Anisotropic liquid etching

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CPC
H01L21/30608

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/30608Anisotropic liquid etching

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming SOI substrates
- Patent number 12,211,686
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor optical device for lidar se...
- Patent number 12,199,132
- Issue date Jan 14, 2025
- AURORA OPERATIONS, INC.
- Lei Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,191,191
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,119,231
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for structuring a semiconductor surface and semiconductor bo...
- Patent number 12,094,928
- Issue date Sep 17, 2024
- Osram Opto Semiconductors GmbH
- Markus Tautz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical liquid preparation device, and substrate processing device
- Patent number 12,064,739
- Issue date Aug 20, 2024
- SCREEN Holdings Co., Ltd.
- Hajime Nishide
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Hard mask and preparation method thereof, preparation method of jos...
- Patent number 12,048,255
- Issue date Jul 23, 2024
- Alibaba Group Holding Limited
- Ran Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etching chemistry and method of forming semiconductor device us...
- Patent number 12,046,476
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Hsien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching substrates comprising a thin surface layer, for...
- Patent number 12,040,194
- Issue date Jul 16, 2024
- Soitec
- Laurent Viravaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor and method of forming the same
- Patent number 12,021,079
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming photonic devices
- Patent number 12,013,570
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tao-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming source/drain contacts
- Patent number 12,009,363
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,990,339
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors with gate fins and method of making the same
- Patent number 11,967,626
- Issue date Apr 23, 2024
- SanDisk Technologies LLC
- Mitsuhiro Togo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a cavity with a wet etch for backside contact formation
- Patent number 11,942,527
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stacked layers and devices formed thereof
- Patent number 11,942,363
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous semiconductor device substrates with high quality epi...
- Patent number 11,908,922
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Carlos H. Diaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,901,185
- Issue date Feb 13, 2024
- Kabushiki Kaisha Toshiba
- Mitsuo Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate liquid processing apparatus, substrate liquid processing...
- Patent number 11,862,486
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Kazuki Kosai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched gate structure fabrication
- Patent number 11,842,932
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices by etching active fi...
- Patent number 11,830,775
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Min-Chul Sun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a source/drain recess in a semiconductor device
- Patent number 11,824,120
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eric Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etching solution, silicon etching method, and method of pro...
- Patent number 11,802,240
- Issue date Oct 31, 2023
- Tokyo Ohka Kogyo Co., Ltd.
- Ming-Yen Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line formation with cut-first tip definition
- Patent number 11,798,842
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor source/drain contacts and methods of forming the same
- Patent number 11,798,943
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain regions in fin field effect transistors (FinFETs) and...
- Patent number 11,784,185
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method
- Patent number 11,776,817
- Issue date Oct 3, 2023
- Tokyo Electron Limited
- Shota Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming SOI substrates
- Patent number 11,764,054
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240421205
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240395556
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH APPARATUS
- Publication number 20240395572
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Ting LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387242
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-YING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...
- Publication number 20240379424
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION
- Publication number 20240355700
- Publication date Oct 24, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Siraj Akhtar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE
- Publication number 20240342672
- Publication date Oct 17, 2024
- SCREEN Holdings Co., Ltd.
- Hajime NISHIDE
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY
- Publication number 20240339327
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240332298
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240304620
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PHOTONIC DEVICES
- Publication number 20240302591
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Tao-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING HIGH ASPECT RATIO OPENINGS USING MULTIPLE CLADDING...
- Publication number 20240290622
- Publication date Aug 29, 2024
- SANDISK TECHNOLOGIES LLC
- Roshan Jayakhar TIRUKKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240282575
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240266183
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- HSUAN-WU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Stacked Layers and Devices Formed Thereof
- Publication number 20240243011
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PILLAR-SHAPED SEMICONDUCTOR DEVICE
- Publication number 20240206146
- Publication date Jun 20, 2024
- Unisantis Electronics Singapore PTE Ltd.
- Kenichi KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION
- Publication number 20240194753
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Etching Solution, Method for Treating Substrate, and Method...
- Publication number 20240170294
- Publication date May 23, 2024
- Tokuyama Corporation
- Tatsuya Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Etching Solution, Method for Treating Substrate, and Method...
- Publication number 20240170293
- Publication date May 23, 2024
- Tokuyama Corporation
- Tatsuya Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ETCHING LIQUID, AND METHOD FOR PRODUCING SILICON DEVICES AN...
- Publication number 20240124775
- Publication date Apr 18, 2024
- Tokuyama Corporation
- Yoshiki Seike
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240074202
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240072113
- Publication date Feb 29, 2024
- NEXPERIA B.V.
- Stefan Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FI...
- Publication number 20240047275
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Min-Chul SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EQUIPMENT AND PROCESS TECHNOLOGIES FOR CATALYST INFLUENCED CHEMICAL...
- Publication number 20230411178
- Publication date Dec 21, 2023
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE
- Publication number 20230387304
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eric PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING SYS...
- Publication number 20230377894
- Publication date Nov 23, 2023
- SEMES CO., LTD.
- Minyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR SOURCE/DRAIN CONTACTS AND METHODS OF FORMING THE SAME
- Publication number 20230369325
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Anisotropic liquid etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming SOI substrates

