Ag as the principal constituent

Industry

CPC
B23K35/3006

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/3006Ag as the principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Brazing ribbon and method for manufacturing same
- Patent number 12,134,145
- Issue date Nov 5, 2024
- AMOGREENTECH CO., LTD.
- Sungbaek Dan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Lead-free solder alloy composition suitable for use in high-tempera...
- Patent number 12,103,114
- Issue date Oct 1, 2024
- KYUNG DONG MTEC CO., LTD.
- Heung Rak Sohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,091,729
- Issue date Sep 17, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing process and device for preforms intended for brazing...
- Patent number 12,048,971
- Issue date Jul 30, 2024
- ISP System
- Paul Sauvageot
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite solder balls metallised on the surface and calibrated for...
- Patent number 12,030,138
- Issue date Jul 9, 2024
- LIPCO INDUSTRIE
- Constantin Iacob
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate, solder system, and...
- Patent number 11,945,054
- Issue date Apr 2, 2024
- Rogers Germany GmbH
- Karsten Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable interconnects for flexible electronic surfaces
- Patent number 11,830,640
- Issue date Nov 28, 2023
- Alpha Assembly Solutions, Inc.
- Narahari Pujari
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Medical device including a solderable linear elastic nickel-titaniu...
- Patent number 11,806,488
- Issue date Nov 7, 2023
- Abbott Cardiovascular Systems, Inc.
- Raleigh A. Purtzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particle aggregates, method for producing same, paste-like me...
- Patent number 11,801,556
- Issue date Oct 31, 2023
- Mitsubishi Materials Corporation
- Tomohiko Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 11,745,294
- Issue date Sep 5, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazed electrode for plasma cutting torch
- Patent number 11,738,410
- Issue date Aug 29, 2023
- Lincoln Global, Inc.
- Praveen K. Namburu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for filling a void
- Patent number 11,685,977
- Issue date Jun 27, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing semiconductor having double-sided substrate
- Patent number 11,631,627
- Issue date Apr 18, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag alloy bonding wire for semiconductor device
- Patent number 11,612,966
- Issue date Mar 28, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for engineering at ambient co...
- Patent number 11,584,978
- Issue date Feb 21, 2023
- Iowa State University Research Foundation
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Ceramic circuit board and module using same
- Patent number 11,570,890
- Issue date Jan 31, 2023
- DENKA COMPANY LIMITED
- Yuta Tsugawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazed electrode for plasma cutting torch
- Patent number 11,554,449
- Issue date Jan 17, 2023
- Lincoln Global, Inc.
- Praveen K. Namburu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material, method for producing bonding material, and method...
- Patent number 11,273,525
- Issue date Mar 15, 2022
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymer composite as plastic solder
- Patent number 11,219,973
- Issue date Jan 11, 2022
- Agency for Science, Technology and Research
- Kuan Eng Johnson Goh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stable undercooled metallic particles for engineering at ambient co...
- Patent number 11,220,730
- Issue date Jan 11, 2022
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive pathways within a wellbore using no-heat liquid solder
- Patent number 11,180,987
- Issue date Nov 23, 2021
- Halliburton Energy Services, Inc.
- William Cecil Pearl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing hermetic sealing lid member
- Patent number 11,178,786
- Issue date Nov 16, 2021
- Hitachi Metals, Ltd.
- Masayuki Yokota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder preform, solder paste and solder...
- Patent number 11,167,379
- Issue date Nov 9, 2021
- Senju Metal Industry Co., Ltd.
- Yuki Iijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CHIP BONDING COMPOSITION FOR POWER SEMICONDUCTOR PACKAGE
- Publication number 20240383078
- Publication date Nov 21, 2024
- TERAON CO., LTD.
- Yoon-Jin KIM
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CUTTING TOOL
- Publication number 20240300026
- Publication date Sep 12, 2024
- AB SANDVIK COROMANT
- Leif DAHL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY
- Publication number 20240198460
- Publication date Jun 20, 2024
- Alpha Assembly Solutions Inc.
- Ranjit PANDHER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL AND MANUFACTURING METHOD OF IT
- Publication number 20240173787
- Publication date May 30, 2024
- Seco Tools AB
- Stefan LARSSON-FRITZ
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING ALLOY, AND SOLDERING PASTE AND SOLDERING FOIL COMPRISING...
- Publication number 20240157485
- Publication date May 16, 2024
- Mapal Fabrik fur Prazisionswerkzeuge Dr. Kress KG
- Martin Kommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR BONDING, AND METHOD FOR MANUFACTURING BONDED BODY
- Publication number 20240149344
- Publication date May 9, 2024
- MITSUBISHI MATERIALS CORPORATION
- Kohei Otogawa
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEO...
- Publication number 20240139847
- Publication date May 2, 2024
- CHINA ACADEMY OF MACHINERY NINGBO ACADEMY OF INTELLIGENT MACHINE TOOL CO., LTD.
- Weimin LONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE METAL BRAZING PASTE COMPOSITION, BRAZING PASTE, AND METHOD F...
- Publication number 20240123554
- Publication date Apr 18, 2024
- BYD COMPANY LIMITED
- Wei ZHOU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE COMPOSITION, DIE ATTACHMENT MATERIAL, PRESSURE-SINTERED...
- Publication number 20240047406
- Publication date Feb 8, 2024
- Namics Corporation
- Koji SASAKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS
- Publication number 20240033860
- Publication date Feb 1, 2024
- Heraeus Deutschland GmbH & Co. KG
- Ly May CHEW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stretchable Interconnects for Flexible Electronic Surfaces
- Publication number 20240029916
- Publication date Jan 25, 2024
- Alpha Assembly Solutions Inc.
- Narahari PUJARI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BRAZING RIBBON AND METHOD FOR MANUFACTURING SAME
- Publication number 20240024989
- Publication date Jan 25, 2024
- AMOGREENTECH CO., LTD.
- Sungbaek DAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL
- Publication number 20240001470
- Publication date Jan 4, 2024
- AB SANDVIK COROMANT
- Tim ULITZKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MEMBER FOR SEMICONDUCTOR DEVICE
- Publication number 20230395550
- Publication date Dec 7, 2023
- SUPERUFO291 TEC
- Akira FUKUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID
- Publication number 20230383388
- Publication date Nov 30, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BOTTOM OHMIC SILVER PASTE FOR STRONTIUM TITANATE RING VARISTOR, PRE...
- Publication number 20230321764
- Publication date Oct 12, 2023
- GUANGZHOU NEWLIFE NEW MATERIAL CO., LTD.
- Zhinan Chai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF
- Publication number 20230321765
- Publication date Oct 12, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR BONDING AND BONDING METHOD
- Publication number 20230311249
- Publication date Oct 5, 2023
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ATTACHING A CONNECTOR TO A GLAZING
- Publication number 20230303433
- Publication date Sep 28, 2023
- Carlex Glass America, LLC
- Jacob Daniel RIGELMAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEDICAL DEVICE INCLUDING A SOLDERABLE LINEAR ELASTIC NICKEL-TITANIU...
- Publication number 20230302261
- Publication date Sep 28, 2023
- ABBOTT CARDIOVASCULAR SYSTEMS, INC.
- Raleigh A. Purtzer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASTE COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230238348
- Publication date Jul 27, 2023
- KYOCERA CORPORATION
- Yuya NITANAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DE...
- Publication number 20230080016
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRO...
- Publication number 20230068210
- Publication date Mar 2, 2023
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low silver solder for welding the electric vacuum device and a prep...
- Publication number 20230048036
- Publication date Feb 16, 2023
- HANGZHOU HUAGUANG ADVANCED WELDING MATERIALS CO., LTD.
- Limei JIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING COMPOSITION
- Publication number 20220371089
- Publication date Nov 24, 2022
- Alpha Assembly Solutions Inc.
- Shamik GHOSHAL
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method for producing a metal-ceramic substrate, solder system, and...
- Publication number 20220362891
- Publication date Nov 17, 2022
- Rogers Germany GmbH
- Karsten Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR...
- Publication number 20220347799
- Publication date Nov 3, 2022
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...
- Publication number 20220339742
- Publication date Oct 27, 2022
- LIFCO INDUSTRIE
- Constantin IACOB
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Ag as the principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Brazing ribbon and method for manufacturing same

