Adhesive bonding; Encapsulation with polymer material

Industry

CPC
G02B6/4239

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4239Adhesive bonding; Encapsulation with polymer material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Alignment method for optical waveguide element
- Patent number 12,111,504
- Issue date Oct 8, 2024
- Nippon Telegraph and Telephone Corporation
- Hiroshi Ishikawa
- G02 - OPTICS
Information Patent Grant
Optical signal transmission device
- Patent number 12,078,855
- Issue date Sep 3, 2024
- BLOVELIGHT (GUANGDONG) INTELLIGENT TECHNOLOGY CO., LTD.
- Dawei Guo
- G02 - OPTICS
Information Patent Grant
Self-aligned integrated lens on pillar
- Patent number 12,055,774
- Issue date Aug 6, 2024
- Mellanox Technologies, Ltd.
- Dimitrios Kalavrouziotis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 12,050,350
- Issue date Jul 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng You
- G02 - OPTICS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
LED light source and method of manufacturing the same
- Patent number 12,034,102
- Issue date Jul 9, 2024
- Nichia Corporation
- Munetsugu Ehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit (PIC) package
- Patent number 12,025,841
- Issue date Jul 2, 2024
- Lumentum Operations LLC
- Pavel Mamyshev
- G02 - OPTICS
Information Patent Grant
Highly-integrated multi-channel optical module having lens mounting...
- Patent number 12,021,563
- Issue date Jun 25, 2024
- Electronics and Telecommunications Research Institute
- Hae Chung Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optoelectronic package and method of manufacturing the same
- Patent number 11,982,853
- Issue date May 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit and opto-electronic system comprising t...
- Patent number 11,899,254
- Issue date Feb 13, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- G02 - OPTICS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimentional packaging method and package structure of photoni...
- Patent number 11,789,218
- Issue date Oct 17, 2023
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Yichen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, optical device, and manufacturing method of package
- Patent number 11,789,201
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- G02 - OPTICS
Information Patent Grant
Method and apparatus to add light sources to a print
- Patent number 11,784,281
- Issue date Oct 10, 2023
- Xerox Corporation
- David C. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for attaching optical fibers to warped photonic c...
- Patent number 11,762,157
- Issue date Sep 19, 2023
- Intel Corporation
- Sufi Ahmed
- G02 - OPTICS
Information Patent Grant
Photonics fabrication process performance improvement
- Patent number 11,762,146
- Issue date Sep 19, 2023
- Analog Photonics LLC
- Michael Robert Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module for endoscope, endoscope, and manufacturing method o...
- Patent number 11,762,156
- Issue date Sep 19, 2023
- Olympus Corporation
- Takahide Miyawaki
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Optoelectronic device
- Patent number 11,740,416
- Issue date Aug 29, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- G02 - OPTICS
Information Patent Grant
Optical module and method of producing the same
- Patent number 11,733,467
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Yasushi Fujimura
- G02 - OPTICS
Information Patent Grant
Low footprint optical interconnects
- Patent number 11,726,274
- Issue date Aug 15, 2023
- WAVEFRONT RESEARCH, INC.
- Randall C. Veitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and assembling method thereof
- Patent number 11,715,433
- Issue date Aug 1, 2023
- Innolux Corporation
- Chung-Chun Kuo
- G02 - OPTICS
Information Patent Grant
Optical based placement of an optical component using a pick and pl...
- Patent number 11,693,195
- Issue date Jul 4, 2023
- OpenLight Photonics, Inc.
- Steven William Keck
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Optoelectronic structure
- Patent number 11,675,136
- Issue date Jun 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Optical assembly and manufacturing method thereof
- Patent number 11,675,146
- Issue date Jun 13, 2023
- InnoLight Technology (Suzhou) LTD.
- Long Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical connector cable
- Patent number 11,656,415
- Issue date May 23, 2023
- Sumitomo Electric Industries, Ltd.
- Taisuke Nagasaki
- G02 - OPTICS
Information Patent Grant
Optical waveguide connection assembly and optical module comprising...
- Patent number 11,656,416
- Issue date May 23, 2023
- Molex, LLC
- Sung-Ping Huang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
FIBER OPTIC ATTACHMENT APPARATUS AND ATTACHING AN OPTICAL FIBER TO...
- Publication number 20240393550
- Publication date Nov 28, 2024
- Government of the United States of America, as Represented by the Secretary o...
- Jeffrey Taylor Chiles
- G02 - OPTICS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240393549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE DEVICE
- Publication number 20240385366
- Publication date Nov 21, 2024
- Shinko Electric Industries Co., Ltd.
- Kazunao YAMAMOTO
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240369783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
LIGHT GUIDE PLATE UNIT AND GAMING MACHINE
- Publication number 20240345310
- Publication date Oct 17, 2024
- Omron Corporation
- Takahiro ONO
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL CONNECTOR CABLE
- Publication number 20240337797
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Kensaku SHIMADA
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...
- Publication number 20240329339
- Publication date Oct 3, 2024
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240329344
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240329340
- Publication date Oct 3, 2024
- TDK Corporation
- Kenji NAGASE
- G02 - OPTICS
Information Patent Application
INTEGRATED OPTICAL MODULE
- Publication number 20240319453
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Satoshi KAJIYA
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240302614
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
METHOD FOR CONNECTING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE CONN...
- Publication number 20240302610
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- JUNICHI KAMATANI
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL RECEPTION...
- Publication number 20240295708
- Publication date Sep 5, 2024
- FUJITSU OPTICAL COMPONENTS LIMITED
- Masaki SUGIYAMA
- G02 - OPTICS
Information Patent Application
MANAGING TEMPERATURES IN INTEGRATED CIRCUITS
- Publication number 20240288633
- Publication date Aug 29, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240280764
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240213205
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR-OUTLINE PACKAGE AND PREPARATION METHOD THEREOF, OPTICAL...
- Publication number 20240201457
- Publication date Jun 20, 2024
- Huawei Technologies Co., Ltd
- Yujie Zeng
- G02 - OPTICS
Information Patent Application
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
OPTICAL WAFER-LEVEL PACKAGE
- Publication number 20240184066
- Publication date Jun 6, 2024
- Cisco Technology, Inc.
- Norbert SCHLEPPLE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
- Publication number 20240168245
- Publication date May 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- G02 - OPTICS
Information Patent Application
SURFACE MOUNTABLE OPTOELECTRONIC DEVICE WITH SIDE WALLS INCLUDING S...
- Publication number 20240159977
- Publication date May 16, 2024
- DOMINANT Opto Technologies Sdn Bhd
- LOW TEK BENG
- G02 - OPTICS
Information Patent Application
CONTAMINATION-SAFE OPTICAL COUPLING DEVICE
- Publication number 20240151920
- Publication date May 9, 2024
- RAYLASE GmbH
- Reinold Wischnewski
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240077669
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20240061195
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS

Adhesive bonding; Encapsulation with polymer material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hydrophobic feature to control adhesive flow

Alignment method for optical waveguide element

Optical signal transmission device

Self-aligned integrated lens on pillar

Semiconductor package structure and method of manufacturing the same

Silicon groove architectures and manufacturing processes for passiv...

LED light source and method of manufacturing the same

Photonic integrated circuit (PIC) package

Highly-integrated multi-channel optical module having lens mounting...

Optoelectronic package and method of manufacturing the same

Package structure

Photonic semiconductor device and method of manufacture

Photonic integrated circuit and opto-electronic system comprising t...

Package assembly and manufacturing method thereof

Three-dimentional packaging method and package structure of photoni...

Package, optical device, and manufacturing method of package

Method and apparatus to add light sources to a print

Method and system for attaching optical fibers to warped photonic c...

Photonics fabrication process performance improvement

Optical module for endoscope, endoscope, and manufacturing method o...

Optoelectronic device

Optical module and method of producing the same

Low footprint optical interconnects

Display device and assembling method thereof

Optical based placement of an optical component using a pick and pl...

Photonic semiconductor device and method of manufacture

Optoelectronic structure

Optical assembly and manufacturing method thereof

Optical connector cable

Optical waveguide connection assembly and optical module comprising...

Patents Applicationslast 30 patents

OPTICAL MODULE

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

FIBER OPTIC ATTACHMENT APPARATUS AND ATTACHING AN OPTICAL FIBER TO...

Optical Device and Method of Manufacture

OPTICAL WAVEGUIDE DEVICE

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

LIGHT GUIDE PLATE UNIT AND GAMING MACHINE

OPTICAL MODULE AND OPTICAL CONNECTOR CABLE

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL DEVICE

INTEGRATED OPTICAL MODULE

OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR CONNECTING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE CONN...

OPTICAL DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL RECEPTION...

MANAGING TEMPERATURES IN INTEGRATED CIRCUITS

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

TRANSISTOR-OUTLINE PACKAGE AND PREPARATION METHOD THEREOF, OPTICAL...

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

Photonic Semiconductor Device and Method of Manufacture

OPTICAL WAFER-LEVEL PACKAGE

INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...

SURFACE MOUNTABLE OPTOELECTRONIC DEVICE WITH SIDE WALLS INCLUDING S...

CONTAMINATION-SAFE OPTICAL COUPLING DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF