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H01L21/3105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3105After-treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for silicon nitride CMP
- Patent number 12,227,673
- Issue date Feb 18, 2025
- CMC MATERIALS LLC
- Fernando Hung Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 12,230,566
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area selective organic material removal
- Patent number 12,230,506
- Issue date Feb 18, 2025
- ASM IP Holding B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for FinFet fabrication and structure thereof
- Patent number 12,224,210
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside air gap dielectric
- Patent number 12,224,212
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench intersections
- Patent number 12,218,188
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Binghua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip with graphene based interconnect
- Patent number 12,218,060
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for smoothing of arbitrary surfaces
- Patent number 12,217,968
- Issue date Feb 4, 2025
- California Institute of Technology
- Harold Frank Greer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid channel semiconductor device and method
- Patent number 12,211,900
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure and manufacturing method thereof
- Patent number 12,205,822
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Cheng Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist and method
- Patent number 12,197,128
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Liang-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method for forminginsulating structure of high electr...
- Patent number 12,199,175
- Issue date Jan 14, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar semiconductor device having doped sub-fin region and met...
- Patent number 12,191,308
- Issue date Jan 7, 2025
- Tahoe Research, LTD.
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective molecular layer deposition of organic and hybrid organic-...
- Patent number 12,191,139
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Tapash Chakraborty
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having deep trench structure and method of man...
- Patent number 12,183,639
- Issue date Dec 31, 2024
- SK keyfoundry Inc.
- Yang Beom Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for isolation of bit-line drivers for a three-...
- Patent number 12,183,698
- Issue date Dec 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device by driving hydrogen into a...
- Patent number 12,183,581
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hongfa Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,183,586
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry and polishing method
- Patent number 12,173,219
- Issue date Dec 24, 2024
- Resonac Corporation
- Satoyuki Nomura
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
High pressure oxidation of metal films
- Patent number 12,173,413
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Amrita B. Mullick
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a semiconductor using slurry
- Patent number 12,176,217
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Hung Liao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,176,216
- Issue date Dec 24, 2024
- Kokusai Electric Corporation
- Motomu Degai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF
- Publication number 20250059401
- Publication date Feb 20, 2025
- ANJI MICROELECTRONICS (SHANGHAI) CO., LTD.
- Pengyu Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...
- Publication number 20250062133
- Publication date Feb 20, 2025
- Mattson Technology, Inc.
- Shawming Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY
- Publication number 20250054769
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Hsu-Cheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WAFER EDGE DEFECTS
- Publication number 20250054807
- Publication date Feb 13, 2025
- WINBOND ELECTRONICS CORP.
- Cheng-Hsiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20250026962
- Publication date Jan 23, 2025
- SOULBRAIN CO., LTD
- Jae-Wan PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
- Publication number 20250019569
- Publication date Jan 16, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Eric Turner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...
- Publication number 20250018526
- Publication date Jan 16, 2025
- SK enpulse Co., Ltd.
- Jae In AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...
- Publication number 20250019567
- Publication date Jan 16, 2025
- Yi Guo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250022799
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yong Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...
- Publication number 20250015098
- Publication date Jan 9, 2025
- SAMSUNG DISPLAY CO., LTD.
- Joon-Hwa BAE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...
- Publication number 20250014940
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...
- Publication number 20250014899
- Publication date Jan 9, 2025
- Merck Patent GmbH
- Takashi SEKITO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LE...
- Publication number 20250006505
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-K ISOLATION OF FIN STRUCTURES
- Publication number 20240429312
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...
- Publication number 20240429060
- Publication date Dec 26, 2024
- Canon Kabushiki Kaisha
- Steven C. Shackleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20240429057
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PROCESSED SUBSTRATE
- Publication number 20240429061
- Publication date Dec 26, 2024
- MASANOBU HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOL...
- Publication number 20240425536
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING FILM
- Publication number 20240429039
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Eun Hyea Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY, SCREENING METHOD, AND POLISHING METHOD
- Publication number 20240425737
- Publication date Dec 26, 2024
- Resonac Corporation
- Satoyuki NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CARBON PLUG FORMATION
- Publication number 20240420927
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Daniela ANJOS RIGSBY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240420961
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical Mechanical Planarization Polishing Composition For Silicon...
- Publication number 20240417594
- Publication date Dec 19, 2024
- VERSUM MATERIALS US, LLC
- Maitland Graham
- H01 - BASIC ELECTRIC ELEMENTS

After-treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Word line structure of three-dimensional memory device

Composition and method for silicon nitride CMP

Metal-insulator-metal structure

Area selective organic material removal

Method for FinFet fabrication and structure thereof

Semiconductor devices with backside air gap dielectric

Method of manufacturing semiconductor devices with multiple silicid...

Deep trench intersections

Integrated chip with graphene based interconnect

Atomic layer etching for smoothing of arbitrary surfaces

Semiconductor structure cutting process and structures formed thereby

Hybrid channel semiconductor device and method

Method of preparing semiconductor structure having low dielectric c...

Nanostructure and manufacturing method thereof

Semiconductor device and a manufacturing method thereof

Photoresist and method

Manufacturing process for semiconductor optical device for lidar se...

Manufacturing method for forminginsulating structure of high electr...

Non-planar semiconductor device having doped sub-fin region and met...

Selective molecular layer deposition of organic and hybrid organic-...

Methods for copper doped hybrid metallization for line and via

Semiconductor device having deep trench structure and method of man...

Structure and method for isolation of bit-line drivers for a three-...

Method of forming a semiconductor device by driving hydrogen into a...

Method for forming semiconductor structure

Slurry and polishing method

High pressure oxidation of metal films

Method for manufacturing a semiconductor using slurry

Method of manufacturing semiconductor device, substrate processing...

Selective passivation and selective deposition

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING SOLUTION AND USAGE METHOD THEREOF

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid...

METHOD FOR REDUCING VARIATIONS IN MASK TOPOGRAPHY

METHOD FOR REDUCING WAFER EDGE DEFECTS

COMPOSITION FOR ETCHING AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

POLISHING COMPOSITIONS AND METHODS OF USE THEREOF

POLISHING PAD, PREPARATION METHOD THEREOF AND METHOD FOR PREPARING...

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD FOR PREVENTING...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

Surface Profile Control Of Passivation Layers In Integrated Circuit...

METHOD OF PREVENTING PATTERN COLLAPSE

POLISHING SLURRY, METHOD FOR MANUFACTURING A DISPLAY DEVICE USING T...

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE USING NITROGEN-...

METHOD FOR REMOVING UPPER PART OF SACRIFICIAL LAYER, AND SACRIFICIA...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE INCLUDING DEVICES WITH DIFFERENT CHANNEL LE...

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

HIGH-K ISOLATION OF FIN STRUCTURES

PLANARIZATION SYSTEM, PLANARIZING METHOD, AND METHOD OF MANUFACTURI...

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

METHOD FOR MANUFACTURING PROCESSED SUBSTRATE

HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOL...

METHOD OF DEPOSITING FILM

SLURRY, SCREENING METHOD, AND POLISHING METHOD

SYSTEM AND METHOD FOR CARBON PLUG FORMATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Chemical Mechanical Planarization Polishing Composition For Silicon...