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Industry

CPC
H01L21/321

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/321After treatment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment liquid for semiconductor wafers
- Patent number 12,195,658
- Issue date Jan 14, 2025
- Tokuyama Corporation
- Yuki Kikkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct-bonded optoelectronic devices
- Patent number 12,199,082
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atmospheric plasma in wafer processing system optimization
- Patent number 12,198,935
- Issue date Jan 14, 2025
- Axus Technology, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device including gate electrode for applying tensile...
- Patent number 12,198,987
- Issue date Jan 14, 2025
- Renesas Electronics Corporation
- Hirokazu Sayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,189,284
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,191,143
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested and non-nested SEI messages in video bitstreams
- Patent number 12,184,899
- Issue date Dec 31, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure including complemen...
- Patent number 12,183,585
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide mandrels in patterning
- Patent number 12,183,589
- Issue date Dec 31, 2024
- Lam Research Corporation
- Jengyi Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact with air spacer
- Patent number 12,176,400
- Issue date Dec 24, 2024
- TAIWAN SEMINCODCUTOR MANUFACTURING COMPANY, LTD.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device forming method and substrate processing apparatus
- Patent number 12,176,219
- Issue date Dec 24, 2024
- SCREEN Holdings Co., Ltd.
- Eiji Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier head membrane with regions of different roughness
- Patent number 12,172,264
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Young J. Paik
- B24 - GRINDING POLISHING
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,174,541
- Issue date Dec 24, 2024
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Formation and in-situ etching processes for metal layers
- Patent number 12,170,202
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage MOSFET device with improved breakdown voltage
- Patent number 12,170,329
- Issue date Dec 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Anupam Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,170,197
- Issue date Dec 17, 2024
- ASM IP Holding B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for cleaning high aspect ratio structures
- Patent number 12,170,196
- Issue date Dec 17, 2024
- Applied Materials, Inc.
- Schubert S. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal lines
- Patent number 12,170,268
- Issue date Dec 17, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for advanced ion control for etching processes
- Patent number 12,165,872
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor mask reshaping using a sacrificial layer
- Patent number 12,165,878
- Issue date Dec 10, 2024
- Lam Research Corporation
- Zhongkui Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Tungsten Chemical Mechanical Polishing Slurries
- Publication number 20250019568
- Publication date Jan 16, 2025
- VERSUM MATERIALS US, LLC
- MATTHIAS STENDER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS
- Publication number 20250022870
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250022719
- Publication date Jan 16, 2025
- Hitachi High-Tech Corporation
- Thi-Thuy-Nga NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...
- Publication number 20250020998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Kyungoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250022753
- Publication date Jan 16, 2025
- Kokusai Electric Corporation
- Masanori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...
- Publication number 20250014911
- Publication date Jan 9, 2025
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20250011623
- Publication date Jan 9, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250011624
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Hyune Jea LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250014944
- Publication date Jan 9, 2025
- SCREEN Holdings Co., Ltd.
- Kana TAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...
- Publication number 20250011650
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Cheol HAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR WITH CHANNEL-SYMMETRIC GATE
- Publication number 20250006810
- Publication date Jan 2, 2025
- Intel Corporation
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING
- Publication number 20250006518
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Shiyu YUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Publication number 20250001547
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...
- Publication number 20240429053
- Publication date Dec 26, 2024
- Silicon Laboratories Inc.
- Jiye Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Feature Through Heterogeneous Stacked Film and Methods of M...
- Publication number 20240429090
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jhen Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...
- Publication number 20240431110
- Publication date Dec 26, 2024
- Lodestar Licensing Group LLC
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...
- Publication number 20240425754
- Publication date Dec 26, 2024
- FUJIFILM CORPORATION
- Yuta SHIGENOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ETCHING WITH REDUCED TILT ANGLE
- Publication number 20240429064
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...
- Publication number 20240425723
- Publication date Dec 26, 2024
- VERSUM MATERIALS US, LLC
- XIAOBO SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
- Publication number 20240417595
- Publication date Dec 19, 2024
- FUJIMI INCORPORATED
- Tzu-Chun TSENG
- C01 - INORGANIC CHEMISTRY
Information Patent Application
MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME
- Publication number 20240417620
- Publication date Dec 19, 2024
- YCCHEM CO., LTD.
- Jun Han KIM
- H01 - BASIC ELECTRIC ELEMENTS

After treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a manufacturing method thereof

Treatment liquid for semiconductor wafers

Method of direct-bonded optoelectronic devices

Atmospheric plasma in wafer processing system optimization

Semiconductor device including gate electrode for applying tensile...

Etch method for opening a source line in flash memory

Method for forming semiconductor device

Semiconductor device and method for forming the same

Semiconductor device and manufacturing method thereof

Method for forming and patterning a layer and/or substrate

Nested and non-nested SEI messages in video bitstreams

Wet etching method

Remote source pulsing with advanced pulse control

Manufacturing method of semiconductor structure including complemen...

Tin oxide mandrels in patterning

Bottom lateral expansion of contact plugs through implantation

Backside contact with air spacer

Semiconductor device forming method and substrate processing apparatus

Metal oxide composite as etch stop layer

Carrier head membrane with regions of different roughness

Trench capacitor profile to decrease substrate warpage

Composition for forming silicon-containing resist underlayer film a...

Formation and in-situ etching processes for metal layers

High voltage MOSFET device with improved breakdown voltage

Selective passivation and selective deposition

Method of processing substrate, method of manufacturing semiconduct...

Methods and systems for cleaning high aspect ratio structures

Embedded metal lines

Methods and systems for advanced ion control for etching processes

Semiconductor mask reshaping using a sacrificial layer

Patents Applicationslast 30 patents

Tungsten Chemical Mechanical Polishing Slurries

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

SMALL DUMMY POLY PATTERN INSERTION IN SMALL BORDER REGIONS

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

ETCHING METHOD

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

METHOD OF PREVENTING PATTERN COLLAPSE

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

PAD-IN-A-BOTTLE AND SINGLE PLATEN CHEMICAL MECHANICAL-PLANARIZATION...

Composition For Forming Organic Film, Method For Forming Organic Fi...

POLISHING SLURRY, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SUBSTRATE PROCESSING METHOD

ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

TRANSISTOR WITH CHANNEL-SYMMETRIC GATE

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

BOTTOM ETCH PROCESS FOR CONTACT PLUG ANCHORING

FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS

METHOD FOR REDUCING CRITICAL DIMENSION OF PATTERNS GENERATED USING...

Contact Feature Through Heterogeneous Stacked Film and Methods of M...

BLOCK-ON-BLOCK MEMORY ARRAY ARCHITECTURE USING BI-DIRECTIONAL STAIR...

COMPOSITION FOR MANUFACTURING SEMICONDUCTOR, METHOD FOR TREATING OB...

METHOD OF PATTERNING ELEMENTAL METALS

METAL ETCHING WITH REDUCED TILT ANGLE

PAD-IN-A-BOTTLE CHEMICAL MECHANICAL PLANARIZATION POLISHING WITH CO...

POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME

MOLYBDENUM FILM ETCHANT COMPOSITION AND ETCHING METHOD USING SAME