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H01L21/3105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3105After-treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,258,460
- Issue date Mar 25, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,255,164
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,249,544
- Issue date Mar 11, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing the same and electron...
- Patent number 12,245,442
- Issue date Mar 4, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hard mask removal without damaging top epitaxial layer
- Patent number 12,243,770
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fin end spacer dummy gate and method of m...
- Patent number 12,243,930
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,243,744
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure using nitrogen-...
- Patent number 12,243,769
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer bonding
- Patent number 12,234,145
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having STI region
- Patent number 12,238,924
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Kunihiro Tsubomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for increasing germanium concentration of surfaces of a sil...
- Patent number 12,237,404
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including middle-of-line (MOL) capacitance...
- Patent number 12,237,368
- Issue date Feb 25, 2025
- Adeia Semiconductor Solutions LLC
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,237,402
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for silicon nitride CMP
- Patent number 12,227,673
- Issue date Feb 18, 2025
- CMC MATERIALS LLC
- Fernando Hung Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective organic material removal
- Patent number 12,230,506
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for FinFet fabrication and structure thereof
- Patent number 12,224,210
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside air gap dielectric
- Patent number 12,224,212
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for smoothing of arbitrary surfaces
- Patent number 12,217,968
- Issue date Feb 4, 2025
- California Institute of Technology
- Harold Frank Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP
- Publication number 20250105054
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photoresist and Method
- Publication number 20250102916
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE
- Publication number 20250105017
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Hsun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR GLOBAL PLANARIZATION
- Publication number 20250096005
- Publication date Mar 20, 2025
- Brewer Science, Inc.
- Jinhua Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250096155
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chieh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096033
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE...
- Publication number 20250084281
- Publication date Mar 13, 2025
- Fujimi Incorporated
- Shogo ONISHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLURRY AND POLISHING METHOD
- Publication number 20250084294
- Publication date Mar 13, 2025
- Resonac Corporation
- Satoyuki NOMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...
- Publication number 20250079336
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Opaque Thermal Layer for Silicon Carbide Substrates
- Publication number 20250079186
- Publication date Mar 6, 2025
- Yi ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...
- Publication number 20250069938
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- SETH J. BAMESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHOD AND METHOD OF MANUFACTURING ARTICLE
- Publication number 20250069892
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- KENJI YAEGASHI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250069891
- Publication date Feb 27, 2025
- Kokusai Electric Corporation
- Motomu DEGAI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF
- Publication number 20250059401
- Publication date Feb 20, 2025
- ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.
- Pengyu Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...
- Publication number 20250062133
- Publication date Feb 20, 2025
- Mattson Technology, Inc.
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY
- Publication number 20250054769
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Hsu-Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20250026962
- Publication date Jan 23, 2025
- SOULBRAIN CO., LTD
- Jae-Wan PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20250019569
- Publication date Jan 16, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...
- Publication number 20250018526
- Publication date Jan 16, 2025
- SK enpulse Co., Ltd.
- Jae In AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...
- Publication number 20250019567
- Publication date Jan 16, 2025
- Yi Guo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...
- Publication number 20250015098
- Publication date Jan 9, 2025
- SAMSUNG DISPLAY CO., LTD.
- Joon-Hwa BAE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...
- Publication number 20250014940
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS

After-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polishing pad and method of fabricating semiconductor device using...

Info structure with copper pillar having reversed profile

Multi-layer line structure

CMP safe alignment mark

Structure and method for isolation of bit-line drivers for a three-...

Semiconductor device, method of manufacturing the same and electron...

Semiconductor device with electromagnetic interference film and met...

Semiconductor device, method of manufacturing the same and electron...

Hard mask removal without damaging top epitaxial layer

Semiconductor device with fin end spacer dummy gate and method of m...

Method for forming semiconductor structure

Method for preparing semiconductor device structure using nitrogen-...

Methods for wafer bonding

Semiconductor device having STI region

Methods for increasing germanium concentration of surfaces of a sil...

Semiconductor structures including middle-of-line (MOL) capacitance...

Methods of forming semiconductor devices

Word line structure of three-dimensional memory device

Composition and method for silicon nitride CMP

Metal-insulator-metal structure

Area selective organic material removal

Method for FinFet fabrication and structure thereof

Semiconductor devices with backside air gap dielectric

Method of manufacturing semiconductor devices with multiple silicid...

Deep trench intersections

Integrated chip with graphene based interconnect

Atomic layer etching for smoothing of arbitrary surfaces

Semiconductor structure cutting process and structures formed thereby

Hybrid channel semiconductor device and method

Method of preparing semiconductor structure having low dielectric c...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD SEALING THE AIR GAP

Photoresist and Method

METHOD OF MANUFACTURING MEMORY DEVICE

METHODS FOR GLOBAL PLANARIZATION

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POLISHING COMPOSITION AND METHOD FOR POLISHING SUBSTRATE USING THE...

SLURRY AND POLISHING METHOD

STRESS AND WARPAGE MODULATING STRUCTURE FOR MULTI-STACKED WAFER AND...

Opaque Thermal Layer for Silicon Carbide Substrates

CHUCK ASSEMBLY, PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANU...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

PLANARIZATION METHOD AND METHOD OF MANUFACTURING ARTICLE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF

Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY

METHOD FOR REDUCING WAFER EDGE DEFECTS

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...

Surface Profile Control Of Passivation Layers In Integrated Circuit...

METHOD OF PREVENTING PATTERN COLLAPSE

POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...