After-treatment

Industry

CPC
H01L21/3105

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3105After-treatment

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing gate structure and method of manufacturing...
- Patent number 12,170,280
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment agent and method for manufacturing surface treatm...
- Patent number 12,163,087
- Issue date Dec 10, 2024
- Central Glass Company, Limited
- Yuki Fukui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure with air gap and method sealing the air gap
- Patent number 12,165,912
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck assembly, planarization process, apparatus and method of manu...
- Patent number 12,165,903
- Issue date Dec 10, 2024
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor element
- Patent number 12,163,058
- Issue date Dec 10, 2024
- Jae-Wan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etch process using plasma in conjunction with a rapid...
- Patent number 12,159,789
- Issue date Dec 3, 2024
- BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Training a machine learning system to detect an excursion of a CMP...
- Patent number 12,148,149
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etching composition, method for etching insulating film of semicond...
- Patent number 12,146,092
- Issue date Nov 19, 2024
- SK Innovation Co., Ltd.
- Cheol Woo Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor element
- Patent number 12,146,076
- Issue date Nov 19, 2024
- Jae-Wan Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming source/drain contacts
- Patent number 12,142,663
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad, preparation method thereof and method for preparing...
- Patent number 12,138,738
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Jae In Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with gate and res...
- Patent number 12,136,572
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chai-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative-capacitance and ferroelectric field-effect transistor (NCF...
- Patent number 12,136,659
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,136,662
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,132,050
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with dielectric stressor
- Patent number 12,132,115
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shi-Ning Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,125,703
- Issue date Oct 22, 2024
- Renesas Electronics Corporation
- Shibun Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,125,783
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced trap defect and method of forming...
- Patent number 12,119,389
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin-type field effect transistor and me...
- Patent number 12,119,351
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Dong-Il Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-stopping polishing composition and method for high topological...
- Patent number 12,116,502
- Issue date Oct 15, 2024
- CMC MATERIALS LLC
- Juyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for semiconductor processing and method of fabricating...
- Patent number 12,110,421
- Issue date Oct 8, 2024
- SK ENPULSE CO., LTD.
- Seung Chul Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid isolation regions having upper and lower portions with seams
- Patent number 12,112,988
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing Composition For Silicon...
- Publication number 20240417594
- Publication date Dec 19, 2024
- VERSUM MATERIALS US, LLC
- Maitland Graham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240413005
- Publication date Dec 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Jen-I LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY
- Publication number 20240413221
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CRACK THRESHOLD PLANARIZING COATINGS AND PROCESSES TO FILL WID...
- Publication number 20240400858
- Publication date Dec 5, 2024
- Honeywell International Inc.
- Hong Min Huang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...
- Publication number 20240400861
- Publication date Dec 5, 2024
- VERSUM MATERIALS US, LLC
- Gregor Larbig
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
- Publication number 20240392214
- Publication date Nov 28, 2024
- FUJIFILM CORPORATION
- Naotsugu MURO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Isolation Structures Of Semiconductor Devices
- Publication number 20240395855
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pinyen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing For Shallow Trench Isol...
- Publication number 20240395558
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Hongjun Zhou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME
- Publication number 20240395910
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240395598
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES
- Publication number 20240387699
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE
- Publication number 20240387704
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Yang Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR
- Publication number 20240387740
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shi-Ning JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...
- Publication number 20240387187
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Chun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...
- Publication number 20240387188
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240379814
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379540
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Fins With Different Dielectric Constants and Sizes in Di...
- Publication number 20240379452
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...
- Publication number 20240378718
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Sidney P. Huey
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH GATE AND RES...
- Publication number 20240371698
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Chai-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING...
- Publication number 20240371974
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN HSIUNG TSAI
- H01 - BASIC ELECTRIC ELEMENTS

After-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective passivation and selective deposition

Method of manufacturing gate structure and method of manufacturing...

Embedded metal insulator metal structure

Surface treatment agent and method for manufacturing surface treatm...

Semiconductor structure with air gap and method sealing the air gap

Chuck assembly, planarization process, apparatus and method of manu...

Semiconductor element

Atomic layer etch process using plasma in conjunction with a rapid...

Chemical direct pattern plating method

Training a machine learning system to detect an excursion of a CMP...

Etching composition, method for etching insulating film of semicond...

Semiconductor element

Multi-chip integrated fan-out package

Method for forming source/drain contacts

Transistor structures having conductive structures along pillars of...

Semiconductor structure and manufacturing method thereof

Polishing pad, preparation method thereof and method for preparing...

Integrated fan-out package and the methods of manufacturing

Method for forming semiconductor device structure with gate and res...

Negative-capacitance and ferroelectric field-effect transistor (NCF...

Methods of forming semiconductor devices

Semiconductor structure cutting process and structures formed thereby

Semiconductor device structure with dielectric stressor

Method of manufacturing semiconductor device

Interconnect structure and method for forming the same

Semiconductor device with reduced trap defect and method of forming...

Semiconductor device having fin-type field effect transistor and me...

Self-stopping polishing composition and method for high topological...

Composition for semiconductor processing and method of fabricating...

Hybrid isolation regions having upper and lower portions with seams

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chemical Mechanical Planarization Polishing Composition For Silicon...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

INTEGRATED CIRCUIT DEVICE WITH IMPROVED RELIABILITY

HIGH CRACK THRESHOLD PLANARIZING COATINGS AND PROCESSES TO FILL WID...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

Triazole- And/Or Triazolium-Based Polymers And Copolymers As Additi...

COMPOSITION AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

Isolation Structures Of Semiconductor Devices

Chemical Mechanical Planarization Polishing For Shallow Trench Isol...

FINFET WITH DUMMY FINS AND METHODS OF MAKING THE SAME

Semiconductor Device and Method

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

METHODS OF FORMING SEMICONDUCTOR DEVICES

METHOD OF GAP FILLING FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC STRESSOR

METHODS FOR REDUCING SCRATCH DEFECTS IN CHEMICAL MECHANICAL PLANARI...

AMBIENT CONTROLLED TWO-STEP THERMAL TREATMENT FOR SPIN-ON COATING L...

CMP SAFE ALIGNMENT MARK

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

Dielectric Fins With Different Dielectric Constants and Sizes in Di...

DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE...

METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH GATE AND RES...

SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING...