Indexing scheme relating to printed circuits covered by H05K1/00

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

H05K2201/01Dielectrics H05K2201/0104Properties and characteristics in general H05K2201/0108Transparent H05K2201/0112Absorbing light H05K2201/0116Porous H05K2201/012Flame-retardant Preventing of inflammation H05K2201/0125Shrinkable H05K2201/0129Thermoplastic polymer H05K2201/0133Elastomeric or compliant polymer H05K2201/0137Materials H05K2201/0141Liquid crystal polymer [LCP] H05K2201/0145Polyester H05K2201/015Fluoropolymer H05K2201/0154Polyimide H05K2201/0158Polyalkene or polyolefin H05K2201/0162Silicon containing polymer H05K2201/0166Polymeric layer used for special processing H05K2201/017Glass ceramic coating H05K2201/0175Inorganic, non-metallic layer H05K2201/0179Thin film deposited insulating layer H05K2201/0183Dielectric layers H05K2201/0187with regions of different dielectrics in the same layer H05K2201/0191wherein the thickness of the dielectric plays an important role H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers H05K2201/02Fillers Particles Fibers Reinforcement materials H05K2201/0203Fillers and particles H05K2201/0206Materials H05K2201/0209Inorganic, non-metallic particles H05K2201/0212Resin particles H05K2201/0215Metallic fillers H05K2201/0218Composite particles H05K2201/0221Insulating particles having an electrically conductive coating H05K2201/0224Conductive particles having an insulating coating H05K2201/0227Insulating particles having an insulating coating H05K2201/023Hard particles H05K2201/0233Deformable particles H05K2201/0236Plating catalyst as filler in insulating material H05K2201/0239Coupling agent for particles H05K2201/0242Shape of an individual particle H05K2201/0245Flakes, flat particles or lamellar particles H05K2201/0248Needles or elongated particles Elongated cluster of chemically bonded particles H05K2201/0251Non-conductive microfibers H05K2201/0254Microballoons or hollow filler particles H05K2201/0257Nanoparticles H05K2201/026Nanotubes or nanowires H05K2201/0263Details about a collection of particles H05K2201/0266Size distribution H05K2201/0269Non-uniform distribution or concentration of particles H05K2201/0272Mixed conductive particles, i.e. using different conductive particles H05K2201/0275Fibers and reinforcement materials H05K2201/0278Polymeric fibers H05K2201/0281Conductive fibers H05K2201/0284Paper H05K2201/0287Unidirectional or parallel fibers H05K2201/029Woven fibrous reinforcement or textile H05K2201/0293Non-woven fibrous reinforcement H05K2201/0296Fibers with a special cross-section H05K2201/03Conductive materials H05K2201/0302Properties and characteristics in general H05K2201/0305Solder used for other purposes than connections between PCB or components H05K2201/0308Shape memory alloy [SMA] H05K2201/0311Metallic part with specific elastic properties H05K2201/0314Elastomeric connector or conductor H05K2201/0317Thin film conductor layer Thin film passive component H05K2201/032Materials H05K2201/0323Carbon H05K2201/0326Inorganic, non-metallic conductor H05K2201/0329Intrinsically conductive polymer [ICP] Semiconductive polymer H05K2201/0332Structure of the conductor H05K2201/0335Layered conductors or foils H05K2201/0338Layered conductor H05K2201/0341Intermediate metal H05K2201/0344Electroless sublayer H05K2201/0347Overplating H05K2201/035Paste overlayer H05K2201/0352Differences between the conductors of different layers of a multilayer H05K2201/0355Metal foils H05K2201/0358Resin coated copper [RCC] H05K2201/0361Etched tri-metal structure H05K2201/0364Conductor shape H05K2201/0367Metallic bump or raised conductor not used as solder bump H05K2201/037Hollow conductors, i.e. conductors partially or completely surrounding a void H05K2201/0373Conductors having a fine structure H05K2201/0376Flush conductors H05K2201/0379Stacked conductors H05K2201/0382Continuously deformed conductors H05K2201/0385Displaced conductors H05K2201/0388Other aspects of conductors H05K2201/0391Using different types of conductors H05K2201/0394Conductor crossing over a hole in the substrate H05K2201/0397Tab H05K2201/04Assemblies of printed circuits H05K2201/041Stacked PCBs H05K2201/042Stacked spaced PCBs Planar parts of folded flexible circuits having mounted components in between or spaced from each other H05K2201/043Stacked PCBs with their backs attached to each other without electrical connection H05K2201/044Details of backplane or midplane for mounting orthogonal PCBs H05K2201/045Hierarchy auxiliary