Air blasting delaminating means]

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CPC
Y10T156/1939

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

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Y10T156/1939Air blasting delaminating means]

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Patents Grantslast 30 patents

Information Patent Grant
Detaching a die from an adhesive tape by air ejection
- Patent number 11,764,098
- Issue date Sep 19, 2023
- ASMPT SINGAPORE PTE. LTD.
- Ngai Tat Man
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet automatic peeling apparatus and protective sheet a...
- Patent number 11,629,028
- Issue date Apr 18, 2023
- NIPPI Corporation
- Risa Yoshizaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of peeling protective sheet for prepreg sheet and apparatus...
- Patent number 11,331,898
- Issue date May 17, 2022
- Mitsubishi Heavy Industries, Ltd.
- Yukiharu Yamasaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Peeling method and method of manufacturing semiconductor device
- Patent number 11,296,131
- Issue date Apr 5, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet automatic peeling apparatus and protective sheet a...
- Patent number 11,247,866
- Issue date Feb 15, 2022
- NIPPI Corporation
- Risa Yoshizaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip ejecting apparatus
- Patent number 11,239,104
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Jae Ryoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing element array and apparatus for removin...
- Patent number 11,167,541
- Issue date Nov 9, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg debacker and method of layup
- Patent number 11,155,070
- Issue date Oct 26, 2021
- 7260297 Manitoba Ltd.
- Braden Pierce
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing element array and method of removing specif...
- Patent number 11,101,317
- Issue date Aug 24, 2021
- TDK Corporation
- Toshinobu Miyagoshi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Support for bonding a workpiece and method thereof
- Patent number 11,097,306
- Issue date Aug 24, 2021
- Micro Materials Inc.
- Hao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peel-off device
- Patent number 11,001,044
- Issue date May 11, 2021
- Nikkiso Co., Ltd.
- Toru Makino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film-peeling apparatus
- Patent number 10,882,296
- Issue date Jan 5, 2021
- Kinsus Interconnect Technology Corp.
- Shang-Chi Wang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate separation system and method
- Patent number 10,622,332
- Issue date Apr 14, 2020
- Princo Corp.
- Chun-Hsiung Chou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Peeling method and method of manufacturing semiconductor device
- Patent number 10,529,748
- Issue date Jan 7, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary carrier debond initiation, and associated systems and met...
- Patent number 10,446,431
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component supply device and tape peeling method in component supply...
- Patent number 10,414,612
- Issue date Sep 17, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atuyuki Horie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer de-bonding device
- Patent number 10,204,813
- Issue date Feb 12, 2019
- Zhejiang Microtech Material Co., Ltd.
- Ming Yin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Debonding chips from wafer
- Patent number 10,170,443
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Akihiro Horibe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Support supply apparatus and method for supplying support
- Patent number 10,065,808
- Issue date Sep 4, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Procedure of processing a workpiece and an apparatus designed for t...
- Patent number 9,991,150
- Issue date Jun 5, 2018
- Micro Materials Inc.
- Hao Tang
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,984,927
- Issue date May 29, 2018
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a carrier-workpiece bonded stack
- Patent number 9,962,919
- Issue date May 8, 2018
- Micro Materials Inc.
- Hao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation method, separation apparatus, and separation system
- Patent number 9,956,755
- Issue date May 1, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling device, peeling system and peeling method
- Patent number 9,919,509
- Issue date Mar 20, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling method and method of manufacturing semiconductor device
- Patent number 9,842,994
- Issue date Dec 12, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- G02 - OPTICS
Information Patent Grant
Separation apparatus, separation system, and separation method
- Patent number 9,827,756
- Issue date Nov 28, 2017
- Tokyo Electron Limited
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for forming separation starting point, stack manufacturing a...
- Patent number 9,764,488
- Issue date Sep 19, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Ryu Komatsu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Peeling method and method of manufacturing semiconductor device
- Patent number 9,755,148
- Issue date Sep 5, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- G02 - OPTICS
Information Patent Grant
Automatic film peeling machine and film peeling method
- Patent number 9,566,777
- Issue date Feb 14, 2017
- Fu Tai Hua Industry (Shenzhen) Co., Ltd.
- Li-Chin Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Film-removing mechanism
- Patent number 9,511,578
