Adaptation of interconnections

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CPC
H01L21/485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/485Adaptation of interconnections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate and manufacturing method thereof
- Patent number 12,272,653
- Issue date Apr 8, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chao-Tsung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an integrated device positioned within...
- Patent number 12,272,629
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming a chip package having first and...
- Patent number 12,272,712
- Issue date Apr 8, 2025
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for high-frequency package
- Patent number 12,272,567
- Issue date Apr 8, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including same
- Patent number 12,272,630
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel package substrate with stair shaped substrate traces
- Patent number 12,266,597
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing component carrier and component carrier int...
- Patent number 12,262,482
- Issue date Mar 25, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,126
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing stress in semiconductor chips
- Patent number 12,261,139
- Issue date Mar 25, 2025
- Ciena Corporation
- Jean-Sébastien Côté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,261,125
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,261,102
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Ling Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having multiple substrate segments
- Patent number 12,261,110
- Issue date Mar 25, 2025
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with riveting structure between two rings and...
- Patent number 12,255,156
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna chip packaging structure and method for preparing same
- Patent number 12,255,159
- Issue date Mar 18, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yayuan Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,255,157
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, assembly structure and method for manufacturing...
- Patent number 12,249,583
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Publication number 20250112163
- Publication date Apr 3, 2025
- Intel Corporation
- Pratyush Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...
- Publication number 20250112155
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...
- Publication number 20250113501
- Publication date Apr 3, 2025
- Eagle Technology, LLC
- Matt BAUER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250105224
- Publication date Mar 27, 2025
- JCET Management Co., Ltd.
- Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105118
- Publication date Mar 27, 2025
- PanelSemi Corporation
- Tang-Chin HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...
- Publication number 20250105122
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250105130
- Publication date Mar 27, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corner Reinforcement Structure for Package Interconnect
- Publication number 20250105115
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Jen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE AND PACKAGING METHOD
- Publication number 20250105168
- Publication date Mar 27, 2025
- Forehope Electronic (Ningbo) Co., Ltd.
- Zhenghong HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...
- Publication number 20250105170
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...
- Publication number 20250096091
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Chiao-Yi TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20250096101
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Carsten Joachim von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Stiffener Interposers
- Publication number 20250096154
- Publication date Mar 20, 2025
- Intel Corporation
- Chin Mian CHOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096158
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096175
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YISEUL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Dummy Vias to...
- Publication number 20250096095
- Publication date Mar 20, 2025
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
- Publication number 20250096180
- Publication date Mar 20, 2025
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250096055
- Publication date Mar 20, 2025
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...
- Publication number 20250096143
- Publication date Mar 20, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20250096167
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS

Adaptation of interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogeneous nested interposer package for IC chips

Semiconductor packaging substrate and manufacturing method thereof

Semiconductor device having an integrated device positioned within...

Chip package and method for forming a chip package having first and...

Manufacturing method for high-frequency package

Interposer and semiconductor package including same

Antenna apparatus and fabrication method

Dense via pitch interconnect to increase wiring density

Integrated devices in semiconductor packages and methods of forming...

Embedded component package structure and manufacturing method thereof

Semiconductor package and method of forming the same

Polymer material in a redistribution structure of a semiconductor p...

Multilevel package substrate with stair shaped substrate traces

Method of manufacturing component carrier and component carrier int...

Semiconductor package

Managing stress in semiconductor chips

Semiconductor package having an encapulant comprising conductive fi...

Method for forming chip package structure

Semiconductor device package and method of manufacturing the same

Semiconductor package and method of forming the same

Electronic assembly having multiple substrate segments

Semiconductor package with riveting structure between two rings and...

Antenna chip packaging structure and method for preparing same

Antenna modules employing three-dimensional (3D) build-up on mold p...

Silicon spacers with improved adhesion and semiconductor device ass...

Semiconductor package device with integrated inductor and manufactu...

Nitride-based semiconductor module and method for manufacturing the...

Chip package structure

Package structure, assembly structure and method for manufacturing...

Semiconductor device package

Patents Applicationslast 30 patents

THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-...

INTEGRATED CIRCUIT PACKAGE AND METHOD

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...

METHOD OF FABRICATING HIGH ACCURACY EMBEDDED RESISTORS IN FLEX SUBS...

WIRING BOARD AND SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING...

Electronic Device and Manufacturing Method Thereof

Corner Reinforcement Structure for Package Interconnect

ELECTROMAGNETIC SHIELDING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHO...

PACKAGE COMPRISING A SUBSTRATE WITH VIA INTERCONNECT WITH VERTICAL...

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

Package Substrates with Stiffener Interposers

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Methods of Making and Using Dummy Vias to...

SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATIO...

INTEGRATED CIRCUIT STRUCTURE AND METHOD

Antenna Apparatus and Method