Manufacturing process for semiconductor optical device for lidar se...

Semiconductor structure and manufacturing method thereof

Semiconductor device and method

Method for structuring a semiconductor surface and semiconductor bo...

Chemical liquid preparation device, and substrate processing device

Hard mask and preparation method thereof, preparation method of jos...

Wet etching chemistry and method of forming semiconductor device us...

Method for etching substrates comprising a thin surface layer, for...

Fin field-effect transistor and method of forming the same

Methods of forming photonic devices

Method for forming source/drain contacts

Semiconductor device and method of manufacture

Field effect transistors with gate fins and method of making the same

Forming a cavity with a wet etch for backside contact formation

Methods for forming stacked layers and devices formed thereof

Heterogeneous semiconductor device substrates with high quality epi...

Semiconductor device structure and method for forming the same

Etching method

Substrate liquid processing apparatus, substrate liquid processing...

Integrated assemblies and methods of forming integrated assemblies

Notched gate structure fabrication

Methods of manufacturing semiconductor devices by etching active fi...

Method of fabricating a source/drain recess in a semiconductor device

Silicon etching solution, silicon etching method, and method of pro...

Line formation with cut-first tip definition

Transistor source/drain contacts and methods of forming the same

Source/drain regions in fin field effect transistors (FinFETs) and...

Pattern forming method

Methods of forming SOI substrates

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD

WET ETCH APPARATUS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MAKING HIGH ASPECT RATIO OPENINGS IN A SEMICONDUCTOR DEVI...

DIE-PACKAGE INTERCONNECT TO FACILITATE THERMAL CONDUCTION

CHEMICAL LIQUID PREPARATION DEVICE, AND SUBSTRATE PROCESSING DEVICE

METHOD OF FORMING SEMICONDUCTOR DEVICE USING WET ETCHING CHEMISTRY

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

METHODS OF FORMING PHOTONIC DEVICES

METHOD OF MAKING HIGH ASPECT RATIO OPENINGS USING MULTIPLE CLADDING...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Methods for Forming Stacked Layers and Devices Formed Thereof

METHOD FOR PRODUCING PILLAR-SHAPED SEMICONDUCTOR DEVICE

FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION

Silicon Etching Solution, Method for Treating Substrate, and Method...

Silicon Etching Solution, Method for Treating Substrate, and Method...

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

SILICON ETCHING LIQUID, AND METHOD FOR PRODUCING SILICON DEVICES AN...

Memory Circuitry And Method Used In Forming Memory Circuitry

VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES BY ETCHING ACTIVE FI...

EQUIPMENT AND PROCESS TECHNOLOGIES FOR CATALYST INFLUENCED CHEMICAL...

METHOD OF FABRICATING A SOURCE/DRAIN RECESS IN A SEMICONDUCTOR DEVICE

METHOD OF FORMING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING SYS...

TRANSISTOR SOURCE/DRAIN CONTACTS AND METHODS OF FORMING THE SAME