Zong-Xun LI

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Tao-Yuan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer circuit board structure and manufacturing method thereof
- Patent number 10,736,215
- Issue date Aug 4, 2020
- Unimicron Technology Corp.
- Shao-Chien Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and manufacturing method of heat dissipation substrate an...
- Patent number 10,497,847
- Issue date Dec 3, 2019
- Unimicron Technology Corp.
- Wen-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,468,570
- Issue date Nov 5, 2019
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package circuit board module
- Patent number 10,159,151
- Issue date Dec 18, 2018
- Unimicron Technology Corp.
- Wen-Fang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package circuit board module
- Patent number 10,056,356
- Issue date Aug 21, 2018
- Unimicron Technology Corp.
- Wen-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR STRUCTURE HAVING CURRENT CLAMPING...
- Publication number 20240079450
- Publication date Mar 7, 2024
- VISUAL PHOTONICS EPITAXY CO., LTD.
- Yu-Chung CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190181315
- Publication date Jun 13, 2019
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND MANUFACTURING METHOD OF HEAT DISSIPATION SUBSTRATE AN...
- Publication number 20190067543
- Publication date Feb 28, 2019
- Unimicron Technology Corp.
- Wen-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE CIRCUIT BOARD MODULE
- Publication number 20180368263
- Publication date Dec 20, 2018
- Unimicron Technology Corp.
- Wen-Fang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Forming a Cobalt-Iron Alloy Film on a Substrate
- Publication number 20180100218
- Publication date Apr 12, 2018
- CHUNG YUAN CHRISTIAN UNIVERSITY
- Chih-Chi Chen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...