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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/3105After-treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing solution
- Patent number 12,365,814
- Issue date Jul 22, 2025
- ANJI MICROELCTRONICS (SHANGHAI) CO., LTD
- Shoutian Li
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Isolation structures of semiconductor devices
- Patent number 12,363,962
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pinyen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration methods to fabricate internal spacers for nanowire devices
- Patent number 12,363,967
- Issue date Jul 15, 2025
- Sony Group Corporation
- Seiyon Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Polishing pad and method for preparing semiconductor device using t...
- Patent number 12,362,232
- Issue date Jul 15, 2025
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 12,363,882
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for splitting semiconductor wafers
- Patent number 12,356,700
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Christian Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor lasers and processes for the planarization of semicon...
- Patent number 12,355,212
- Issue date Jul 8, 2025
- MACOM Technology Solutions Holdings, Inc.
- Ali Badar Alamin Dow
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,347,776
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical device having a protrusion source
- Patent number 12,349,435
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- De-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate cut and structure thereof
- Patent number 12,347,690
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising steps
- Patent number 12,341,112
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a surface for direct-bonding
- Patent number 12,341,018
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-oxidation layer to prevent dielectric loss from planarization...
- Patent number 12,341,019
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride inhibitors for high selectivity of TiN—SiN CMP applications
- Patent number 12,338,369
- Issue date Jun 24, 2025
- CMC MATERIALS LLC
- Chih-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,342,615
- Issue date Jun 24, 2025
- Sony Group Corporation
- Shinya Yamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphite and method forming same
- Patent number 12,334,397
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,334,433
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing particles or photoresist on subst...
- Patent number 12,334,367
- Issue date Jun 17, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superstrate including a body and layers and methods of forming and...
- Patent number 12,325,046
- Issue date Jun 10, 2025
- Canon Kabushiki Kaisha
- Niyaz Khusnatdinov
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Contact with a silicide region
- Patent number 12,328,890
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve profile control during selective etching of silic...
- Patent number 12,327,732
- Issue date Jun 10, 2025
- American Air Liquide, Inc.
- Xiangyu Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with contracted isolation feature
- Patent number 12,324,222
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsing plasma treatment for film densification
- Patent number 12,322,573
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Rui Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS INCLUDING A SUBSTRATE CHUCK, A DISPENSER, AND A PLANARIZA...
- Publication number 20250239471
- Publication date Jul 24, 2025
- Canon Kabushiki Kaisha
- Ozkan Ozturk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR
- Publication number 20250240981
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Jyun-Ying LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS
- Publication number 20250239445
- Publication date Jul 24, 2025
- Applied Materials, Inc.
- Ning Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...
- Publication number 20250232981
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...
- Publication number 20250226261
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD
- Publication number 20250226232
- Publication date Jul 10, 2025
- Canon Kabushiki Kaisha
- YU NOMURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TEMPLATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250216774
- Publication date Jul 3, 2025
- KIOXIA Corporation
- Takeharu MOTOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SHAPING A SURFACE, SHAPING SYSTEM, AND METHOD OF MANUFACT...
- Publication number 20250216775
- Publication date Jul 3, 2025
- Canon Kabushiki Kaisha
- Seth J. Bamesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...
- Publication number 20250215296
- Publication date Jul 3, 2025
- Merck Patent GmbH
- Eric JACQUINOT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITIONS AND METHODS FOR TUNGSTEN ETCHING INHIBITION
- Publication number 20250215266
- Publication date Jul 3, 2025
- BASF SE
- Ching Hsun CHAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20250221012
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Tse HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20250210427
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING
- Publication number 20250212413
- Publication date Jun 26, 2025
- Micron Technology, Inc.
- Yun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210559
- Publication date Jun 26, 2025
- Innolux Corporation
- Kuo-Shun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...
- Publication number 20250204019
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250204039
- Publication date Jun 19, 2025
- UNITED MICROELECTRONICS CORP.
- Chun-Ya Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...
- Publication number 20250197676
- Publication date Jun 19, 2025
- AGC Inc.
- Hideki NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING ELECTRONIC CHIPS
- Publication number 20250191977
- Publication date Jun 12, 2025
- STMicroelectronics International N.V.
- Gregoire DELACOURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STI REGION
- Publication number 20250194085
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...
- Publication number 20250187141
- Publication date Jun 12, 2025
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Structure
- Publication number 20250192026
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices With Backside Air Gap Dielectric
- Publication number 20250185348
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For FinFET Fabrication And Structure Thereof
- Publication number 20250185346
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ENABLING CHEMICAL MECHANICAL POLISHING AND BONDING OF A...
- Publication number 20250183037
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Maria Gorchichko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stable Chemical Mechanical Planarization Polishing Compositions And...
- Publication number 20250171658
- Publication date May 29, 2025
- VERSUM MATERIALS US, LLC
- Maitland Graham
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250176182
- Publication date May 29, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang XU
- H01 - BASIC ELECTRIC ELEMENTS

