Apparatus for manufacturing bump connectors

Industry

CPC
H01L24/742

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/742Apparatus for manufacturing bump connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fluxless gang die bonding arrangement
- Patent number 11,972,968
- Issue date Apr 30, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition system and method thereof
- Patent number 11,916,036
- Issue date Feb 27, 2024
- INTLVAC INC.
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing semiconductor package structure
- Patent number 11,837,572
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Min Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable and self-healing solders for dies and components in man...
- Patent number 11,664,338
- Issue date May 30, 2023
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball jumping apparatus and ball absorption
- Patent number 11,511,363
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Sangkeun Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
- Patent number 11,450,640
- Issue date Sep 20, 2022
- Shinkawa Ltd.
- Shinsuke Tei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple module chip manufacturing arrangement
- Patent number 11,440,117
- Issue date Sep 13, 2022
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining location of power feeding point in electropl...
- Patent number 11,319,642
- Issue date May 3, 2022
- Ebara Corporation
- Mitsuhiro Shamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Combination polyimide decal with a rigid mold
- Patent number 11,270,966
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold-welded flip chip interconnect structure
- Patent number 11,165,010
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vaccum deposition system and method thereof
- Patent number 11,088,107
- Issue date Aug 10, 2021
- INTLVAC INC.
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive bump and electroless Pt plating bath
- Patent number 11,049,838
- Issue date Jun 29, 2021
- C. Uyemura & Co., Ltd.
- Takuma Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool and method of reflow
- Patent number 11,000,923
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for filling a ball grid array
- Patent number 11,004,820
- Issue date May 11, 2021
- Aurigin Technology Pte. Ltd.
- Boon Chew Ng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for determining location of power feeding point in electropl...
- Patent number 10,934,630
- Issue date Mar 2, 2021
- Ebara Corporation
- Mitsuhiro Shamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid discharge device
- Patent number 10,932,372
- Issue date Feb 23, 2021
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor fabrication apparatus and semiconductor fabrication m...
- Patent number 10,892,240
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Keiichi Niwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip fan out package and methods of forming the same
- Patent number 10,833,039
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240282611
- Publication date Aug 22, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20240066618
- Publication date Feb 29, 2024
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS CHAMBER WITH UV IRRADIANCE
- Publication number 20230294190
- Publication date Sep 21, 2023
- Yield Engineering Systems, Inc.
- Tapani Laaksonen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...
- Publication number 20230230847
- Publication date Jul 20, 2023
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230088097
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20230060603
- Publication date Mar 2, 2023
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220392868
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Min WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF
- Publication number 20220216170
- Publication date Jul 7, 2022
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless gang die bonding arrangement
- Publication number 20220005720
- Publication date Jan 6, 2022
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM DEPOSITION SYSTEM AND METHOD THEREOF
- Publication number 20210335746
- Publication date Oct 28, 2021
- INTLVAC INC.
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
- Publication number 20210151402
- Publication date May 20, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...
- Publication number 20210148000
- Publication date May 20, 2021
- EBARA CORPORATION
- Mitsuhiro SHAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISCHARGING FLUID
- Publication number 20210144863
- Publication date May 13, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multiple module chip manufacturing arrangement
- Publication number 20210098401
- Publication date Apr 1, 2021
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20200373267
- Publication date Nov 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FILLING A BALL GRID ARRAY
- Publication number 20200194400
- Publication date Jun 18, 2020
- AURIGIN TECHNOLOGY PTE LTD
- Boon Chew Ng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACCUM DEPOSITION SYSTEM AND METHOD THEREOF
- Publication number 20200051946
- Publication date Feb 13, 2020
- Michael Nagy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRETCHABLE AND SELF-HEALING SOLDERS FOR DIES AND COMPONENTS IN MAN...
- Publication number 20200043880
- Publication date Feb 6, 2020
- Anwar A. Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH
- Publication number 20200020660
- Publication date Jan 16, 2020
- C. Uyemura & Co., Ltd.
- Takuma MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing bump connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluxless gang die bonding arrangement

Vacuum deposition system and method thereof

Method of using processing oven

Apparatus and method for manufacturing semiconductor package structure

Stretchable and self-healing solders for dies and components in man...

Method of applying conductive adhesive and manufacturing device usi...

Conductive external connector structure and method of forming

Ball jumping apparatus and ball absorption

Method of using processing oven

Method of using a processing oven

Wire bonding apparatus and manufacturing method for semiconductor a...

Multiple module chip manufacturing arrangement

Method for determining location of power feeding point in electropl...

Combination polyimide decal with a rigid mold

Method for discharging fluid

Packaged microelectronic devices having stacked interconnect elemen...

Cold-welded flip chip interconnect structure

Semiconductor wafer and method of ball drop on thin wafer with edge...

Vaccum deposition system and method thereof

Conductive bump and electroless Pt plating bath

Method of applying conductive adhesive and manufacturing device usi...

Tool and method of reflow

Apparatus and method for filling a ball grid array

Method for determining location of power feeding point in electropl...

Fluid discharge device

Semiconductor fabrication apparatus and semiconductor fabrication m...

Method of forming solder bumps

Multi-chip fan out package and methods of forming the same

Method of forming solder bumps

Method of forming solder bumps

Patents Applicationslast 30 patents

FLUXLESS GANG DIE BONDING ARRANGEMENT

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

REPAIR OF SOLDER BUMPS

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

METHOD OF USING PROCESSING OVEN

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

PROCESS CHAMBER WITH UV IRRADIANCE

ELECTRO-OXIDATIVE METAL REMOVAL ACCOMPANIED BY PARTICLE CONTAMINATI...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM

METHOD OF USING PROCESSING OVEN

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

Fluxless gang die bonding arrangement

VACUUM DEPOSITION SYSTEM AND METHOD THEREOF

COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD

METHOD FOR DETERMINING LOCATION OF POWER FEEDING POINT IN ELECTROPL...

METHOD FOR DISCHARGING FLUID

Multiple module chip manufacturing arrangement

Conductive External Connector Structure and Method of Forming

APPARATUS AND METHOD FOR FILLING A BALL GRID ARRAY

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

VACCUM DEPOSITION SYSTEM AND METHOD THEREOF

STRETCHABLE AND SELF-HEALING SOLDERS FOR DIES AND COMPONENTS IN MAN...

CONDUCTIVE BUMP AND ELECTROLESS Pt PLATING BATH