Zongrong Liu

Follow

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 8,324,081
- Issue date Dec 4, 2012
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level surface passivation of stackable integrated circuit chips
- Patent number 7,923,349
- Issue date Apr 12, 2011
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20110147943
- Publication date Jun 23, 2011
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL SURFACE PASSIVATION OF STACKABLE INTEGRATED CIRCUIT CHIPS
- Publication number 20080315434
- Publication date Dec 25, 2008
- Vertical Circuits, Inc.
- Simon J.S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS