Ziyin LIN

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
- Patent number 11,749,585
- Issue date Sep 5, 2023
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenches in wafer level packages for improvements in warpage reliab...
- Patent number 11,688,634
- Issue date Jun 27, 2023
- Intel Corporation
- Vipul Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with warpage management and process for f...
- Patent number 11,676,876
- Issue date Jun 13, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...
- Publication number 20240270929
- Publication date Aug 15, 2024
- Intel Corporation
- Clay Arrington
- B82 - NANO-TECHNOLOGY
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
- Publication number 20240222243
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...
- Publication number 20240222259
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
- Publication number 20240222304
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219654
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219656
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
- Publication number 20240222210
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...
- Publication number 20240222238
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
- Publication number 20240213170
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...
- Publication number 20240213164
- Publication date Jun 27, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
- Publication number 20240215269
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186228
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
- Publication number 20240153837
- Publication date May 9, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112971
- Publication date Apr 4, 2024
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hydrophobic feature to control adhesive flow

Dummy die structures of a packaged integrated circuit device

Barrier structures for underfill containment

Micro-electronic package with substrate protrusion to facilitate di...

High thermal conductivity, high modulus structure within a mold mat...

Trenches in wafer level packages for improvements in warpage reliab...

Semiconductor die package with warpage management and process for f...

Micro-electronic package with substrate protrusion to facilitate di...

Patents Applicationslast 30 patents

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

2D FILLERS FOR REDUCED CTE FOR PID

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

CAPILLARY UNDERFILL FORMULATIONS THAT INCLUDE CARBON NANOTUBES, CON...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE...

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

GLASS SUBSTRATE FABRICATION USING HYBRID BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERM...

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES