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Ziyin LIN
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Barrier structures for underfill containment
Patent number
12,002,727
Issue date
Jun 4, 2024
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
Patent number
11,776,821
Issue date
Oct 3, 2023
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High thermal conductivity, high modulus structure within a mold mat...
Patent number
11,749,585
Issue date
Sep 5, 2023
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trenches in wafer level packages for improvements in warpage reliab...
Patent number
11,688,634
Issue date
Jun 27, 2023
Intel Corporation
Vipul Mehta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package with warpage management and process for f...
Patent number
11,676,876
Issue date
Jun 13, 2023
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
Patent number
11,282,717
Issue date
Mar 22, 2022
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
Publication number
20240153837
Publication date
May 9, 2024
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240112971
Publication date
Apr 4, 2024
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR SEALING LIQUID METAL INTERCONNECT ARRAY PACKAGES
Publication number
20240074046
Publication date
Feb 29, 2024
Intel Corporation
Ziyin Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
THROUGH GLASS VIAS (TGVS) IN GLASS CORE SUBSTRATES
Publication number
20240071848
Publication date
Feb 29, 2024
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIERS TO MODULATE UNDERFILL FLOW
Publication number
20230317668
Publication date
Oct 5, 2023
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
Publication number
20230187850
Publication date
Jun 15, 2023
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
Publication number
20230187337
Publication date
Jun 15, 2023
Karumbu Meyyappan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS
Publication number
20230089928
Publication date
Mar 23, 2023
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
Publication number
20220196937
Publication date
Jun 23, 2022
Intel Corporation
Bassam ZIADEH
G02 - OPTICS
Information
Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
Publication number
20220165585
Publication date
May 26, 2022
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUMMY DIE STRUCTURES OF A PACKAGED INTEGRATED CIRCUIT DEVICE
Publication number
20220102242
Publication date
Mar 31, 2022
Intel Corporation
Mitul Modi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH THERMAL CONDUCTIVITY, HIGH MODULUS STRUCTURE WITHIN A MOLD MAT...
Publication number
20210272878
Publication date
Sep 2, 2021
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
Publication number
20210249322
Publication date
Aug 12, 2021
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
Publication number
20210242102
Publication date
Aug 5, 2021
Intel Corporation
Elizabeth NOFEN
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE WITH WARPAGE MANAGEMENT AND PROCESS FOR F...
Publication number
20210066152
Publication date
Mar 4, 2021
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRENCHES IN WAFER LEVEL PACKAGES FOR IMPROVEMENTS IN WARPAGE RELIAB...
Publication number
20210035859
Publication date
Feb 4, 2021
Intel Corporation
Vipul MEHTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN LINE DAM ON UNDERFILL MATERIAL TO CONTAIN THERMAL INTERFACE MA...
Publication number
20200126887
Publication date
Apr 23, 2020
Intel Corporation
Ziyin Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC ENCAPSULANT FOR PACKAGE MAGNETIC INDUCTORS
Publication number
20200005983
Publication date
Jan 2, 2020
Intel Corporation
Malavarayan SANKARASUBRAMANIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
Publication number
20190304808
Publication date
Oct 3, 2019
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS