Membership
Tour
Register
Log in
Zongwei LI
Follow
Person
Beijing, CN
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Seismic acquisition system based on frequency domain expansion mems...
Patent number
12,130,397
Issue date
Oct 29, 2024
INSTITUTE OF GEOLOGY AND GEOPHYSICS, CHINESE ACADEMY OF SCIENCES
Jing Liu
G01 - MEASURING TESTING
Information
Patent Grant
Seismic acquisition system and sensor based on MEMS sensor with low...
Patent number
11,472,696
Issue date
Oct 18, 2022
INSTITUTE OF GEOLOGY AND GEOPHYSICS, CHINESE ACADEMY OF SCIENCES
Zongwei Li
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
MEMS sensor detection device and MEMS sensor system
Patent number
11,401,160
Issue date
Aug 2, 2022
INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
Zongwei Li
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System-level packaging method and packaging system based on 3D prin...
Patent number
10,643,862
Issue date
May 5, 2020
INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
Zongwei Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEISMIC ACQUISITION SYSTEM BASED ON FREQUENCY DOMAIN EXPANSION MEMS...
Publication number
20240077632
Publication date
Mar 7, 2024
Institute of Geology and Geophysics, Chinese Academy of Sciences
Jing LIU
G01 - MEASURING TESTING
Information
Patent Application
IRREGULAR OPTIMIZED ACQUISITION METHOD, DEVICE, APPARATUS AND MEDIU...
Publication number
20220155475
Publication date
May 19, 2022
INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES (IGGCAS)
Xiaocai SHAN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MEMS SENSOR DETECTION DEVICE AND MEMS SENSOR SYSTEM
Publication number
20210130164
Publication date
May 6, 2021
INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
Zongwei LI
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SYSTEM-LEVEL PACKAGING METHOD AND PACKAGING SYSTEM BASED ON 3D PRIN...
Publication number
20190228986
Publication date
Jul 25, 2019
INSTITUTE OF GEOLOGY AND GEOPHYSICS CHINESE ACADEMY OF SCIENCES
Zongwei LI
H01 - BASIC ELECTRIC ELEMENTS