Membership
Tour
Register
Log in
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Follow
Industry
CPC
H01L
Parent Industries
H
ELECTRICITY
H01
Electric elements
Current Industry
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Sub Industries
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
H01L2223/00
Details relating to semiconductor or other solid state devices covered by the group H01L23/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2227/00
Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
H01L2229/00
Indexing scheme for semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, for details of semiconductor bodies or of electrodes thereof, or for multistep manufacturing processes therefor
H01L2251/00
Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
H01L23/00
Details of semiconductor or other solid state devices
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
H01L28/00
Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
H01L29/00
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2933/00
Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
H01L31/00
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof
H01L33/00
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L35/00
Thermo-electric devices comprising a junction of dissimilar materials
H01L37/00
Thermoelectric devices without a junction of dissimilar materials Thermomagnetic devices
H01L39/00
Devices using superconductivity Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L41/00
Piezo-electric devices in general Electrostrictive devices in general Magnetostrictive devices in general Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L43/00
Devices using galvano-magnetic or similar magnetic effects Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L45/00
Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier
H01L47/00
Bulk negative resistance effect devices
H01L49/00
Solid state devices not provided for in groups H01L27/00 - H01L47/00 and H01L51/00 and not provided for in any other subclass Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L51/00
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor integrated circuit
Patent number
12,237,669
Issue date
Feb 25, 2025
Integrated Silicon Solution Inc.
Kang Min Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ferroelectric capacitor, ferroelectric field effect transistor, and...
Patent number
12,237,112
Issue date
Feb 25, 2025
Micron Technology, Inc.
Manuj Nahar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for processing substrate using plasma
Patent number
12,237,151
Issue date
Feb 25, 2025
SEMES CO, LTD.
Seong Gil Lee
B08 - CLEANING
Information
Patent Grant
Etching method
Patent number
12,237,174
Issue date
Feb 25, 2025
HITACHI HIGH-TECH CORPORATION
Kazunori Shinoda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor processing system including temperature controller
Patent number
12,237,183
Issue date
Feb 25, 2025
Samsung Electronics Co., Ltd.
Kyoungsik Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heating structure and wafer test device
Patent number
12,237,184
Issue date
Feb 25, 2025
SEMIGHT INSTRUMENTS CO., LTD
Zhe Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser machining apparatus and laser machining method
Patent number
12,237,185
Issue date
Feb 25, 2025
Samsung Display Co., Ltd.
Heung Yeol Na
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
Patent number
12,237,297
Issue date
Feb 25, 2025
Samsung Electronics Co., Ltd.
Junga Lee
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Through-substrate void filling for an integrated circuit assembly
Patent number
12,237,300
Issue date
Feb 25, 2025
Intel Corporation
Tyler Leuten
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Correction die for wafer/die stack
Patent number
12,237,306
Issue date
Feb 25, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
12,237,320
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having improved electrostatic discharge protec...
Patent number
12,237,323
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Fu Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Variable width for RF neighboring stacks
Patent number
12,237,327
Issue date
Feb 25, 2025
pSemi Corporation
Shashi Samal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating the same
Patent number
12,237,329
Issue date
Feb 25, 2025
United Microelectronics Corp.
Chun-Hao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit
Patent number
12,237,332
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Guo-Huei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
12,237,342
Issue date
Feb 25, 2025
Japan Display Inc.
Akihiro Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor and image signal processing method
Patent number
12,237,349
Issue date
Feb 25, 2025
Samsung Electronics Co., Ltd.
Seung Wan Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and related methods
Patent number
12,237,351
Issue date
Feb 25, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yu-Te Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor die
Patent number
12,237,355
Issue date
Feb 25, 2025
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Danqing Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor and electronic apparatus including the same
Patent number
12,237,357
Issue date
Feb 25, 2025
Samsung Electronics Co., Ltd.
Ji-Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transparent display
Patent number
12,237,361
Issue date
Feb 25, 2025
Au Optronics Corporation
Chih-Che Kuo
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Field effect transistor and method
Patent number
12,237,372
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Lung-Kun Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for producing same
Patent number
12,237,374
Issue date
Feb 25, 2025
mqSemi AG
Munaf Rahimo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of spacer formation with straight sidewall of memory cells
Patent number
12,237,387
Issue date
Feb 25, 2025
Infineon Technologies LLC
Angela Tai Hui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor arrangements with stacked trench contacts and gate straps
Patent number
12,237,388
Issue date
Feb 25, 2025
Intel Corporation
Andy Chih-Hung Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waferscale physiological characteristic sensor package with integra...
Patent number
12,232,842
Issue date
Feb 25, 2025
Medtronic MiniMed, Inc.
Daniel Hahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-definition flicker-free etched glass, manufacturing process th...
Patent number
12,234,179
Issue date
Feb 25, 2025
Zhang Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CMP composition including anionic and cationic inhibitors
Patent number
12,234,382
Issue date
Feb 25, 2025
CMC MATERIALS LLC
Hsin-Yen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Proximity sensor including enclosed accommodation space with sealed...
