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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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ELECTRICITY
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Electric elements
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H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Sub Industries
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
H01L2223/00
Details relating to semiconductor or other solid state devices covered by the group H01L23/00
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
H01L2227/00
Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
H01L2229/00
Indexing scheme for semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, for details of semiconductor bodies or of electrodes thereof, or for multistep manufacturing processes therefor
H01L2251/00
Indexing scheme relating to organic semiconductor devices covered by group H01L51/00
H01L23/00
Details of semiconductor or other solid state devices
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L25/00
Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
H01L27/00
Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
H01L28/00
Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
H01L29/00
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2933/00
Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
H01L31/00
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof
H01L33/00
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L35/00
Thermo-electric devices comprising a junction of dissimilar materials
H01L37/00
Thermoelectric devices without a junction of dissimilar materials Thermomagnetic devices
H01L39/00
Devices using superconductivity Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L41/00
Piezo-electric devices in general Electrostrictive devices in general Magnetostrictive devices in general Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof Details thereof
H01L43/00
Devices using galvano-magnetic or similar magnetic effects Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L45/00
Solid state devices adapted for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier
H01L47/00
Bulk negative resistance effect devices
H01L49/00
Solid state devices not provided for in groups H01L27/00 - H01L47/00 and H01L51/00 and not provided for in any other subclass Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof
H01L51/00
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
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Patents Grants
last 30 patents
Information
Patent Grant
Remote capacitively coupled plasma deposition of amorphous silicon
Patent number
12,365,986
Issue date
Jul 22, 2025
Applied Materials, Inc.
Zubin Huang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Systems and methods for power module for inverter for electric vehicle
Patent number
12,368,391
Issue date
Jul 22, 2025
BorgWarner US Technologies LLC
David Paul Buehler
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Logic drive based on standard commodity FPGA IC chips using non-vol...
Patent number
12,368,438
Issue date
Jul 22, 2025
iCometrue Company Ltd.
Jin-Yuan Lee
G11 - INFORMATION STORAGE
Information
Patent Grant
Method and system for providing variable ramp-down control for an e...
Patent number
12,369,228
Issue date
Jul 22, 2025
Watlow Electric Manufacturing Company
Brittany Phillips
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device and manufacturing method for semiconductor device
Patent number
12,369,370
Issue date
Jul 22, 2025
Fuji Electric Co., Ltd.
Takahiro Tamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite substrate, composite substrate preparation method, semico...
Patent number
12,369,373
Issue date
Jul 22, 2025
Huawei Technologies Co., Ltd.
Bo Gao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Epitaxial growth methods and structures thereof
Patent number
12,369,374
Issue date
Jul 22, 2025
Taiwan Semicoductor Manufacturing Co., Ltd.
Tetsuji Ueno
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Nanosheet transistor
Patent number
12,369,379
Issue date
Jul 22, 2025
Adeia Semiconductor Solutions LLC
Kangguo Cheng
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Transistor with dielectric spacers and field plate and method of fa...
Patent number
12,369,380
Issue date
Jul 22, 2025
NXP USA, INC.
Darrell Glenn Hill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit fabrication method that includes reconfiguration of via con...
Patent number
12,369,257
Issue date
Jul 22, 2025
Innovium, Inc.
Vittal Balasubramanian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for forming metal-insulator-metal capacitors
Patent number
12,369,336
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Wei-Liang Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Thin film capacitor and electronic circuit substrate having the same
Patent number
12,369,337
Issue date
Jul 22, 2025
TDK Corporation
Daiki Ishii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Horizontal hall device and preparation method
Patent number
12,366,614
Issue date
Jul 22, 2025
Southeast University
Long Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna array with replaceable antenna cell
Patent number
12,368,229
Issue date
Jul 22, 2025
YTTEK TECHNOLOGY CORP.
Fang-Yao Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
12,368,138
Issue date
Jul 22, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having photonic die and electronic die
Patent number
12,368,147
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for using spacer-on-spacer design for solder...
Patent number
12,368,113
Issue date
Jul 22, 2025
Micron Technology, Inc.
Faxing Che
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated millimeter-wave dual-mode matching network
Patent number
12,368,118
Issue date
Jul 22, 2025
NXP B.V.
Harish Nandagopal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,368,122
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Jinhee Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including stacked pillar portions and method for...
Patent number
12,368,123
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
Patent number
12,368,136
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Hyunsu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
12,366,935
Issue date
Jul 22, 2025
Samsung Display Co., Ltd.
Wooyong Sung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Edge seal for lower electrode assembly
Patent number
12,368,025
Issue date
Jul 22, 2025
Lam Research Corporation
David Schaefer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing
Patent number
12,368,048
Issue date
Jul 22, 2025
Fuji Electric Co., Ltd.