PCB H05K2201/046Planar parts of folded PCBs making an angle relative to each other H05K2201/047Box-like arrangements of PCBs H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB H05K2201/049PCB for one component H05K2201/05Flexible printed circuits [FPCs] H05K2201/051Rolled H05K2201/052Branched H05K2201/053Tails H05K2201/055Folded back on itself H05K2201/056Folded around rigid support or component H05K2201/057Shape retainable H05K2201/058Direct connection between two or more FPCs or between flexible parts of rigid PCBs H05K2201/06Thermal details H05K2201/062Means for thermal insulation H05K2201/064Fluid cooling H05K2201/066Heatsink mounted on the surface of the PCB H05K2201/068wherein the coefficient of thermal expansion is important H05K2201/07Electric details H05K2201/0707Shielding H05K2201/0715provided by an outer layer of PCB H05K2201/0723provided by an inner layer of PCB H05K2201/073High voltage adaptations H05K2201/0738Use of voltage responsive materials H05K2201/0746Protection against transients H05K2201/0753Insulation H05K2201/0761Insulation resistance H05K2201/0769Anti metal-migration H05K2201/0776Resistance and impedance H05K2201/0784Uniform resistance H05K2201/0792Means against parasitic impedance Means against eddy currents H05K2201/08Magnetic details H05K2201/083Magnetic materials H05K2201/086for inductive purposes H05K2201/09Shape and layout H05K2201/09009Substrate related H05K2201/09018Rigid curved substrate H05K2201/09027Non-rectangular flat PCB H05K2201/09036Recesses or grooves in insulating substrate H05K2201/09045Locally raised area or protrusion of insulating substrate H05K2201/09054Raised area or protrusion of metal substrate H05K2201/09063Holes or slots in insulating substrate not used for electrical connections H05K2201/09072Hole or recess under component or special relationship between hole and component H05K2201/09081Tongue or tail integrated in planar structure H05K2201/0909Preformed cutting or breaking line H05K2201/091Locally and permanently deformed areas including dielectric material H05K2201/09109Locally detached layers H05K2201/09118Moulded substrate H05K2201/09127PCB or component having an integral separable or breakable part H05K2201/09136Means for correcting warpage H05K2201/09145Edge details H05K2201/09154Bevelled, chamferred or tapered edge H05K2201/09163Slotted edge H05K2201/09172Notches between edge pads H05K2201/09181Notches in edge pads H05K2201/0919Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes H05K2201/092Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes H05K2201/09209Shape and layout details of conductors H05K2201/09218Conductive traces H05K2201/09227Layout details of a plurality of traces H05K2201/09236Parallel layout H05K2201/09245Crossing layout H05K2201/09254Branched layout H05K2201/09263Meander H05K2201/09272Layout details of angles or corners H05K2201/09281Layout details of a single conductor H05K2201/0929Conductive planes H05K2201/093Layout of power planes, ground planes or power supply conductors H05K2201/09309Core having two or more power planes Capacitive laminate of two power planes H05K2201/09318Core having one signal plane and one power plane H05K2201/09327Special sequence of power, ground and signal layers in multilayer PCB H05K2201/09336Signal conductors in same plane as power plane H05K2201/09345Power and ground in the same plane Power planes for two voltages in one plane H05K2201/09354Ground conductor along edge of main surface H05K2201/09363wherein only contours around conductors are removed for insulation H05K2201/09372Pads and lands H05K2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereof Shape of electrode of leadless component H05K2201/0939Curved pads H05K2201/094Array of pads or lands differing from one another H05K2201/09409Multiple rows of pads, lands, terminals or dummy patterns Multiple rows of mounted components H05K2201/09418Special orientation of pads, lands or terminals of component H05K2201/09427Special relation between the location or dimension of a pad or land and the location or dimension of a terminal H05K2201/09436Pads or lands on permanent coating which covers the other conductors H05K2201/09445Pads for connections not located at the edge of the PCB H05K2201/09454Inner lands H05K2201/09463Partial lands H05K2201/09472Recessed pad for surface mounting Recessed electrode of component H05K2201/09481Via in pad Pad over filled via H05K2201/0949Pad close to a hole, not surrounding the hole H05K2201/095Conductive through-holes or vias