- Issue date Dec 6, 2016
- FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.
- Xiao-Yong Lv
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
PROTECTIVE SHEET AUTOMATIC PEELING APPARATUS AND PROTECTIVE SHEET A...
- Publication number 20220127102
- Publication date Apr 28, 2022
- NIPPI Corporation
- Risa YOSHIZAKI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PEELING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180108838
- Publication date Apr 19, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20140367015
- Publication date Dec 18, 2014
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peeling Method and Method of Manufacturing Semiconductor Device
- Publication number 20140264351
- Publication date Sep 18, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Toru Takayama
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD
- Publication number 20140020846
- Publication date Jan 23, 2014
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM
- Publication number 20140008022
- Publication date Jan 9, 2014
- Kyung-Hyun AHN
- B32 - LAYERED PRODUCTS
Information Patent Application
SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM
- Publication number 20130327484
- Publication date Dec 12, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...
- Publication number 20130292062
- Publication date Nov 7, 2013
- TOKYO ELECTRON LIMITED
- Yasuharu Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD
- Publication number 20130269879
- Publication date Oct 17, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS
- Publication number 20130255887
- Publication date Oct 3, 2013
- Corning Incorporated
- Michael Yoshiya Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE SEPARATION EQUIPMENT AND OPERATING METHOD THEREOF
- Publication number 20130206331
- Publication date Aug 15, 2013
- SUBTRON TECHNOLOGY CO., LTD.
- Chung W. Ho
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS
- Publication number 20130125364
- Publication date May 23, 2013
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Mark Meloni
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Peeling Method and Method of Manufacturing Semiconductor Device
- Publication number 20120217501
- Publication date Aug 30, 2012
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Toru Takayama
- G02 - OPTICS
Information Patent Application
Removing and Segregating Components from Printed Circuit Boards
- Publication number 20120031566
- Publication date Feb 9, 2012
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Mark Meloni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253315
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUSES USEFUL IN PRINTING, FIXING DEVICES AND METHODS OF STRIP...
- Publication number 20110079354
- Publication date Apr 7, 2011
- Xerox Corporation
- Augusto E. BARTON
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE F...
- Publication number 20110048641
- Publication date Mar 3, 2011
- Nitto Denko Corporation
- Toshimasa SUGIMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS
- Publication number 20100104402
- Publication date Apr 29, 2010
- Michael Yoshiya Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS AND SEPARATING METHOD
- Publication number 20100000680
- Publication date Jan 7, 2010
- Yoshihiro INAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separating apparatus and separating method
- Publication number 20090314430
- Publication date Dec 24, 2009
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Peeling Method and Method of Manufacturing Semiconductor Device
- Publication number 20090291516
- Publication date Nov 26, 2009
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Toru Takayama
- G02 - OPTICS
Information Patent Application
AUTOMATIC MASK PEELING APPARATUS
- Publication number 20090229765
- Publication date Sep 17, 2009
- NGK Insulators, Ltd.
- Hiroshi FURUKUBO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Peeling Method and Method of Manufacturing Semiconductor Device
- Publication number 20090042356
- Publication date Feb 12, 2009
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Toru Takayama
- G02 - OPTICS
Information Patent Application
Method and apparatus for optical fiber coating removal
- Publication number 20080128084
- Publication date Jun 5, 2008
- Steven Akin Dunwoody
- G02 - OPTICS
Information Patent Application
Apparatus for nondestructively removing layout pattern from wafer s...
- Publication number 20080093029
- Publication date Apr 24, 2008
- Kuei-min Liao
- B24 - GRINDING POLISHING
Information Patent Application
Film Stripping Method and Apparatus
- Publication number 20080011420
- Publication date Jan 17, 2008
- Takenori Yoshizawa
- G02 - OPTICS
Information Patent Application
Methods and systems for removing protective films from microfeature...
- Publication number 20070261783
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Charles E. Larson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Delabeling method, device for carrying out the same and use thereof
- Publication number 20060037697
- Publication date Feb 23, 2006
- Nordenia Deutschland Pacimex GmbH
- Fritz Brinkmann
- B08 - CLEANING
Information Patent Application
Method and apparatus for separating disc-shaped substrates
- Publication number 20050205205
- Publication date Sep 22, 2005
- Martin Kratzer
- G11 - INFORMATION STORAGE
Information Patent Application
Sample separating apparatus and method, and substrate manufacturing...
- Publication number 20050045274
- Publication date Mar 3, 2005
- Kazutaka Yanagita
- H01 - BASIC ELECTRIC ELEMENTS

