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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
H01L2223/00
Details relating to semiconductor or other solid state devices covered by the group H01L23/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2227/00
Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
H01L2229/00
Indexing scheme for semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, for details of semiconductor bodies or of electrodes thereof, or for multistep manufacturing processes therefor
H01L2251/00
Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
H01L23/00
Details of semiconductor or other solid state devices
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
H01L28/00
Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
H01L29/00
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2933/00
Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
H01L31/00
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof
H01L33/00
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L35/00
Thermo-electric devices comprising a junction of dissimilar materials
H01L37/00
Thermoelectric devices without a junction of dissimilar materials Thermomagnetic devices
H01L39/00
Devices using superconductivity Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L41/00
Piezo-electric devices in general Electrostrictive devices in general Magnetostrictive devices in general Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L43/00
Devices using galvano-magnetic or similar magnetic effects Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L45/00
Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier
H01L47/00
Bulk negative resistance effect devices
H01L49/00
Solid state devices not provided for in groups H01L27/00 - H01L47/00 and H01L51/00 and not provided for in any other subclass Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L51/00
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
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Patents Grants
last 30 patents
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Patent Grant
Chip-on-film package, display panel, and display device
Patent number
12,340,719
Issue date
Jun 24, 2025
Samsung Display Co., Ltd.
Hee-Kwon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Temperature monitoring device and method
Patent number
12,339,174
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Zeng Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Biomimetic leaf wetness sensor and method of manufacture of the same
Patent number
12,339,246
Issue date
Jun 24, 2025
The Regents of the University of California
Marco Rolandi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming silicon-phosphorous materials
Patent number
12,338,547
Issue date
Jun 24, 2025
Applied Materials, Inc.
Errol Antonio C Sanchez
C30 - CRYSTAL GROWTH
Information
Patent Grant
Workpiece processing apparatus with outer gas channel insert
Patent number
12,340,981
Issue date
Jun 24, 2025
Beijing E-Town Semiconductor Technology Co., Ltd.
Maolin Long
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma processing apparatus and plasma processing method
Patent number
12,340,985
Issue date
Jun 24, 2025
Tokyo Electron Limited
Tetsuji Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ring carrier and substrate treating system
Patent number
12,340,988
Issue date
Jun 24, 2025
Semes Co., Ltd.
Mun Gi Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for forming material within a gap
Patent number
12,341,003
Issue date
Jun 24, 2025
ASM IP Holding B.V.
Timothee Blanquart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film formation method and film formation apparatus
Patent number
12,341,004
Issue date
Jun 24, 2025
Tokyo Electron Limited
Yumiko Kawano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming and using mask
Patent number
12,341,011
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for annealing a gate insulation layer on a wide band gap sem...
Patent number
12,341,012
Issue date
Jun 24, 2025
Infineon Technologies AG
Thomas Aichinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective etch using deposition of a metalloid or metal containing...
Patent number
12,341,021
Issue date
Jun 24, 2025
Lam Research Corporation
Samantha Siamhwa Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Treating vessel and liquid processing apparatus
Patent number
12,341,027
Issue date
Jun 24, 2025
Semes Co., Ltd.
Dae Sung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light irradiation type heat treatment method and heat treatment app...
Patent number
12,341,031
Issue date
Jun 24, 2025
SCREEN Holdings Co., Ltd.
Akitsugu Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dynamic and localized temperature control for epitaxial deposition...
Patent number
12,341,038
Issue date
Jun 24, 2025
Applied Materials, Inc.
Sathya Shrinivas Chary
F27 - FURNACES KILNS OVENS RETORTS
Information
Patent Grant
Automated OCAP interfacing system and method
Patent number
12,341,041
Issue date
Jun 24, 2025
Texas Instruments Incorporated
Tian Oon Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular material handling robot platform
Patent number
12,341,043
Issue date
Jun 24, 2025
Persimmon Technologies Corporation
Martin Hosek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer apparatus and transfer method
Patent number
12,341,046
Issue date
Jun 24, 2025
Tokyo Electron Limited
Norihiko Amikura
G01 - MEASURING TESTING
Information
Patent Grant
Interconnect line for semiconductor device
Patent number
12,341,057
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air gap through at least two metal layers
Patent number
12,341,058
Issue date
Jun 24, 2025
GLOBALFOUNDRIES Singapore Pte. Ltd.
Wei-Hui Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
Patent number
12,341,061
Issue date
Jun 24, 2025
Intel Corporation
Florian Gstrein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing chips
Patent number
12,341,068
Issue date
Jun 24, 2025
Disco Corporation
Hideyuki Sandoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside metal patterning die singulation system and related methods
Patent number
12,341,069
Issue date
Jun 24, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor circuit structure with direct die heat removal structure
Patent number
12,341,077
Issue date
Jun 24, 2025
INVENTION AND COLLABORATION LABORATORY, INC.
Chao-Chun Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip cooling package with multiple fluid paths
Patent number
12,341,082
Issue date
Jun 24, 2025
BAIDU USA LLC
Tianyi Gao
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Electronic device cooling structures bonded to semiconductor elements
Patent number
12,341,083
Issue date
Jun 24, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and semiconductor device each having non-photosensitiv...
Patent number
12,341,088
Issue date
Jun 24, 2025
Shinko Electric Industries Co., Ltd.
