Zongya Li

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Wuxi, CN

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Patents Grantslast 30 patents

Information Patent Grant
Magnetometer
- Patent number 8,525,514
- Issue date Sep 3, 2013
- Memsic, Inc.
- Yongyao Cai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Leakage detection method using micromachined-thermal-convection acc...
- Patent number 8,011,226
- Issue date Sep 6, 2011
- Memsic, Inc.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Grant
Sensor packaging method for a human contact interface
- Patent number 7,617,599
- Issue date Nov 17, 2009
- Memsic, Inc.
- Zongya Li
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional multi-chips and tri-axial sensors and methods of...
- Patent number 7,536,909
- Issue date May 26, 2009
- Memsic, Inc.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Patent number 7,495,462
- Issue date Feb 24, 2009
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
FOLDABLE SUBSTRATE
- Publication number 20130249542
- Publication date Sep 26, 2013
- Yang Zhao
- B32 - LAYERED PRODUCTS
Information Patent Application
MAGNETOMETER
- Publication number 20110227569
- Publication date Sep 22, 2011
- Yongyao Cai
- G01 - MEASURING TESTING
Information Patent Application
Leakage detection method using micromachined-thermal-convection acc...
- Publication number 20100050747
- Publication date Mar 4, 2010
- MEMSIC, INC.
- Yaping Hua
- G01 - MEASURING TESTING
Information Patent Application
Sensor packaging method for a human contact interface
- Publication number 20090145237
- Publication date Jun 11, 2009
- Zongya Li
- G01 - MEASURING TESTING
Information Patent Application
Three-dimensional multi-chips and tri-axial sensors and methods of...
- Publication number 20070170228
- Publication date Jul 26, 2007
- Memsic Corporation
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of wafer-level packaging using low-aspect ratio through-wafe...
- Publication number 20060273430
- Publication date Dec 7, 2006
- Memsic, Inc.
- Yaping Hua
- B81 - MICRO-STRUCTURAL TECHNOLOGY