Adhesive bonding; Encapsulation with polymer material

Industry

CPC
G02B6/4239

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4239Adhesive bonding; Encapsulation with polymer material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method and application of optical interconnection module
- Patent number 12,235,498
- Issue date Feb 25, 2025
- Electronics and Telecommunications Research Institute
- Sae-Kyoung Kang
- G02 - OPTICS
Information Patent Grant
Light-emitting assembly for enhancing optical performance
- Patent number 12,230,228
- Issue date Feb 18, 2025
- Innolux Corporation
- Chung-Chun Kuo
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Fiber block alignment structure
- Patent number 12,189,196
- Issue date Jan 7, 2025
- POET Technologies, Inc.
- Suresh Venkatesan
- G02 - OPTICS
Information Patent Grant
Manufacturing optically accessible co-packaged optics
- Patent number 12,189,198
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- G02 - OPTICS
Information Patent Grant
Hydrophobic feature to control adhesive flow
- Patent number 12,130,482
- Issue date Oct 29, 2024
- Intel Corporation
- Bassam Ziadeh
- G02 - OPTICS
Information Patent Grant
Alignment method for optical waveguide element
- Patent number 12,111,504
- Issue date Oct 8, 2024
- Nippon Telegraph and Telephone Corporation
- Hiroshi Ishikawa
- G02 - OPTICS
Information Patent Grant
Optical signal transmission device
- Patent number 12,078,855
- Issue date Sep 3, 2024
- BLOVELIGHT (GUANGDONG) INTELLIGENT TECHNOLOGY CO., LTD.
- Dawei Guo
- G02 - OPTICS
Information Patent Grant
Self-aligned integrated lens on pillar
- Patent number 12,055,774
- Issue date Aug 6, 2024
- Mellanox Technologies, Ltd.
- Dimitrios Kalavrouziotis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 12,050,350
- Issue date Jul 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng You
- G02 - OPTICS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
LED light source and method of manufacturing the same
- Patent number 12,034,102
- Issue date Jul 9, 2024
- Nichia Corporation
- Munetsugu Ehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit (PIC) package
- Patent number 12,025,841
- Issue date Jul 2, 2024
- Lumentum Operations LLC
- Pavel Mamyshev
- G02 - OPTICS
Information Patent Grant
Highly-integrated multi-channel optical module having lens mounting...
- Patent number 12,021,563
- Issue date Jun 25, 2024
- Electronics and Telecommunications Research Institute
- Hae Chung Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optoelectronic package and method of manufacturing the same
- Patent number 11,982,853
- Issue date May 14, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei Lin
- G02 - OPTICS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit and opto-electronic system comprising t...
- Patent number 11,899,254
- Issue date Feb 13, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- G02 - OPTICS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimentional packaging method and package structure of photoni...
- Patent number 11,789,218
- Issue date Oct 17, 2023
- Hangzhou Guangzhiyuan Technology Co., Ltd.
- Yichen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, optical device, and manufacturing method of package
- Patent number 11,789,201
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- G02 - OPTICS
Information Patent Grant
Method and apparatus to add light sources to a print
- Patent number 11,784,281
- Issue date Oct 10, 2023
- Xerox Corporation
- David C. Craig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for attaching optical fibers to warped photonic c...
- Patent number 11,762,157
- Issue date Sep 19, 2023
- Intel Corporation
- Sufi Ahmed
- G02 - OPTICS
Information Patent Grant
Photonics fabrication process performance improvement
- Patent number 11,762,146
- Issue date Sep 19, 2023
- Analog Photonics LLC
- Michael Robert Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module for endoscope, endoscope, and manufacturing method o...
- Patent number 11,762,156
- Issue date Sep 19, 2023
- Olympus Corporation
- Takahide Miyawaki
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Optoelectronic device
- Patent number 11,740,416
- Issue date Aug 29, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- G02 - OPTICS
Information Patent Grant
Optical module and method of producing the same
- Patent number 11,733,467
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Yasushi Fujimura
- G02 - OPTICS
Information Patent Grant
Low footprint optical interconnects
- Patent number 11,726,274
- Issue date Aug 15, 2023
- WAVEFRONT RESEARCH, INC.
- Randall C. Veitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and assembling method thereof
- Patent number 11,715,433
- Issue date Aug 1, 2023
- Innolux Corporation
- Chung-Chun Kuo
- G02 - OPTICS
Information Patent Grant
Optical based placement of an optical component using a pick and pl...
- Patent number 11,693,195
- Issue date Jul 4, 2023
- OpenLight Photonics, Inc.
- Steven William Keck
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Publication number 20250110295
- Publication date Apr 3, 2025
- Intel Corporation
- Ziyin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS
- Publication number 20250102744
- Publication date Mar 27, 2025
- Intel Corporation
- Feifei Cheng
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250102748
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS FOR HANDLING AN OPTICAL DEVICE, METHOD FOR HAN...
- Publication number 20250085494
- Publication date Mar 13, 2025
- Applied Materials, Inc.
- Davide COLLA
- G02 - OPTICS
Information Patent Application
STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...
- Publication number 20250076596
- Publication date Mar 6, 2025
- Marvell Asia Pte Ltd.
- Pei-Keng Fu
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250052963
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan HUANG
- G02 - OPTICS
Information Patent Application
MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS
- Publication number 20250052965
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED...
- Publication number 20250044533
- Publication date Feb 6, 2025
- Intel Corporation
- Xavier F. Brun
- G02 - OPTICS
Information Patent Application
Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process
- Publication number 20250044534
- Publication date Feb 6, 2025
- Ayar Labs, Inc.
- Chong Zhang
- G02 - OPTICS
Information Patent Application
DETECTION OF OPTICAL MODULE MISALIGNMENT USING A LIGHT FREQUENCY RE...
- Publication number 20250012984
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250012985
- Publication date Jan 9, 2025
- Shinko Electric Industries Co., LTD.
- Kenji YANAGISAWA
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE INCLUDING A FIBER ALIGNMENT STRUCTURE
- Publication number 20250004218
- Publication date Jan 2, 2025
- PsiQuantum Corp.
- Eric DUDLEY
- G02 - OPTICS
Information Patent Application
STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...
- Publication number 20250004206
- Publication date Jan 2, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVI...
- Publication number 20250004220
- Publication date Jan 2, 2025
- Intel Corporation
- Sufi R. Ahmed
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW
- Publication number 20240402445
- Publication date Dec 5, 2024
- Intel Corporation
- Bassam ZIADEH
- G02 - OPTICS
Information Patent Application
FIBER OPTIC ATTACHMENT APPARATUS AND ATTACHING AN OPTICAL FIBER TO...
- Publication number 20240393550
- Publication date Nov 28, 2024
- Government of the United States of America, as Represented by the Secretary o...
- Jeffrey Taylor Chiles
- G02 - OPTICS
Information Patent Application
Optical Device and Method of Manufacture
- Publication number 20240393549
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE DEVICE
- Publication number 20240385366
- Publication date Nov 21, 2024
- Shinko Electric Industries Co., Ltd.
- Kazunao YAMAMOTO
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240369783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
LIGHT GUIDE PLATE UNIT AND GAMING MACHINE
- Publication number 20240345310
- Publication date Oct 17, 2024
- Omron Corporation
- Takahiro ONO
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL CONNECTOR CABLE
- Publication number 20240337797
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Kensaku SHIMADA
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...
- Publication number 20240329339
- Publication date Oct 3, 2024
- Intel Corporation
- Jeremy Ecton
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240329344
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240329340
- Publication date Oct 3, 2024
- TDK Corporation
- Kenji NAGASE
- G02 - OPTICS
Information Patent Application
INTEGRATED OPTICAL MODULE
- Publication number 20240319453
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Satoshi KAJIYA
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240302614
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
METHOD FOR CONNECTING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE CONN...
- Publication number 20240302610
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- JUNICHI KAMATANI
- G02 - OPTICS

