Alloying of impurity materials

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/24Alloying of impurity materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Patterning platinum by alloying and etching platinum alloy
- Patent number 11,658,034
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Sebastian Meier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer-level package structure
- Patent number 11,562,980
- Issue date Jan 24, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode with alloy interface
- Patent number 11,557,482
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum oxide semiconductor manufacturing method and aluminum oxid...
- Patent number 11,410,850
- Issue date Aug 9, 2022
- UACJ Corporation
- Hiroki Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spectrometer utilizing surface plasmon
- Patent number 11,092,546
- Issue date Aug 17, 2021
- SAMSUNG ELECTRONICS CO., LTD.
- Wonjae Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning platinum by alloying and etching platinum alloy
- Patent number 11,011,381
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral current injection electro-optical device with well-separate...
- Patent number 10,897,121
- Issue date Jan 19, 2021
- International Business Machines Corporation
- Charles Caër
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging method and package structure thereof
- Patent number 10,861,822
- Issue date Dec 8, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical cavity surface emitting laser, method for fabricating vert...
- Patent number 10,847,950
- Issue date Nov 24, 2020
- Sumitomo Electric Industries, Ltd.
- Yutaka Onishi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of producing differently doped zones in a silicon substrate,...
- Patent number 10,825,945
- Issue date Nov 3, 2020
- Universitat Konstanz
- Sebastian Gloger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Contact formation through low-tempearature epitaxial deposition in...
- Patent number 10,804,270
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow angle, multi-wavelength, multi-receiver, adjustable sensiti...
- Patent number 10,794,694
- Issue date Oct 6, 2020
- Axcelis Technologies, Inc.
- John F. Baggett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including gettering agents in memory charge storage...
- Patent number 10,734,491
- Issue date Aug 4, 2020
- Micron Technology, Inc.
- Rhett T. Brewer
- G11 - INFORMATION STORAGE
Information Patent Grant
Contact formation through low-temperature epitaxial deposition in s...
- Patent number 10,692,868
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device with quantum well structure, power su...
- Patent number 10,651,305
- Issue date May 12, 2020
- Fujitsu Limited
- Junji Kotani
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Localized tunneling enhancement for semiconductor devices
- Patent number 10,636,875
- Issue date Apr 28, 2020
- Northrop Grumman Systems Corporation
- Yeong-Chang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a source region with chalcogen atoms
- Patent number 10,475,911
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a ternary...
- Patent number 10,453,688
- Issue date Oct 22, 2019
- National Chiao Tung University
- Chao-Hsin Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon germanium-on-insulator formation by thermal mixing
- Patent number 10,396,182
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ni:NiGe:Ge selective etch formulations and method of using same
- Patent number 10,340,150
- Issue date Jul 2, 2019
- Entegris, Inc.
- Steven Bilodeau
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Maskless method to reduce source-drain contact resistance in CMOS d...
- Patent number 10,304,938
- Issue date May 28, 2019
- International Business Machines Corporation
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal relay board for power semiconductor modules
- Patent number 10,276,386
- Issue date Apr 30, 2019
- Fuji Electric Co., Ltd.
- Ryohei Makino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Nitride semiconductor device and process of forming the same
- Patent number 10,263,094
- Issue date Apr 16, 2019
- Sumitomo Electric Industries, Ltd.
- Ken Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon germanium-on-insulator formation by thermal mixing
- Patent number 10,249,737
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of epitaxial growth shape control for CMOS applications
- Patent number 10,205,002
- Issue date Feb 12, 2019
- Applied Materials, Inc.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device with implanted chalcogen...
- Patent number 10,205,011
- Issue date Feb 12, 2019
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating substrates and semiconductor chip
- Patent number 10,090,198
- Issue date Oct 2, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus including gettering agents in memory charge storage struc...
- Patent number 10,074,724
- Issue date Sep 11, 2018
- Micron Technology, Inc.
- Rhett T. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a pillar-shaped semiconductor device
- Patent number 10,050,124
- Issue date Aug 14, 2018
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure, method for manufacturing same, semiconductor...
- Patent number 10,043,664
- Issue date Aug 7, 2018
- FLOSFIA INC.
- Masaya Oda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET
- Publication number 20240332402
- Publication date Oct 3, 2024
- Hua Hong Semiconductor (Wuxi) Limited
- Zhaozhao XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTER TARGETS AND SOURCES FOR SELF-DOPED SOURCE AND DRAIN CONTACTS
- Publication number 20230420246
- Publication date Dec 28, 2023
- Intel Corporation
- Ilya V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY
- Publication number 20230253211
- Publication date Aug 10, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FIELD EFFECT TRANSISTOR WITH REDUCED SOURCE/DRAIN RESISTANCE
- Publication number 20230127783
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230131163
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Koichi NISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR DEVICE
- Publication number 20220406898
- Publication date Dec 22, 2022
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- SHENGHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...
- Publication number 20210272810
- Publication date Sep 2, 2021
- UACJ CORPORATION
- Hiroki Arima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY
- Publication number 20210242029
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode with Alloy Interface
- Publication number 20210104406
- Publication date Apr 8, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20210082869
- Publication date Mar 18, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING OHMIC CONTACT FOR GALLIUM NITRIDE-BASED COMPOUND...
- Publication number 20200365705
- Publication date Nov 19, 2020
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- SHENGHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200303225
- Publication date Sep 24, 2020
- Toyota Jidosha Kabushiki Kaisha
- Shuhei ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF
- Publication number 20200075536
- Publication date Mar 5, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY
- Publication number 20200035500
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING
- Publication number 20190267475
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190198655
- Publication date Jun 27, 2019
- KABUSHIKI KAISHA TOSHIBA
- Keiichi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Source Region with Chalcogen Atoms
- Publication number 20190157438
- Publication date May 23, 2019
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION THROUGH LOW-TEMPEARATURE EPITAXIAL DEPOSITION IN...
- Publication number 20190148377
- Publication date May 16, 2019
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION THROUGH LOW-TEMPEARATURE EPITAXIAL DEPOSITION IN...
- Publication number 20190115347
- Publication date Apr 18, 2019
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING GETTERING AGENTS IN MEMORY CHARGE STORAGE...
- Publication number 20180350930
- Publication date Dec 6, 2018
- Micron Technology, Inc.
- Rhett T. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND PROCESS OF FORMING THE SAME
- Publication number 20180204928
- Publication date Jul 19, 2018
- Sumitomo Electric Industries, Ltd.
- Ken NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR STRUCTURE
- Publication number 20180145188
- Publication date May 24, 2018
- AZUR SPACE SOLAR POWER GMBH
- Daniel FUHRMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20180108567
- Publication date Apr 19, 2018
- Infineon Technologies AG
- Stefan Barzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS METHOD TO REDUCE SOURCE-DRAIN CONTACT RESISTANCE IN CMOS D...
- Publication number 20180083114
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Praneet ADUSUMILLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180061642
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Hsin CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS METHOD TO REDUCE SOURCE-DRAIN CONTACT RESISTANCE IN CMOS D...
- Publication number 20180061956
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Praneet ADUSUMILLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL RELAY BOARD FOR POWER SEMICONDUCTOR MODULES
- Publication number 20180053654
- Publication date Feb 22, 2018
- Fuji Electric Co., Ltd.
- Ryohei MAKINO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTILAYER STRUCTURE, METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...
- Publication number 20170278706
- Publication date Sep 28, 2017
- FLOSFIA INC.
- Masaya Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
- Publication number 20170250112
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Stefan Barzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PILLAR-SHAPED SEMICONDUCTOR DEVICE
- Publication number 20170236920
- Publication date Aug 17, 2017
- Unisantis Electronics Singapore PTE LTD.
- Fujio MASUOKA
- H01 - BASIC ELECTRIC ELEMENTS

Alloying of impurity materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterning platinum by alloying and etching platinum alloy

Wafer-level package structure

Electrode with alloy interface

Aluminum oxide semiconductor manufacturing method and aluminum oxid...

Spectrometer utilizing surface plasmon

Patterning platinum by alloying and etching platinum alloy

Lateral current injection electro-optical device with well-separate...

Wafer-level packaging method and package structure thereof

Vertical cavity surface emitting laser, method for fabricating vert...

Method of producing differently doped zones in a silicon substrate,...

Contact formation through low-tempearature epitaxial deposition in...

Shallow angle, multi-wavelength, multi-receiver, adjustable sensiti...

Memory devices including gettering agents in memory charge storage...

Contact formation through low-temperature epitaxial deposition in s...

Compound semiconductor device with quantum well structure, power su...

Localized tunneling enhancement for semiconductor devices

Semiconductor device having a source region with chalcogen atoms

Method of manufacturing a semiconductor device including a ternary...

Silicon germanium-on-insulator formation by thermal mixing

Ni:NiGe:Ge selective etch formulations and method of using same

Maskless method to reduce source-drain contact resistance in CMOS d...

Signal relay board for power semiconductor modules

Nitride semiconductor device and process of forming the same

Silicon germanium-on-insulator formation by thermal mixing

Method of epitaxial growth shape control for CMOS applications

Method for forming a semiconductor device with implanted chalcogen...

Method for separating substrates and semiconductor chip

Apparatus including gettering agents in memory charge storage struc...

Method for producing a pillar-shaped semiconductor device

Multilayer structure, method for manufacturing same, semiconductor...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SUPERJUNCTION TRENCH GATE MOSFET

SPUTTER TARGETS AND SOURCES FOR SELF-DOPED SOURCE AND DRAIN CONTACTS

PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY

FIELD EFFECT TRANSISTOR WITH REDUCED SOURCE/DRAIN RESISTANCE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING...

PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY

Electrode with Alloy Interface

WAFER-LEVEL PACKAGE STRUCTURE

METHOD OF FORMING OHMIC CONTACT FOR GALLIUM NITRIDE-BASED COMPOUND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY

SILICON GERMANIUM-ON-INSULATOR FORMATION BY THERMAL MIXING

SEMICONDUCTOR DEVICE

Semiconductor Device Having a Source Region with Chalcogen Atoms

CONTACT FORMATION THROUGH LOW-TEMPEARATURE EPITAXIAL DEPOSITION IN...

CONTACT FORMATION THROUGH LOW-TEMPEARATURE EPITAXIAL DEPOSITION IN...

MEMORY DEVICES INCLUDING GETTERING AGENTS IN MEMORY CHARGE STORAGE...

NITRIDE SEMICONDUCTOR DEVICE AND PROCESS OF FORMING THE SAME

STACKED SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

MASKLESS METHOD TO REDUCE SOURCE-DRAIN CONTACT RESISTANCE IN CMOS D...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

MASKLESS METHOD TO REDUCE SOURCE-DRAIN CONTACT RESISTANCE IN CMOS D...

SIGNAL RELAY BOARD FOR POWER SEMICONDUCTOR MODULES

MULTILAYER STRUCTURE, METHOD FOR MANUFACTURING SAME, SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING A PILLAR-SHAPED SEMICONDUCTOR DEVICE