Zlata Kovac

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of making microelectronic assemblies including compliant in...
- Patent number 7,368,818
- Issue date May 6, 2008
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making microelectronic assemblies including compliant in...
- Patent number 6,870,272
- Issue date Mar 22, 2005
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making microelectronic assemblies including compliant in...
- Patent number 6,723,584
- Issue date Apr 20, 2004
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making microelectronic assemblies including compliant in...
- Patent number 6,525,429
- Issue date Feb 25, 2003
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bondable compliant pads for packaging of a semiconductor chip and m...
- Patent number 6,373,141
- Issue date Apr 16, 2002
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant microelectronic mounting device
- Patent number 6,370,032
- Issue date Apr 9, 2002
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connections with deformable contacts
- Patent number 6,274,820
- Issue date Aug 14, 2001
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making microelectronic components having electrophoretic...
- Patent number 6,266,874
- Issue date Jul 31, 2001
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for microelectronic devices
- Patent number 6,255,738
- Issue date Jul 3, 2001
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connections with deformable contacts
- Patent number 6,239,386
- Issue date May 29, 2001
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip connection components with adhesives and methods...
- Patent number 6,202,299
- Issue date Mar 20, 2001
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant interface for semiconductor chip and method therefor
- Patent number 6,133,639
- Issue date Oct 17, 2000
- Tessera, Inc.
- Zlata Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a connection component on a semiconductor chip w...
- Patent number 6,045,655
- Issue date Apr 4, 2000
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bondable compliant pads for packaging of a semiconductor chip and m...
- Patent number 6,030,856
- Issue date Feb 29, 2000
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming compliant microelectronic mounting device
- Patent number 6,012,224
- Issue date Jan 11, 2000
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting a connection component on a semiconductor chip w...
- Patent number 5,875,545
- Issue date Mar 2, 1999
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant microelectrionic mounting device
- Patent number 5,706,174
- Issue date Jan 6, 1998
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating compliant interface for semiconductor chip
- Patent number 5,659,952
- Issue date Aug 26, 1997
- Tessera, Inc.
- Zlata Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic bonding with lead motion
- Patent number 5,619,017
- Issue date Apr 8, 1997
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multilayer circuit
- Patent number 5,590,460
- Issue date Jan 7, 1997
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip connection components with adhesives and methods...
- Patent number 5,548,091
- Issue date Aug 20, 1996
- Tessera, Inc.
- Thomas H. DiStefano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic bonding with lead motion
- Patent number 5,491,302
- Issue date Feb 13, 1996
- Tessera, Inc.
- Thomas H. Distefano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of making microelectronic assemblies including compliant in...
- Publication number 20060049498
- Publication date Mar 9, 2006
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of making microelectronic assemblies including compliant in...
- Publication number 20050139986
- Publication date Jun 30, 2005
- Tessera, Inc.
- Zlata Kovac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of making microelectronic assemblies including compliant in...
- Publication number 20030027374
- Publication date Feb 6, 2003
- Zlata Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies including compliant in...
- Publication number 20020109213
- Publication date Aug 15, 2002
- Zlata Kovac
- H01 - BASIC ELECTRIC ELEMENTS

Zlata Kovac

Person

Patents Grantslast 30 patents

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...

Bondable compliant pads for packaging of a semiconductor chip and m...

Compliant microelectronic mounting device

Electrical connections with deformable contacts

Methods of making microelectronic components having electrophoretic...

Encapsulant for microelectronic devices

Electrical connections with deformable contacts

Semiconductor chip connection components with adhesives and methods...

Compliant interface for semiconductor chip and method therefor

Method of mounting a connection component on a semiconductor chip w...

Bondable compliant pads for packaging of a semiconductor chip and m...

Method of forming compliant microelectronic mounting device

Method of mounting a connection component on a semiconductor chip w...

Compliant microelectrionic mounting device

Method of fabricating compliant interface for semiconductor chip

Microelectronic bonding with lead motion

Method of making multilayer circuit

Semiconductor chip connection components with adhesives and methods...

Microelectronic bonding with lead motion

Patents Applicationslast 30 patents

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...

Methods of making microelectronic assemblies including compliant in...