Adhesive element

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CPC
H04N2201/03191

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Parent Industries

HELECTRICITY H04Electric communication H04NPICTORIAL COMMUNICATION H04N2201/00Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof

Current Industry

H04N2201/03191Adhesive element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Camera module
- Patent number 9,531,933
- Issue date Dec 27, 2016
- LG Innotek Co., Ltd
- Hyun Ah Oh
- G02 - OPTICS
Information Patent Grant
Camera module
- Patent number 9,197,796
- Issue date Nov 24, 2015
- LG Innotek Co., Ltd
- Hyun Ah Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor and image forming apparatus
- Patent number 8,085,449
- Issue date Dec 27, 2011
- Toshiba Design & Manufacturing Service Corporation
- Miyoshi Yoshimura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Contact-type image sensor having an adhesive elastic layer therein
- Patent number 5,517,329
- Issue date May 14, 1996
- Canon Kabushiki Kaisha
- Haruo Ishizuka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE
- Publication number 20160057327
- Publication date Feb 25, 2016
- LG Innotek Co., Ltd.
- Hyun Ah OH
- G02 - OPTICS
Information Patent Application
CAMERA MODULE
- Publication number 20130128108
- Publication date May 23, 2013
- LG Innotek Co., Ltd.
- Hyun Ah OH
- G02 - OPTICS
Information Patent Application
IMAGE SENSOR AND IMAGE FORMING APPARATUS
- Publication number 20080135759
- Publication date Jun 12, 2008
- Miyoshi Yoshimura
- H04 - ELECTRIC COMMUNICATION TECHNIQUE