Anti metal-migration

Industry

CPC
H05K2201/0769

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0769Anti metal-migration

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn whisker growth mitigation using NiO sublayers
- Patent number 10,967,463
- Issue date Apr 6, 2021
- The University of Toledo
- Vamsi Borra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,932,363
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible wiring board and display device
- Patent number 10,932,365
- Issue date Feb 23, 2021
- Joled Inc
- Yutaka Nakano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for the mitigation of metal whiskers
- Patent number 10,913,869
- Issue date Feb 9, 2021
- Raytheon Company
- David R. Smith
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board and method for production thereof
- Patent number 10,834,810
- Issue date Nov 10, 2020
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Producing metal/ceramic circuit board by removing residual silver
- Patent number 10,834,823
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal coating, composition and method for the mitigation of gro...
- Patent number 10,731,042
- Issue date Aug 4, 2020
- Loughborough University
- Mark Andrew Ashworth
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metal-base printed circuit board
- Patent number 10,681,808
- Issue date Jun 9, 2020
- Waseda University
- Yoshimichi Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with non-plated hole interposed between plated holes...
- Patent number 10,631,407
- Issue date Apr 21, 2020
- Cisco Technology, Inc.
- Jennifer Oliver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate
- Patent number 10,524,365
- Issue date Dec 31, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,462,900
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Flexible printed circuit board
- Patent number 10,405,431
- Issue date Sep 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Lei Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 10,375,837
- Issue date Aug 6, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,299,385
- Issue date May 21, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Coating for the mitigation of metal whiskers
- Patent number 10,184,054
- Issue date Jan 22, 2019
- Raytheon Company
- David R. Smith
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive film, conductive film manufacturing method, and touch panel
- Patent number 10,108,304
- Issue date Oct 23, 2018
- FUJIFILM Corporation
- Tasuku Satou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board
- Patent number 9,913,372
- Issue date Mar 6, 2018
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive film forming composition, conductive film, and wiring board
- Patent number 9,859,036
- Issue date Jan 2, 2018
- FUJIFILM Corporation
- Yasuaki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,736,945
- Issue date Aug 15, 2017
- Ibiden Co., Ltd.
- Nobuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,711,439
- Issue date Jul 18, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,693,453
- Issue date Jun 27, 2017
- NGK SPARK PLUS CO., LTD.
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,609,747
- Issue date Mar 28, 2017
- FUJIFILM Corporation
- Yasuaki Matsushita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for forming silver ion diffusion-suppressing layer, fil...
- Patent number 9,578,732
- Issue date Feb 21, 2017
- FUJIFILM Corporation
- Yasuhiro Mitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-base printed circuit board
- Patent number 9,554,464
- Issue date Jan 24, 2017
- Waseda University
- Yoshimichi Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for reducing the occurrence of metal whiskers
- Patent number 9,532,463
- Issue date Dec 27, 2016
- The Boeing Company
- Mark J. Clemen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD
- Publication number 20230254983
- Publication date Aug 10, 2023
- TOPPAN INC.
- Takeshi TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230104567
- Publication date Apr 6, 2023
- KYOCERA CORPORATION
- Takayuki UMEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS
- Publication number 20210310124
- Publication date Oct 7, 2021
- Picosun Oy
- Marko PUDAS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION
- Publication number 20210289636
- Publication date Sep 16, 2021
- Jaguar Land Rover Limited
- Thomas LIEDTKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING FOR THE MITIGATION OF METAL WHISKERS
- Publication number 20210095139
- Publication date Apr 1, 2021
- Raytheon Company
- David R. Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FLEXIBLE WIRING BOARD AND DISPLAY DEVICE
- Publication number 20200053878
- Publication date Feb 13, 2020
- JOLED INC.
- Yutaka NAKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...
- Publication number 20190364659
- Publication date Nov 28, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS
- Publication number 20190127853
- Publication date May 2, 2019
- Marko PUDAS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COATING FOR THE MITIGATION OF METAL WHISKERS
- Publication number 20190077976
- Publication date Mar 14, 2019
- Raytheon Company
- David R. Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20180324957
- Publication date Nov 8, 2018
- NGK SPARK PLUG CO., LTD.
- Tatsuya KATOH
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METAL-BASE PRINTED CIRCUIT BOARD
- Publication number 20170127514
- Publication date May 4, 2017
- Waseda University
- Yoshimichi Ohki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL-BASE PRINTED CIRCUIT BOARD
- Publication number 20150140293
- Publication date May 21, 2015
- Waseda University
- Yoshimichi Ohki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...
- Publication number 20140342113
- Publication date Nov 20, 2014
- United States of America as represented by the Secretary of the Navy
- Nishkamraj U. Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS TO PRODUCE CONFORMAL NANO-COMPOSITE COATING FOR MITITGATION...
- Publication number 20140342097
- Publication date Nov 20, 2014
- The United States Navy as represented by the Secretary of the Navy
- Nishkamraj Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140138134
- Publication date May 22, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Reducing the Occurrence of Metal Whiskers
- Publication number 20140110402
- Publication date Apr 24, 2014
- The Boeing Company
- Mark J. Clemen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD
- Publication number 20140069701
- Publication date Mar 13, 2014
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER BUMP BONDING STRUCTURE
- Publication number 20140054766
- Publication date Feb 27, 2014
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Eiji HASHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS INTERPOSER PANELS AND METHODS FOR MAKING THE SAME
- Publication number 20140034374
- Publication date Feb 6, 2014
- Corning Incorporated
- Ivan A. Cornejo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
WIRING BOARD
- Publication number 20140000940
- Publication date Jan 2, 2014
- KYOCERA CORPORATION
- Yurie Onitsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130284499
- Publication date Oct 31, 2013
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...
- Publication number 20130284066
- Publication date Oct 31, 2013
- Yutaka MORII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FIXING METAL BRACKET FOR COMPONENT MOUNTED ON CIRCUIT BOARD
- Publication number 20130118789
- Publication date May 16, 2013
- YAZAKI CORPORATION
- Takashi Muro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET HEAD AND METHOD FOR PRODUCING THE SAME
- Publication number 20130076834
- Publication date Mar 28, 2013
- FUJIFILM CORPORATION
- Norihito NOSAKA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...
- Publication number 20120198692
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass Interposer Panels And Methods For Making The Same
- Publication number 20120048604
- Publication date Mar 1, 2012
- Ivan A. Cornejo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREVENTING OR REDUCING SILVER MIGRATION IN THE CROSSOVER...
- Publication number 20110281024
- Publication date Nov 17, 2011
- E.I. du Pont de Nemours and Company
- John C. Crumpton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Printed circuit substrate and method of manufacturing the same
- Publication number 20110253431
- Publication date Oct 20, 2011
- SNU R&DB Foundation
- Hyung Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND STRUCTURE USING THE SAME
- Publication number 20110232953
- Publication date Sep 29, 2011
- Kyocera Corporation
- Takeshi Oga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATINGS FOR SUPPRESSING METALLIC WHISKERS
- Publication number 20110206909
- Publication date Aug 25, 2011
- Sundew Technologies LLC
- Ofer Sneh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Anti metal-migration