Air blasting delaminating means]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Detaching a die from an adhesive tape by air ejection

Protective sheet automatic peeling apparatus and protective sheet a...

Method of peeling protective sheet for prepreg sheet and apparatus...

Peeling method and method of manufacturing semiconductor device

Protective sheet automatic peeling apparatus and protective sheet a...

Chip ejecting apparatus

Apparatus for manufacturing element array and apparatus for removin...

Prepreg debacker and method of layup

Method of manufacturing element array and method of removing specif...

Support for bonding a workpiece and method thereof

Peel-off device

Film-peeling apparatus

Substrate separation system and method

Peeling method and method of manufacturing semiconductor device

Temporary carrier debond initiation, and associated systems and met...

Component supply device and tape peeling method in component supply...

Wafer de-bonding device

Debonding chips from wafer

Support supply apparatus and method for supplying support

Procedure of processing a workpiece and an apparatus designed for t...

Method and apparatus for separating semiconductor devices from a wafer

Method of separating a carrier-workpiece bonded stack

Separation method, separation apparatus, and separation system

Peeling device, peeling system and peeling method

Peeling method and method of manufacturing semiconductor device

Separation apparatus, separation system, and separation method

Device for forming separation starting point, stack manufacturing a...

Peeling method and method of manufacturing semiconductor device

Automatic film peeling machine and film peeling method

Film-removing mechanism

Patents Applicationslast 30 patents

PROTECTIVE SHEET AUTOMATIC PEELING APPARATUS AND PROTECTIVE SHEET A...

PEELING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

Peeling Method and Method of Manufacturing Semiconductor Device

SEPARATION APPARATUS, SEPARATION SYSTEM, AND SEPARATION METHOD

DELAMINATION APPARATUS AND INLINE THERMAL IMAGING SYSTEM

SEPARATION METHOD, SEPARATION APPARATUS, AND SEPARATION SYSTEM

SUBSTRATE INVERTING DEVICE, SUBSTRATE INVERTING METHOD, AND PEELING...

PEELING DEVICE, PEELING SYSTEM AND PEELING METHOD

HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS

EDGE SEPARATION EQUIPMENT AND OPERATING METHOD THEREOF

REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS

Peeling Method and Method of Manufacturing Semiconductor Device

Removing and Segregating Components from Printed Circuit Boards

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

APPARATUSES USEFUL IN PRINTING, FIXING DEVICES AND METHODS OF STRIP...

METHOD FOR SEPARATING AND REMOVING DICING SURFACE PROTECTION TAPE F...

HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS

SEPARATING APPARATUS AND SEPARATING METHOD

Separating apparatus and separating method

Peeling Method and Method of Manufacturing Semiconductor Device

AUTOMATIC MASK PEELING APPARATUS

Peeling Method and Method of Manufacturing Semiconductor Device

Method and apparatus for optical fiber coating removal

Apparatus for nondestructively removing layout pattern from wafer s...

Film Stripping Method and Apparatus

Methods and systems for removing protective films from microfeature...

Delabeling method, device for carrying out the same and use thereof

Method and apparatus for separating disc-shaped substrates

Sample separating apparatus and method, and substrate manufacturing...