After-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor device

Chemical mechanical polishing solution

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor device and method of manufacturing the same

Conformal deposition of silicon carbide films using heterogeneous p...

Isolation structures of semiconductor devices

Integration methods to fabricate internal spacers for nanowire devices

Polishing pad and method for preparing semiconductor device using t...

Method of manufacturing semiconductor structure and semiconductor s...

Method for splitting semiconductor wafers

Semiconductor lasers and processes for the planarization of semicon...

Integrated chip with graphene based interconnect

Vertical device having a protrusion source

Method for metal gate cut and structure thereof

Semiconductor devices comprising steps

Method for preparing a surface for direct-bonding

Anti-oxidation layer to prevent dielectric loss from planarization...

Method for forming a semiconductor structure by diffusing manganese...

Nitride inhibitors for high selectivity of TiN—SiN CMP applications

Semiconductor device and method of manufacturing the same

Interconnect structure including graphite and method forming same

Package with tilted interface between device die and encapsulating...

Semiconductor device and method of fabricating the same

Method and apparatus for removing particles or photoresist on subst...

Superstrate including a body and layers and methods of forming and...

Contact with a silicide region

Method to improve profile control during selective etching of silic...

Semiconductor device with contracted isolation feature

Method of fabricating Fin-type field-effect transistor device havin...

Pulsing plasma treatment for film densification

Patents Applicationslast 30 patents

APPARATUS INCLUDING A SUBSTRATE CHUCK, A DISPENSER, AND A PLANARIZA...

LOW WARPAGE HIGH DENSITY TRENCH CAPACITOR

METHOD AND APPARATUS FOR SELECTIVE DEPOSITION OF DIELECTRIC FILMS

HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...

GALLIUM NITRIDE DEVICE WITH FIELD PLATE STRUCTURE AND METHOD OF MAN...

IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD

TEMPLATE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF SHAPING A SURFACE, SHAPING SYSTEM, AND METHOD OF MANUFACT...

NEGATIVELY CHARGED SILICA PARTICLES, METHOD OF PRODUCING SUCH PARTI...

COMPOSITIONS AND METHODS FOR TUNGSTEN ETCHING INHIBITION

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER SEAL RING

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

ELECTRONIC DEVICES, RELATED SYSTEMS, AND METHODS OF FORMING

MULTI-LAYER LINE STRUCTURE

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

FLOWABLE CHEMICAL VAPOR DEPOSITION (FCVD) USING MULTI-STEP ANNEAL T...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

POLISHING AGENT, ADDITIVE SOLUTION FOR POLISHING AGENT, AND POLISHI...

METHOD OF FABRICATING ELECTRONIC CHIPS

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE HAVING STI REGION

APPARATUS AND METHOD FOR IN-SITU CHEMICAL SEPARATION AND RECIRCULAT...

Metal-Insulator-Metal Structure

Semiconductor Devices With Backside Air Gap Dielectric

Method For FinFET Fabrication And Structure Thereof

METHODS FOR ENABLING CHEMICAL MECHANICAL POLISHING AND BONDING OF A...

Stable Chemical Mechanical Planarization Polishing Compositions And...

WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE