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Method of separating wafer
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Patent number 12,304,109
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Issue date May 20, 2025
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Disco Corporation
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Shunsuke Teranishi
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Peeling method and peeling apparatus
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Patent number 12,304,110
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Issue date May 20, 2025
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Disco Corporation
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Ryohei Yamamoto
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Optimised laser cutting
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Patent number 12,304,001
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Issue date May 20, 2025
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ASMPT SINGAPORE PTE. LTD.
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Paul Verburg
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Virtual markings in welding systems
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Patent number 12,304,007
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Issue date May 20, 2025
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Illinois Tool Works Inc.
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William Joshua Becker
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Bond force concentrator
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Patent number 12,304,809
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Issue date May 20, 2025
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KYOCERA Technologies Oy
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Elmeri Österlund
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Hybrid base plate
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Patent number 12,303,992
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Issue date May 20, 2025
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AMOSENSE CO., LTD.
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Jihyung Lee
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Flux and method for producing assembly
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Patent number 12,304,008
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Issue date May 20, 2025
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Senju Metal Industry Co., Ltd.
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Yasuhisa Sukawa
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B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Rail welding method and device
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Patent number 12,304,011
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Issue date May 20, 2025
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DEZHOU UNIVERSITY
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Kaiguo Fan
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