Apparatus for connecting with build-up interconnects

Industry

CPC
H01L24/76

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/76Apparatus for connecting with build-up interconnects

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
- Patent number 11,881,466
- Issue date Jan 23, 2024
- Orbotech Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck design and method for wafer
- Patent number 11,587,818
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating interconnect for silicon chip
- Patent number 10,755,940
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Jerard Canuto Malado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-based additive manufacturing system for 3D structural ele...
- Patent number 10,748,867
- Issue date Aug 18, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device processing method for material removal
- Patent number 10,600,652
- Issue date Mar 24, 2020
- Deca Technologies Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 10,090,238
- Issue date Oct 2, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrostatic spraying or electrostatic co...
- Patent number 9,831,187
- Issue date Nov 28, 2017
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 9,589,894
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrostatic spraying or electrostatic co...
- Patent number 9,589,907
- Issue date Mar 7, 2017
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling electric components on a flexib...
- Patent number 9,338,894
- Issue date May 10, 2016
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 8,969,197
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,945,986
- Issue date Feb 3, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing an electronic module, and el...
- Patent number 8,846,456
- Issue date Sep 30, 2014
- Siemens Aktiengesellschaft
- Karl Weidner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,816,513
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring forming method
- Patent number 8,048,691
- Issue date Nov 1, 2011
- Konica Minolta Holdings, Inc.
- Yasuo Nishi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device package and electronic equipment
- Patent number 7,964,955
- Issue date Jun 21, 2011
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,955,873
- Issue date Jun 7, 2011
- Infineon Technologies AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring module
- Patent number 7,952,888
- Issue date May 31, 2011
- Canon Kabushiki Kaisha
- Nobuhito Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer assembly for manufacturing electronic devices
- Patent number 7,931,063
- Issue date Apr 26, 2011
- Alien Technology Corporation
- Gordon S. W. Craig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic board and multilayer wiring board
- Patent number 7,805,836
- Issue date Oct 5, 2010
- Seiko Epson Corporation
- Tsuyoshi Shintate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting an electronic element on a wiring board
- Patent number 7,454,831
- Issue date Nov 25, 2008
- Seiko Epson Corporation
- Hirofumi Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and electronic equipment
- Patent number 7,385,280
- Issue date Jun 10, 2008
- Seiko Epson Corporation
- Wataru Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20220359260
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USIN...
- Publication number 20220223562
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jung Hyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...
- Publication number 20220139866
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun Di HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnection Of Circuit Elements On A Substrate Witho...
- Publication number 20210028141
- Publication date Jan 28, 2021
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chuck Design and Method for Wafer
- Publication number 20210020492
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING INTERCONNECT FOR SILICON CHIP
- Publication number 20200027737
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jerard Canuto Malado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20140210089
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20130307150
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELE...
- Publication number 20130170171
- Publication date Jul 4, 2013
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUC...
- Publication number 20120298401
- Publication date Nov 29, 2012
- POSTECH Academy-Industry Foundation
- Jung Ho Je
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING FORMING METHOD
- Publication number 20110111588
- Publication date May 12, 2011
- Konica Minolta Holdings, Inc.
- Yasuo Nishi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20100248475
- Publication date Sep 30, 2010
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for manufacturing an electronic module, and el...
- Publication number 20100187700
- Publication date Jul 29, 2010
- Karl Weidner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELE...
- Publication number 20100140811
- Publication date Jun 10, 2010
- Vertical Circuits, Inc.
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming three-dimensional structure, method for manufact...
- Publication number 20100078824
- Publication date Apr 1, 2010
- FUJIFILM CORPORATION
- Kazuaki Okamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Formed by Pulsed Dispense
- Publication number 20090068790
- Publication date Mar 12, 2009
- Vertical Circuits, Inc.
- Terrence Caskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transfer assembly for manufacturing electronic devices
- Publication number 20080156445
- Publication date Jul 3, 2008
- Gordon S.W. Craig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Sensor Component Comprising Protected Feeders, and Me...
- Publication number 20080148861
- Publication date Jun 26, 2008
- Gottfried Beer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD
- Publication number 20080119067
- Publication date May 22, 2008
- SEIKO EPSON CORPORATION
- Tsuyoshi SHINTATE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring module, method and apparatus for manufacturing wiring module
- Publication number 20070286946
- Publication date Dec 13, 2007
- Canon Kabushiki Kaisha
- Nobuhito Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Programmed material consolidation methods employing machine vision
- Publication number 20070124012
- Publication date May 31, 2007
- Warren M. Farnworth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device structures that include sacrificial, readily r...
- Publication number 20070123058
- Publication date May 31, 2007
- Warren M. Farnworth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Selective consolidation methods for fabricating semiconductor devic...
- Publication number 20070062033
- Publication date Mar 22, 2007
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Apparatus for connecting with build-up interconnects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical interconnection of circuit elements on a substrate witho...

Method for producing an electrically conductive connection on a sub...

Chuck design and method for wafer

Bare die integration with printed components on flexible substrate...

Method and fixture for chip attachment to physical objects

Precision alignment of multi-chip high density interconnects

Plating interconnect for silicon chip

Extrusion-based additive manufacturing system for 3D structural ele...

Semiconductor device processing method for material removal

Bare die integration with printed components on flexible substrate...

Wiring substrate and method for manufacturing the same

Apparatus and method for electrostatic spraying or electrostatic co...

Electrode connection structure and electrode connection method

Copper interconnect structure and its formation

Apparatus and method for electrostatic spraying or electrostatic co...

Light emitting diodes and a method of packaging the same

Method and apparatus for assembling electric components on a flexib...

Light emitting diodes and a method of packaging the same

Copper interconnect structure and its formation

Electronic assembly with three dimensional inkjet printed traces

Method and apparatus for manufacturing an electronic module, and el...

Electronic assembly with three dimensional inkjet printed traces

Wiring forming method

Electronic device package and electronic equipment

Method of fabricating a semiconductor device

Wiring module

Transfer assembly for manufacturing electronic devices

Manufacturing method of electronic board and multilayer wiring board

Method for mounting an electronic element on a wiring board

Electronic device package and electronic equipment

Patents Applicationslast 30 patents

Chuck Design and Method for Wafer

INK LEVELING DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USIN...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICO...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

Electrical Interconnection Of Circuit Elements On A Substrate Witho...

Chuck Design and Method for Wafer

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

PLATING INTERCONNECT FOR SILICON CHIP

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

Electronic Assembly with Three Dimensional Inkjet Printed Traces

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...

Electronic Assembly With Three Dimensional Inkjet Printed Traces

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

EXTRUSION-BASED ADDITIVE MANUFACTURING SYSTEM FOR 3D STRUCTURAL ELE...

METHOD FOR FABRICATING A THREE-DIMENSIONAL ULTRAFINE POLYMER CONDUC...

WIRING FORMING METHOD

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

Method and apparatus for manufacturing an electronic module, and el...

SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELE...

Method for forming three-dimensional structure, method for manufact...

Electrical Interconnect Formed by Pulsed Dispense

Transfer assembly for manufacturing electronic devices

Semiconductor Sensor Component Comprising Protected Feeders, and Me...

MANUFACTURING METHOD OF ELECTRONIC BOARD AND MULTILAYER WIRING BOARD

Wiring module, method and apparatus for manufacturing wiring module

Programmed material consolidation methods employing machine vision

Semiconductor device structures that include sacrificial, readily r...

Selective consolidation methods for fabricating semiconductor devic...