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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
H01L2223/00
Details relating to semiconductor or other solid state devices covered by the group H01L23/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2227/00
Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
H01L2229/00
Indexing scheme for semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, for details of semiconductor bodies or of electrodes thereof, or for multistep manufacturing processes therefor
H01L2251/00
Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
H01L23/00
Details of semiconductor or other solid state devices
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
H01L28/00
Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
H01L29/00
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2933/00
Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
H01L31/00
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof
H01L33/00
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L35/00
Thermo-electric devices comprising a junction of dissimilar materials
H01L37/00
Thermoelectric devices without a junction of dissimilar materials Thermomagnetic devices
H01L39/00
Devices using superconductivity Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L41/00
Piezo-electric devices in general Electrostrictive devices in general Magnetostrictive devices in general Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L43/00
Devices using galvano-magnetic or similar magnetic effects Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L45/00
Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier
H01L47/00
Bulk negative resistance effect devices
H01L49/00
Solid state devices not provided for in groups H01L27/00 - H01L47/00 and H01L51/00 and not provided for in any other subclass Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L51/00
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
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last 30 patents
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Patent Grant
PUF cell array, system and method of manufacturing same
Patent number
12,169,676
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Cheng-En Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Optoelectronic synaptic memristor
Patent number
12,169,773
Issue date
Dec 17, 2024
Beihang University
Anping Huang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronics tester
Patent number
12,169,217
Issue date
Dec 17, 2024
AEHR Test Systems
Jovan Jovanovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical liquid, chemical liquid storage body, chemical liquid fill...
Patent number
12,169,362
Issue date
Dec 17, 2024
FUJIFILM Corporation
Tetsuya Kamimura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positioning apparatus, lithography apparatus and article manufactur...
Patent number
12,169,368
Issue date
Dec 17, 2024
Canon Kabushiki Kaisha
Tsutomu Terao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post-CMP cleaning and apparatus
Patent number
12,170,195
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Fu-Ming Huang
B08 - CLEANING
Information
Patent Grant
Cyclic spin-on coating process for forming dielectric material
Patent number
12,170,199
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Je-Ming Kuo
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Formation and in-situ etching processes for metal layers
Patent number
12,170,202
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit with conductive via formation on self-aligned ga...
Patent number
12,170,203
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jia-Chuan You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for fabricating semiconductor structures
Patent number
12,170,205
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Nien Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,170,314
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chun Hsiung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, and method of manufacturing the semiconductor...
Patent number
12,170,317
Issue date
Dec 17, 2024
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional device with vertical core and bundled wiring
Patent number
12,170,326
Issue date
Dec 17, 2024
Tokyo Electron Limited
Mark I. Gardner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin field effect transistor devices including NMOS device and PMOS...
Patent number
12,170,332
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Yuan-Sheng Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Oxide semiconductor transistor, method of manufacturing the same, a...
Patent number
12,170,336
Issue date
Dec 17, 2024
Samsung Electronics Co., Ltd.
Kwanghee Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Logic circuit and semiconductor device
Patent number
12,170,338
Issue date
Dec 17, 2024
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic semiconductor component having an intermediate layer...
Patent number
12,170,342
Issue date
Dec 17, 2024
Osram Opto Semiconductors GmbH
Mohammad Tollabi Mazraehno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device using semiconductor light-emitting element, and manu...
Patent number
12,170,345
Issue date
Dec 17, 2024
LG Electronics Inc.
Byungjoon Rhee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for managing temperature in semiconductor fabrication facility
Patent number
12,170,208
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Otto Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flat pocket susceptor design with improved heat transfer
Patent number
12,170,213
Issue date
Dec 17, 2024
Applied Materials, Inc.
Zhepeng Cong
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Transfer device, processing system, and transfer method
Patent number
12,170,216
Issue date
Dec 17, 2024
Tokyo Electron Limited
Shinya Okano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for processing substrate
Patent number
12,170,221
Issue date
Dec 17, 2024
Jusung Engineering Co., Ltd.
Won Woo Jung
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Stacked semiconductor device with nanostructure channels
Patent number
12,170,227
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Te Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Gate-all-around device with trimmed channel and dipoled dielectric...
Patent number
12,170,231
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Wei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package with multi-lid structures and method for...
Patent number
12,170,238
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
Patent number
12,170,240
Issue date
Dec 17, 2024
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out wafer level package structure
Patent number
12,170,242
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including interposer
Patent number
12,170,249
Issue date
Dec 17, 2024
Samsung Electronics Co., Ltd.
Jong-youn Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,170,265
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chao-I Wu
G11 - INFORMATION STORAGE
Information
Patent Grant
Integrated circuit and manufacturing method of the same
Patent number
12,170,277
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kam-Tou Sio
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEMS AND METHODS FOR CONTACTLESS FORMATION OF TILTED OPTICAL WIN...