Patent number
12,235,391
Issue date
Feb 25, 2025
Pixart Imaging Incorporation
Nientse Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor and distance measurement apparatus having an avalanche photo...
Patent number
12,235,392
Issue date
Feb 25, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Yusuke Takatsuka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
Publication number
20250068377
Publication date
Feb 27, 2025
Kokusai Electric Corporation
Shinichiro MORI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING O...
Publication number
20250068195
Publication date
Feb 27, 2025
Applied Materials, Inc.
Wolfgang R. ADERHOLD
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FILMS WITH NARROW BAND EMISSION PHOSPHOR MATERIALS
Publication number
20250066633
Publication date
Feb 27, 2025
GE Intellectual Property Licensing, LLC
Mark D. Doherty
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON NITRIDE SINTERED BODY, WEAR-RESISTANT MEMBER, SUBSTRATE FOR...
Publication number
20250066258
Publication date
Feb 27, 2025
Kabushiki Kaisha Toshiba
Takayuki FUKASAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME
Publication number
20250066154
Publication date
Feb 27, 2025
Samsung Electronics Co., Ltd.
Doojin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING MODULE INCLUDING OPTICAL MEMBER THAT CONTROLS LIGHT...
Publication number
20250067906
Publication date
Feb 27, 2025
Nichia Corporation.
Takanori ARUGA
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
Substrate Coupled Grating Couplers in Photonic Integrated Circuits
Publication number
20250067932
Publication date
Feb 27, 2025
Google LLC
Liming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) I...
Publication number
20250067942
Publication date
Feb 27, 2025
Lightmatter, Inc
Kuang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20250067946
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Systems and Methods for Integrated Shielding in a Current Sensor
Publication number
20250067778
Publication date
Feb 27, 2025
ALLEGRO MICROSYSTEMS, LLC
Shaun D. Milano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20250067793
Publication date
Feb 27, 2025
InnoLux Corporation
Chia-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SPECTROMETER DEVICE
Publication number
20250067598
Publication date
Feb 27, 2025
trinamiX GmbH
Moritz LAUBSCHER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INK DROP MEASUREMENT PAD, INKJET PRINTER DEVICE HAVING SAME, AND ME...
Publication number
20250065619
Publication date
Feb 27, 2025
UNIJET CO., LTD.
SEOG SOON KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
Publication number
20250065400
Publication date
Feb 27, 2025
SEMIKRON ELEKTRONIK GMBH & CO. KG
DOMINIC BIRKICHT
B22 - CASTING POWDER METALLURGY
Information
Patent Application
FILM FORMATION APPARATUS AND FILM FORMATION METHOD OF GALLIUM NITRI...
Publication number
20250066901
Publication date
Feb 27, 2025
Japan Display Inc.
Masanobu IKEDA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEAM PERFORMANCE IMPROVEMENT USING HYDROXYLATION FOR GAPFILL
Publication number
20250066913
Publication date
Feb 27, 2025
Applied Materials, Inc.
Supriya Ghosh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SUBSTRATE PROCESSING APPARATUS
Publication number
20250066920
Publication date
Feb 27, 2025
EUGENE TECHNOLOGY CO., LTD.
In Soo SON
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE SAME
Publication number
20250069968
Publication date
Feb 27, 2025
LAPIS Semiconductor Co., Ltd.
Shohei HIEJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROTECTIVE LAYER WITH FILLERS
Publication number
20250069969
Publication date
Feb 27, 2025
Samsung Electronics Co., Ltd.
Daehyun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
Publication number
20250069975
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICS CHIP PACKAGE STRUCTURES INCLUDING A CONTROLLED UNDERFILL...
Publication number
20250069977
Publication date
Feb 27, 2025
GLOBALFOUNDRIES U.S. Inc.
Kashi Vishwanath Machani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL SPREADER
Publication number
20250069978
Publication date
Feb 27, 2025
SK Hynix NAND Product Solutions Corp. (dba Solidigm)
Hardeep Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250069979
Publication date
Feb 27, 2025
Samsung Electronics Co., Ltd.
Eunseok CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250069981
Publication date
Feb 27, 2025
Mitsubishi Electric Corporation
Shogo TOKUMARU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY
Publication number
20250069984
Publication date
Feb 27, 2025
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250069989
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Chih HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDD...
Publication number
20250070001
Publication date
Feb 27, 2025
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL COMPONENT AND METHOD OF FORMING SAME
Publication number
20250070009
Publication date
Feb 27, 2025
Medtronic, Inc.
Caian Qiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Switches in Interconnect Structures and the Method Forming th...
Publication number
20250070011
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chao Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS
Publication number
20250070018
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing company Ltd.
I-Hsin Yang
G11 - INFORMATION STORAGE