Hiroshi Taneda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar slab vias for integrated circuit interconnects
Patent number
12,341,092
Issue date
Jun 24, 2025
Intel Corporation
Elijah Karpov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor backside transistor integration with backside power d...
Patent number
12,341,099
Issue date
Jun 24, 2025
International Business Machines Corporation
Ruilong Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor storage device and manufacturing method thereof
Patent number
12,341,102
Issue date
Jun 24, 2025
Kioxia Corporation
Yusuke Oshiki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
Publication number
20250199058
Publication date
Jun 19, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING FLUORENE SKEL...
Publication number
20250199407
Publication date
Jun 19, 2025
NISSAN CHEMICAL CORPORATION
Shou SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Publication number
20250199408
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Tse LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCULATION APPARATUS AND METHOD OF CONTROLLING CIRCULATION APPARATUS
Publication number
20250198521
Publication date
Jun 19, 2025
SCREEN Holdings Co., Ltd.
Michinori IWAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...
Publication number
20250197996
Publication date
Jun 19, 2025
LAM RESEARCH CORPORATION
Awnish Gupta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION AND APPLICATION THEREOF, AND LEVELING AGENT AND PREPARA...
Publication number
20250198036
Publication date
Jun 19, 2025
Huawei Technologies Co., Ltd
Li ZHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chemical Mechanical Planarization Using Amino-Polyorganosiloxane-Co...
Publication number
20250197703
Publication date
Jun 19, 2025
VERSUM MATERIALS US, LLC
Gerhard Jonschker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...
Publication number
20250197783
Publication date
Jun 19, 2025
Tokyo Ohka Kogyo Co., Ltd.
Shinya KOGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH CIRCUIT-LOCATING MECHANISM
Publication number
20250201331
Publication date
Jun 19, 2025
Micron Technology, Inc.
Itamar Lavy
G11 - INFORMATION STORAGE
Information
Patent Application
FORMING INTEGRATED ELECTRONIC DEVICES FOR CONVERTING AND DOWNSCALIN...
Publication number
20250202349
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Ku LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING STRUCTURE OF A POWER SUPPLY MODULE
Publication number
20250201654
Publication date
Jun 19, 2025
Murata Manufacturing Co., Ltd.
Takami MUTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250201658
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module For An Electronic Computing Device
Publication number
20250201666
Publication date
Jun 19, 2025
SIEMENS AKTIENGESELLSCHAFT
Jörg Strogies
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITORS INTEGRATED WITH VIA STRUCTURES
Publication number
20250201670
Publication date
Jun 19, 2025
Intel Corporation
Denzil S. Frost
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
Publication number
20250201675
Publication date
Jun 19, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Hui Min LER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250201676
Publication date
Jun 19, 2025
INFINEON TECHNOLOGIES AG
Achim Althaus
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRUCTURE INCLUDING STACKED SUBSTRATES DISPOSED IN A SHELL
Publication number
20250201687
Publication date
Jun 19, 2025
QUALCOMM Incorporated
Yujen CHEN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES
Publication number
20250201689
Publication date
Jun 19, 2025
TEXAS INSTRUMENTS INCORPORATED
Jaimal Mallory Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT WITH NOISE REDUCING CAPACITOR AND METHOD OF MANU...
Publication number
20250201696
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ko Chun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TWO-DIMENSIONAL LAYER ASSISTED THREE-DIMENSIONAL TOP VIA INTERCONNECTS
Publication number
20250201697
Publication date
Jun 19, 2025
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION METHOD FOR FORMING HIGH VOLTAGE RESISTOR NETWORKS OVER...
Publication number
20250201703
Publication date
Jun 19, 2025
TEXAS INSTRUMENTS INCORPORATED
Jeffrey A. West
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ETCH STOP LAYER FOR BACKSIDE POWER DELIVERY NETWORK
Publication number
20250201712
Publication date
Jun 19, 2025
International Business Machines Corporation
Alexander Reznicek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TANTALUM ELECTRODE WITH TANTALUM NITRIDE LINER AS RIE DIFFUSION BAR...
Publication number
20250201716
Publication date
Jun 19, 2025
International Business Machines Corporation
Luxherta Buzi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
A Module
Publication number
20250201723
Publication date
Jun 19, 2025
Graphcore Limited
Stephen FELIX
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20250201727
Publication date
Jun 19, 2025
CXMT Corporation
Qingchun FANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
JITTER APPLIED DETECTION FOR SEMICONDUCTOR SECURE ELEMENT
Publication number
20250201736
Publication date
Jun 19, 2025
NXP B.V.
Kurt Ulrich Neugebauer
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
DIE WITH BOND PAD
Publication number
20250201738
Publication date
Jun 19, 2025
TEXAS INSTRUMENTS INCORPORATED
JEFFREY SOLAS
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Electroless Deposition Process for Semiconductor Devices
Publication number
20250201740
Publication date
Jun 19, 2025
Wolfspeed, Inc.
Meagan Lenore Coleman
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250201742
Publication date
Jun 19, 2025
RENESAS ELECTRONICS CORPORATION
Takashi TONEGAWA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SHOWERHEAD UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
Publication number
20250201523
Publication date
Jun 19, 2025
SEMES CO., LTD.
Ji Hoon LEE
H01 - BASIC ELECTRIC ELEMENTS