Misaki Meguro
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor test sample and manufacturing method thereof
Patent number
12,368,051
Issue date
Jul 22, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Rui Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-substrate composite semiconductor device
Patent number
12,368,052
Issue date
Jul 22, 2025
Infineon Technologies Austria AG
Christian Fachmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for laser drilling process for an integrated circuit package
Patent number
12,368,053
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Shen Cheng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lead frame rolling
Patent number
12,368,054
Issue date
Jul 22, 2025
Texas Instruments Incorporated
Amirul Afiq Bin Hud
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing
Patent number
12,368,060
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jhon Jhy Liaw
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer taping apparatus and method
Patent number
12,368,063
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chien-Yi Lee
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
METHODS FOR PERFORMING HIGH-SPEED, SCANNED LASER STRUCTURING OF MUL...
Publication number
20250235960
Publication date
Jul 24, 2025
Northwestern University
John A. Rogers
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
COOLING CONTROL IN CHEMICAL MECHANICAL POLISHING
Publication number
20250235978
Publication date
Jul 24, 2025
Lapmaster International, LLC
Robert Lewis Rhoades
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH PURITY POLYSILOCARB DERIVED SILICON CARBIDE MATERIALS, APPLICA...
Publication number
20250236524
Publication date
Jul 24, 2025
Pallidus, Inc.
Douglas M. Dukes
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
PHOTOMASK DESIGN METHOD, SEMICONDUCTOR MANUFACTURING PROCESS, AND S...
Publication number
20250237942
Publication date
Jul 24, 2025
United Microelectronics Corp.
Chia-Chen Sun
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20250237830
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
G02 - OPTICS
Information
Patent Application
PLASMA SYSTEMS AND METHODS FOR USING SQUARE-SHAPED PULSE SIGNALS
Publication number
20250239434
Publication date
Jul 24, 2025
LAM RESEARCH CORPORATION
Alexei M. Marakhtanov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-LAYER FOCUS RING FOR PLASMA SEMICONDUCTOR PROCESSING
Publication number
20250239438
Publication date
Jul 24, 2025
Beijing NAURA Microelectronics Equipment Co., Ltd.
Yulin PENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
Publication number
20250239462
Publication date
Jul 24, 2025
TEXAS INSTRUMENTS INCORPORATED
NAZILA DADVAND
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
WAFER CLEANING SYSTEM
Publication number
20250239466
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Tae Ha YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR DICING A WAFER
Publication number
20250239467
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Hyun Soo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS INCLUDING A SUBSTRATE CHUCK, A DISPENSER, AND A PLANARIZA...
Publication number
20250239471
Publication date
Jul 24, 2025
Canon Kabushiki Kaisha
Ozkan Ozturk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT-EMITTING ELEMENT ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING...
Publication number
20250239477
Publication date
Jul 24, 2025
AUO Corporation
Kuan-Yi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILLING OPENINGS BY COMBINING NON-FLOWABLE AND FLOWABLE PROCESSES
Publication number
20250239482
Publication date
Jul 24, 2025
Intel Corporation
Ebony L. Mays
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...
Publication number
20250239495
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing company Ltd.
Ming Jun Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN PACKAGED COMPONENT
Publication number
20250239499
Publication date
Jul 24, 2025
PANJIT INTERNATIONAL INC.
CHUNG-HSIUNG HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
Publication number
20250239500
Publication date
Jul 24, 2025
PANJIT INTERNATIONAL INC.
Chung Hsiung HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH HEATING ELEMENT
Publication number
20250239502
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Tsung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SINK WITH HEAT PIPE HANDLE PORTION
Publication number
20250239503
Publication date
Jul 24, 2025
ZT Group Int’l, Inc. dba ZT Systems
Sruti Chigullapalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
Publication number
20250239504
Publication date
Jul 24, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
Publication number
20250239505
Publication date
Jul 24, 2025
STMicroelectronics International N.V.
Ludovic FALLOURD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED CAPACITOR PACKAGE HAVING REDISTRIBU...
Publication number
20250239518
Publication date
Jul 24, 2025
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
Publication number
20250239519
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
MIN-CHUNG CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20250239526
Publication date
Jul 24, 2025
KIOXIA Corporation
Hikaru ARAKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
Publication number
20250239530
Publication date
Jul 24, 2025
VIA TECHNOLOGIES, INC.
Yeh-Chi Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20250239538
Publication date
Jul 24, 2025
SK HYNIX INC.
Won Geun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING HYBRID BOND STRUCTURE WITH AI...
Publication number
20250239544
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
Hsih-Yang CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TREATMENT PROCESS FOR WAFER BONDING PROCESSES
Publication number
20250239564
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Tsu Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
Publication number
20250239574
Publication date
Jul 24, 2025
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATION COMPONENT WITH ANISOTROPIC HEAT CONDUCTION AND MET...
Publication number
20250236776
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Chieh Yang
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ACCOMMODATION DEVICE AND AUTOMATED TRANSPORT CARRIER AND OPERATION...
Publication number
20250236158
Publication date
Jul 24, 2025
Innolux Corporation
Chien-Wei Chen
B60 - VEHICLES IN GENERAL