forming Inte...
- Publication number 20120286400
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTED CIRCUIT LEAD ARRAY...
- Publication number 20120280390
- Publication date Nov 8, 2012
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Multi-Row Et...
- Publication number 20120273927
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Die Integration and Method
- Publication number 20120276691
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...
- Publication number 20120261808
- Publication date Oct 18, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LOCKING INTERCONNECTS AND...
- Publication number 20120241947
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS

Zigmund R. Camacho

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming wafer level ground plane...

Semiconductor device and method of forming PIP with inner known goo...

Semiconductor device and method of forming package-on-package struc...

Integrated circuit packaging system with under bump metallization a...

Semiconductor device and method of forming overlapping semiconducto...

Integrated circuit packaging system with photoimagable dielectric-d...

Semiconductor device and method of forming prefabricated heat sprea...

Integrated circuit packaging system with interposer structure and m...

Semiconductor device and method of forming a wafer level package wi...

Semiconductor device with optical sensor and method of forming inte...

Integrated circuit packaging system with support structure and meth...

Semiconductor device and method of forming leadframe with notched f...

Integrated circuit packaging system with photoimagable dielectric-d...

Integrated circuit packaging system with insulated trace and method...

Optical semiconductor device having pre-molded leadframe with windo...

Semiconductor device and method of forming wafer level ground plane...

Integrated circuit packaging system with interposer structure and m...

Integrated circuit package system with removable backing element ha...

Integrated circuit packaging system with pre-molded leadframe and m...

Semiconductor device and method of forming RDL and vertical interco...

Integrated circuit packaging system with wafer level reconfiguratio...

Integrated circuit packaging system with routed circuit lead array...

Semiconductor device and method of forming prefabricated heat sprea...

Semiconductor device and method of forming a conductive via-in-via...

Integrated circuit packaging system with under bump metallization a...

Semiconductor package system with cut multiple lead pads

Semiconductor device and method of forming a reconfigured stackable...

Integrated circuit packaging system with plated leads and method of...

Semiconductor device and method of forming wafer level die integration

Semiconductor device with bump interconnection

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Wafer Level Ground Plane...

Semiconductor Device and Method of Forming Prefabricated Heat Sprea...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION A...

Semiconductor Device and Method of Forming RDL and Vertical Interco...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE INK AND METHOD...

Semiconductor Device and Method of Forming Overlapping Semiconducto...

Integrated Circuit Package System with Removable Backing Element Ha...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING PIP WITH INNER KNOWN GOO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD...

Optical Semiconductor Device Having Pre-Molded Leadframe with Windo...

Semiconductor Device and Method of Forming a Wafer Level Package wi...

Semiconductor Device and Method of Forming Prefabricated Heat Sprea...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...

Semiconductor Device and Method of Forming Leadframe Interposer Ove...

Semiconductor Device and Method of Forming EWLB Package Containing...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD...

Semiconductor Device and Method of Forming a Reconfigured Stackable...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WAFER LEVEL RECONFIGURED M...

Semiconductor Device and Method of Forming a Conductive Via-in-Via...

Semiconductor Device and Method of Forming PIP with Inner Known Goo...

Semiconductor Device and Method of Forming EWLB Package With Stando...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUF...

Semiconductor Device and Method of Forming EWLB Package Containing...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERLOCK AND METHOD OF MA...

Semiconductor Device with Optical Sensor and Method of Forming Inte...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTED CIRCUIT LEAD ARRAY...

Semiconductor Device and Method of Forming Wafer Level Multi-Row Et...

Wafer Level Die Integration and Method

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LOCKING INTERCONNECTS AND...