Adaptation of interconnections

Industry

CPC
H01L21/485

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/485Adaptation of interconnections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for microelectronic devices
- Patent number 12,230,583
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,230,609
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, and semiconductor pa...
- Patent number 12,230,580
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,230,586
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 12,224,182
- Issue date Feb 11, 2025
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package
- Patent number 12,217,976
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with reinforced substrates
- Patent number 12,218,079
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Koustav Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component device, and electroni...
- Patent number 12,218,019
- Issue date Feb 4, 2025
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 12,218,043
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, resin sheet, cured film, method for producing cu...
- Patent number 12,210,285
- Issue date Jan 28, 2025
- Toray Industries, Inc.
- Keika Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener package and method of fabricating stiffener package
- Patent number 12,211,705
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...
- Publication number 20250062203
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Hi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE
- Publication number 20250062280
- Publication date Feb 20, 2025
- GENERAL ELECTRIC COMPANY
- Ljubisa D. Stevanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250062173
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062194
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...
- Publication number 20250062235
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20250062215
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Danfeng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062221
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054853
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
- Publication number 20250054854
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250054774
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Hyeyeong Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250054847
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20250054773
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE
- Publication number 20250046696
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Arya BHATTACHERJEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250046726
- Publication date Feb 6, 2025
- STATS ChipPAC Pte Ltd.
- MingYu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF
- Publication number 20250046622
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250046623
- Publication date Feb 6, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250046770
- Publication date Feb 6, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- In Su Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250046721
- Publication date Feb 6, 2025
- Samsung Electronics Co.,Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF
- Publication number 20250046690
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, PACKAGING SUBSTRATE AND MANUFACTURING MET...
- Publication number 20250046693
- Publication date Feb 6, 2025
- Smarter Silicon (Shanghai) Technologies Co., Ltd.
- Xiaorui YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE
- Publication number 20250046697
- Publication date Feb 6, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS

Adaptation of interconnections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package substrate z-disaggregation with liquid metal interconnects

Interposers for microelectronic devices

Electronic package and manufacturing method thereof

Method to enable 30 microns pitch EMIB or below

Multi-device graded embedding package substrate and manufacturing m...

Semiconductor device and method of forming micro interconnect struc...

Semiconductor packages

Package device

Method of manufacturing semiconductor package, and semiconductor pa...

Printed circuit board and electronic component package including th...

Magnetic core inductors in interposer

Method of manufacturing semiconductor device

Mixed hybrid bonding structures and methods of forming the same

Fan out structure for light-emitting diode (LED) device and lightin...

Package structure with metallic layer over the surfaces of a plural...

Method of fabricating package

Multi-chip package with high density interconnects

Semiconductor package and method of fabricating the same

Semiconductor devices with reinforced substrates

Package structure

Semiconductor package and method of manufacturing semiconductor pac...

Chip assembling on adhesion layer or dielectric layer, extending be...

Package and method of forming the same

Method for manufacturing electronic component device, and electroni...

Interposer, semiconductor package including the same, and method of...

Package structure with reinforced element

Method for forming chip package structure with molding layer

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Resin composition, resin sheet, cured film, method for producing cu...

Stiffener package and method of fabricating stiffener package

Patents Applicationslast 30 patents

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A COR...

POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

WIRING BOARD AND SEMICONDUCTOR DEVICE

FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

CIRCUIT BOARD

SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF

CHIP PACKAGING STRUCTURE, PACKAGING SUBSTRATE AND MANUFACTURING MET...

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

FLIP CHIP PACKAGE