Adhesive bonding; Encapsulation with polymer material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method and application of optical interconnection module

Light-emitting assembly for enhancing optical performance

Photonic semiconductor device and method of manufacture

Fiber block alignment structure

Manufacturing optically accessible co-packaged optics

Hydrophobic feature to control adhesive flow

Alignment method for optical waveguide element

Optical signal transmission device

Self-aligned integrated lens on pillar

Semiconductor package structure and method of manufacturing the same

Silicon groove architectures and manufacturing processes for passiv...

LED light source and method of manufacturing the same

Photonic integrated circuit (PIC) package

Highly-integrated multi-channel optical module having lens mounting...

Optoelectronic package and method of manufacturing the same

Package structure

Photonic semiconductor device and method of manufacture

Photonic integrated circuit and opto-electronic system comprising t...

Package assembly and manufacturing method thereof

Three-dimentional packaging method and package structure of photoni...

Package, optical device, and manufacturing method of package

Method and apparatus to add light sources to a print

Method and system for attaching optical fibers to warped photonic c...

Photonics fabrication process performance improvement

Optical module for endoscope, endoscope, and manufacturing method o...

Optoelectronic device

Optical module and method of producing the same

Low footprint optical interconnects

Display device and assembling method thereof

Optical based placement of an optical component using a pick and pl...

Patents Applicationslast 30 patents

POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE

TECHNOLOGIES FOR FIBER ARRAY UNIT LID DESIGNS

SEMICONDUCTOR PACKAGE

METHOD AND APPARATUS FOR HANDLING AN OPTICAL DEVICE, METHOD FOR HAN...

STRUCTURE AND METHOD FOR FASTENING OPTICAL FIBER CABLE TO SILICON P...

OPTICAL DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS

TECHNOLOGIES FOR OPTICAL INTERPOSER MATING WITH PHOTONIC INTEGRATED...

Direct Silicon-to-Silicon Bonding for Fiber-First Packaging Process

DETECTION OF OPTICAL MODULE MISALIGNMENT USING A LIGHT FREQUENCY RE...

OPTICAL MODULE

OPTICAL DEVICE INCLUDING A FIBER ALIGNMENT STRUCTURE

STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...

PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVI...

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

OPTICAL MODULE

HYDROPHOBIC FEATURE TO CONTROL ADHESIVE FLOW

FIBER OPTIC ATTACHMENT APPARATUS AND ATTACHING AN OPTICAL FIBER TO...

Optical Device and Method of Manufacture

OPTICAL WAVEGUIDE DEVICE

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

LIGHT GUIDE PLATE UNIT AND GAMING MACHINE

OPTICAL MODULE AND OPTICAL CONNECTOR CABLE

PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CO...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL DEVICE

INTEGRATED OPTICAL MODULE

OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR CONNECTING OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE CONN...