H05K2201/09509Blind vias H05K2201/09518Deep blind vias H05K2201/09527Inverse blind vias H05K2201/09536Buried plated through-holes H05K2201/09545Plated through-holes or blind vias without lands H05K2201/09554Via connected to metal substrate H05K2201/09563Metal filled via H05K2201/09572Solder filled plated through-hole in the final product H05K2201/09581Applying an insulating coating on the walls of holes H05K2201/0959Plated through-holes or plated blind vias filled with insulating material H05K2201/096Vertically aligned vias, holes or stacked vias H05K2201/09609Via grid H05K2201/09618Via fence H05K2201/09627Special connections between adjacent vias, not for grounding vias H05K2201/09636Details of adjacent, not connected vias H05K2201/09645Patterning on via walls Plural lands around one hole H05K2201/09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095 H05K2201/09663Divided layout H05K2201/09672Superposed layout H05K2201/09681Mesh conductors H05K2201/0969Apertured conductors H05K2201/097Alternating conductors H05K2201/09709Staggered pads, lands or terminals Parallel conductors in different planes H05K2201/09718Clearance holes H05K2201/09727Varying width along a single conductor Conductors or pads having different widths H05K2201/09736Varying thickness of a single conductor Conductors in the same plane having different thicknesses H05K2201/09745Recess in conductor H05K2201/09754Connector integrally incorporated in the PCB or in housing H05K2201/09763Printed component having superposed conductors, but integrated in one circuit layer H05K2201/09772Conductors directly under a component but not electrically connected to the component H05K2201/09781Dummy conductors H05K2201/0979Redundant conductors or connections H05K2201/098Special shape of the cross-section of conductors H05K2201/09809Coaxial layout H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209 Shape and layout details covering several of these groups H05K2201/09827Tapered H05K2201/09836Oblique hole, via or bump H05K2201/09845Stepped hole, via, edge, bump or conductor H05K2201/09854Hole or via having special cross-section H05K2201/09863Concave hole or via H05K2201/09872Insulating conformal coating H05K2201/09881Coating only between conductors H05K2201/0989Coating free areas H05K2201/099Coating over pads H05K2201/09909Special local insulating pattern H05K2201/09918Optically detected marks used for aligning tool relative to the PCB H05K2201/09927Machine readable code H05K2201/09936Marks, inscriptions, etc. for information H05K2201/09945Universal aspects H05K2201/09954More mounting possibilities H05K2201/09963Programming circuit by using small elements H05K2201/09972Partitioned H05K2201/09981Metallised walls H05K2201/0999Circuit printed on or in housing H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board H05K2201/10007Types of components H05K2201/10015Non-printed capacitor H05K2201/10022Non-printed resistor H05K2201/1003Non-printed inductor H05K2201/10037Printed or non-printed battery H05K2201/10045Mounted network component having plural terminals H05K2201/10053Switch H05K2201/1006Non-printed filter H05K2201/10068Non-printed resonator H05K2201/10075Non-printed oscillator H05K2201/10083Electromechanical or electro-acoustic component H05K2201/1009Electromotor H05K2201/10098Component for radio transmission H05K2201/10106Light emitting diode [LED] H05K2201/10113Lamp H05K2201/10121Optical component H05K2201/10128Display H05K2201/10136Liquid Crystal display [LCD] H05K2201/10143Solar cell H05K2201/10151Sensor H05K2201/10159Memory H05K2201/10166Transistor H05K2201/10174Diode H05K2201/10181Fuse H05K2201/10189Non-printed connector H05K2201/10196Variable component H05K2201/10204Dummy component, dummy PCB or template H05K2201/10212Programmable component H05K2201/10219Thermoelectric component H05K2201/10227Other objects H05K2201/10234Metallic balls H05K2201/10242Metallic cylinders H05K2201/1025Metallic discs H05K2201/10257Hollow pieces of metal H05K2201/10265Metallic coils or springs H05K2201/10272Busbars H05K2201/1028Thin metal strips as connectors or conductors H05K2201/10287Metal wires as connectors or conductors H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB H05K2201/10303Pin-in-hole mounted pins H05K2201/1031Surface mounted metallic connector elements H05K2201/10318Surface mounted metallic pins H05K2201/10325Sockets H05K2201/10333Individual female type metallic connector elements H05K2201/1034Edge terminals H05K2201/10348Fuzz's as connector elements H05K2201/10356Cables