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Apparatus and method relating to electrochemical migration

Wiring substrate

Sn whisker growth mitigation using NiO sublayers

Glass fiber coatings for improved resistance to conductive anodic f...

Flexible wiring board and display device

Coating for the mitigation of metal whiskers

Circuit board and method for production thereof

Producing metal/ceramic circuit board by removing residual silver

Circuit board and production method therefor

Conformal coating, composition and method for the mitigation of gro...

Metal-base printed circuit board

Circuit board with non-plated hole interposed between plated holes...

Ceramic substrate

Glass fiber coatings for improved resistance to conductive anodic f...

Flexible printed circuit board

Method of manufacturing a ceramic substrate

Carrier-attached copper foil, laminate, method for producing printe...

Coating for the mitigation of metal whiskers

Conductive film, conductive film manufacturing method, and touch panel

Wiring board

Conductive film forming composition, conductive film, and wiring board

Printed wiring board

Printed wiring board and method for manufacturing the same

Wiring board

Wiring board

Composition for forming silver ion diffusion-suppressing layer, fil...

Metal-base printed circuit board

Methods and apparatus for reducing the occurrence of metal whiskers

Printed wiring board and method for manufacturing printed wiring board

Patents Applicationslast 30 patents

WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD

WIRING BOARD

COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS

APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION

COATING FOR THE MITIGATION OF METAL WHISKERS

FLEXIBLE WIRING BOARD AND DISPLAY DEVICE

GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...

COATING BY ALD FOR SUPPRESSING METALLIC WHISKERS

COATING FOR THE MITIGATION OF METAL WHISKERS

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

METAL-BASE PRINTED CIRCUIT BOARD

METAL-BASE PRINTED CIRCUIT BOARD

STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...

PROCESS TO PRODUCE CONFORMAL NANO-COMPOSITE COATING FOR MITITGATION...

WIRING SUBSTRATE

Methods and Apparatus for Reducing the Occurrence of Metal Whiskers

WIRING BOARD

LEAD-FREE SOLDER BUMP BONDING STRUCTURE

GLASS INTERPOSER PANELS AND METHODS FOR MAKING THE SAME

WIRING BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING...

FIXING METAL BRACKET FOR COMPONENT MOUNTED ON CIRCUIT BOARD

INKJET HEAD AND METHOD FOR PRODUCING THE SAME

UNDERBUMP METALLURGY EMPLOYING AN ELECTROLYTIC Cu / ELECTORLYTIC Ni...

Glass Interposer Panels And Methods For Making The Same

METHOD FOR PREVENTING OR REDUCING SILVER MIGRATION IN THE CROSSOVER...

Printed circuit substrate and method of manufacturing the same

CIRCUIT BOARD AND STRUCTURE USING THE SAME

COATINGS FOR SUPPRESSING METALLIC WHISKERS