TREA

Zili Zhang

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  • Shenzhen, CN
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Patents Grantslast 30 patents

  • Information Patent Grant

    Heat dissipation assembly
    • Patent number 6,611,431
    • Issue date Aug 26, 2003
    • Hon Hai Precision Ind. Co., Ltd.
    • Tsung-Lung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Back plate assembly for motherboard
    • Patent number 6,480,388
    • Issue date Nov 12, 2002
    • Hon Hai Precision Ind. Co., Ltd.
    • Tsung-Lung Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Heat sink assembly
    • Patent number 6,480,387
    • Issue date Nov 12, 2002
    • Hon Hai Precision Ind. Co., Ltd.
    • Tsung-Lung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Heat removal system
    • Patent number 6,450,251
    • Issue date Sep 17, 2002
    • Foxconn Precision Components Co., Ltd.
    • Yeu Lih Lin
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Heat pipe with inner layer
    • Publication number 20030192671
    • Publication date Oct 16, 2003
    • Tsung Lung Lee
    • F28 - HEAT EXCHANGE IN GENERAL