H05K2201/10363Jumpers H05K2201/10371Shields or metal cases H05K2201/10378Interposers H05K2201/10386Clip leads Terminals gripping the edge of a substrate H05K2201/10393Clamping a component by an element or a set of elements H05K2201/10401Eyelets H05K2201/10409Screws H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB H05K2201/10424Frame holders H05K2201/10431Details of mounted components H05K2201/10439Position of a single component H05K2201/10446Mounted on an edge H05K2201/10454Vertically mounted H05K2201/10462Flat component oriented parallel to the PCB surface H05K2201/10469Asymmetrically mounted component H05K2201/10477Inverted H05K2201/10484Obliquely mounted H05K2201/10492Electrically connected to another device H05K2201/105Mechanically attached to another device H05K2201/10507Involving several components H05K2201/10515Stacked components H05K2201/10522Adjacent components H05K2201/1053Mounted components directly electrically connected to each other H05K2201/10537Attached components H05K2201/10545Related components mounted on both sides of the PCB H05K2201/10553Component over metal H05K2201/1056Metal over component H05K2201/10568Integral adaptations of a component or an auxiliary PCB for mounting H05K2201/10575Insulating foil under component H05K2201/10583Cylindrically shaped component Fixing means therefore H05K2201/1059Connections made by press-fit insertion H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB H05K2201/10606Permanent holder for component or auxiliary PCB mounted on a PCB H05K2201/10613Details of electrical connections of non-printed components H05K2201/10621Components characterised by their electrical contacts H05K2201/10628Leaded surface mounted device H05K2201/10636Leadless chip H05K2201/10643Disc shaped leadless component H05K2201/10651Component having two leads H05K2201/10659Different types of terminals for the same component H05K2201/10666Plated through-hole for surface mounting on PCB H05K2201/10674Flip chip H05K2201/10681Tape Carrier Package [TCP] Flexible sheet connector H05K2201/10689Leaded Integrated Circuit [IC] package H05K2201/10696Single-in-line [SIL] package H05K2201/10704Pin grid array [PGA] H05K2201/10712Via grid array H05K2201/10719Land grid array [LGA] H05K2201/10727Leadless chip carrier [LCC] H05K2201/10734Ball grid array [BGA] Bump grid array H05K2201/10742Details of leads H05K2201/1075Shape details H05K2201/10757Bent leads H05K2201/10765Leads folded back H05K2201/10772Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering H05K2201/1078Leads having locally deformed portion H05K2201/10787Leads having protrusions H05K2201/10795Details of lead tips H05K2201/10803Tapered leads H05K2201/1081Special cross-section of a lead Different cross-sections of different leads Matching cross-section H05K2201/10818Flat leads H05K2201/10825Distorted or twisted flat leads H05K2201/10833having a curved or folded cross-section H05K2201/1084Notched leads H05K2201/10848Thinned leads H05K2201/10856Divided leads H05K2201/10863Adaptations of leads or holes for facilitating insertion H05K2201/10871Leads having an integral insert stop H05K2201/10878Means for retention of a lead in a hole H05K2201/10886Other details H05K2201/10893Grouped leads H05K2201/10901Lead partly inserted in hole or via H05K2201/10909Materials of terminal H05K2201/10916Terminals having auxiliary metallic piece H05K2201/10924Leads formed from a punched metal foil H05K2201/10931Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead H05K2201/10939Lead of component used as a connector H05K2201/10946Leads attached onto leadless component after manufacturing the component H05K2201/10954Other details of electrical connections H05K2201/10962Component not directly connected to the PCB H05K2201/10969Metallic case or integral heatsink of component electrically connected to a pad on PCB H05K2201/10977Encapsulated connections H05K2201/10984Component carrying a connection agent H05K2201/10992Using different connection materials H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10 H05K2201/2009Reinforced areas H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly H05K2201/2027Guiding means H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly H05K2201/2045Protection against vibrations H05K2201/2054Light-reflecting surface H05K2201/2063mixed adhesion layer containing metallic/inorganic and polymeric materials H05K2201/2072Anchoring H05K2201/2081Compound repelling a metal H05K2201/209Auto-mechanical connection between a component and a PCB or between two PCBs