Bonding member, method for producing bonding member and method for...

Bonding member for semiconductor device

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Low pressure sintering powder

Lead-free solder alloy composition suitable for use in high-tempera...

Method of producing a vehicle glass assembly

Manufacturing process and device for preforms intended for brazing...

Sinterable films and pastes and methods for use thereof

Composite solder balls metallised on the surface and calibrated for...

Method for producing a metal-ceramic substrate, solder system, and...

Stretchable interconnects for flexible electronic surfaces

Medical device including a solderable linear elastic nickel-titaniu...

Metal particle aggregates, method for producing same, paste-like me...

Sinterable films and pastes and methods for use thereof

Brazed electrode for plasma cutting torch

Stable undercooled metallic particles for filling a void

Method of manufacturing semiconductor having double-sided substrate

Ag alloy bonding wire for semiconductor device

Stable undercooled metallic particles for engineering at ambient co...

Ceramic circuit board and module using same

Brazed electrode for plasma cutting torch

Alternative compositions for high temperature soldering applications

Sintering materials and attachment methods using same

Bonding material, method for producing bonding material, and method...

Conductive polymer composite as plastic solder

Stable undercooled metallic particles for engineering at ambient co...

Conductive pathways within a wellbore using no-heat liquid solder

Method for manufacturing hermetic sealing lid member

Solder alloy, solder ball, solder preform, solder paste and solder...

Patents Applicationslast 30 patents

LOW PRESSURE SINTERING POWDER

CHIP BONDING COMPOSITION FOR POWER SEMICONDUCTOR PACKAGE

CUTTING TOOL

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

TOOL AND MANUFACTURING METHOD OF IT

SOLDERING ALLOY, AND SOLDERING PASTE AND SOLDERING FOIL COMPRISING...

METAL PASTE FOR BONDING, AND METHOD FOR MANUFACTURING BONDED BODY

BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEO...

ACTIVE METAL BRAZING PASTE COMPOSITION, BRAZING PASTE, AND METHOD F...

CONDUCTIVE COMPOSITION, DIE ATTACHMENT MATERIAL, PRESSURE-SINTERED...

SINTERING PASTE AND USE THEREOF FOR CONNECTING COMPONENTS

Stretchable Interconnects for Flexible Electronic Surfaces

BRAZING RIBBON AND METHOD FOR MANUFACTURING SAME

TOOL

BONDING MEMBER FOR SEMICONDUCTOR DEVICE

STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID

BOTTOM OHMIC SILVER PASTE FOR STRONTIUM TITANATE RING VARISTOR, PRE...

SINTERABLE FILMS AND PASTES AND METHODS FOR USE THEREOF

METAL PASTE FOR BONDING AND BONDING METHOD

METHOD OF ATTACHING A CONNECTOR TO A GLAZING

MEDICAL DEVICE INCLUDING A SOLDERABLE LINEAR ELASTIC NICKEL-TITANIU...

PASTE COMPOSITION AND SEMICONDUCTOR DEVICE

BONDED BODY, CERAMIC COPPER CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DE...

BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRO...

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

Low silver solder for welding the electric vacuum device and a prep...

SINTERING COMPOSITION

Method for producing a metal-ceramic substrate, solder system, and...

BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR...

COMPOSITE SOLDER BALLS METALLISED ON THE SURFACE AND CALIBRATED FOR...