Publication number
20240417303
Publication date
Dec 19, 2024
Corning Incorporated
Thierry Luc Alain Dannoux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR FOR SUBSTRATE SUPPORT WITH EMBEDDED TEMPERATURE SENSORS
Publication number
20240417857
Publication date
Dec 19, 2024
LAM RESEARCH CORPORATION
Siyuan TIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
Publication number
20240418951
Publication date
Dec 19, 2024
Intel Corporation
Peng Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANELS AND DISPLAY DEVICES
Publication number
20240419037
Publication date
Dec 19, 2024
GUANGZHOU CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Qingjuan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
Publication number
20240418443
Publication date
Dec 19, 2024
SCREEN Holdings Co., Ltd.
Tomoya TANAKA
B08 - CLEANING
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Patent Application
MEMORY DEVICE
Publication number
20240420764
Publication date
Dec 19, 2024
KIOXIA Corporation
Hiroshi MAEJIMA
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20240422964
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
Kyunghwan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LATERALLY SEPARATED SOURCE SEL...
Publication number
20240422973
Publication date
Dec 19, 2024
WESTERN DIGITAL TECHNOLOGIES, INC.,
Shinsuke YADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
Publication number
20240422976
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
Dongyoung KIM
G11 - INFORMATION STORAGE
Information
Patent Application
SOLID-STATE IMAGING DEVICE
Publication number
20240423001
Publication date
Dec 19, 2024
Sony Semiconductor Solutions Corporation
TADASHI IIJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
Publication number
20240423037
Publication date
Dec 19, 2024
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Tiaomei ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WIT...
Publication number
20240421465
Publication date
Dec 19, 2024
Intel Corporation
Tolga Acikalin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and Compositions for RNA-Directed Target DNA Modification a...
Publication number
20240417756
Publication date
Dec 19, 2024
The Regents of the University of California
Jennifer A. Doudna
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING APPARATUS
Publication number
20240416390
Publication date
Dec 19, 2024
EBARA CORPORATION
Naoki TOYOMURA
B08 - CLEANING
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Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
Publication number
20240417595
Publication date
Dec 19, 2024
FUJIMI INCORPORATED
Tzu-Chun TSENG
C01 - INORGANIC CHEMISTRY
Information
Patent Application
MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME
Publication number
20240417620
Publication date
Dec 19, 2024
YCCHEM CO., LTD.
Jun Han KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME
Publication number
20240420951
Publication date
Dec 19, 2024
FENG CHIA UNIVERSITY
Chang-Ho YU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FABRICATION OF N-FACE III-NITRIDES BY REMOTE EPITAXY
Publication number
20240420955
Publication date
Dec 19, 2024
Future Semiconductor Business, Inc
Kyusang Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM
Publication number
20240420958
Publication date
Dec 19, 2024
ASM IP HOLDING B.V.
Venkata Surya Naga Raju Chava
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS OF SELECTIVELY ETCHING SILICON NITRIDE
Publication number
20240420962
Publication date
Dec 19, 2024
Applied Materials, Inc.
Doreen Wei Ying Yong
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MODIFICATION OF METAL-CONTAINING SURFACES IN HIGH ASPECT RATIO PLAS...
Publication number
20240420963
Publication date
Dec 19, 2024
LAM RESEARCH CORPORATION
He Zhang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES
Publication number
20240420965
Publication date
Dec 19, 2024
TOKYO ELECTRON LIMITED
Shihsheng Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
Publication number
20240420966
Publication date
Dec 19, 2024
Applied Materials, Inc.
Zhiyuan Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
Publication number
20240420968
Publication date
Dec 19, 2024
INFINEON TECHNOLOGIES AG
Alexander Schmer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID CIRCULATION SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND LIQU...
Publication number
20240420970
Publication date
Dec 19, 2024
TOKYO ELECTRON LIMITED
Takao OKABE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOW OPEN AREA AND COUPON ENDPOINT DETECTION
Publication number
20240420975
Publication date
Dec 19, 2024
Applied Materials, Inc.
Varoujan Chakarian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
Publication number
20240420978
Publication date
Dec 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jeng-Chi LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRYOGENIC SUSCEPTOR AND ELECTRIC CONNECTOR ASSEMBLY USED THEREIN
Publication number
20240420985
Publication date
Dec 19, 2024
MiCo Ceramics Ltd.
Hyekyong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
Publication number
20240420988
Publication date
Dec 19, 2024
EPISTAR CORPORATION
Chien-Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
Publication number
20240420996
Publication date
Dec 19, 2024
Applied Materials, Inc.
Jiajie Cen
H01 - BASIC ELECTRIC ELEMENTS