Apparatus for manufacturing layer connectors

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CPC
H01L24/743

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/743Apparatus for manufacturing layer connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package having metal thermal interface material
- Patent number 12,119,237
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Producing apparatus
- Patent number 11,784,158
- Issue date Oct 10, 2023
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing electronic device using device chip
- Patent number 11,749,636
- Issue date Sep 5, 2023
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki Kitazawa
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,315,846
- Issue date Apr 26, 2022
- Namics Corporation
- Hiroki Myodo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 11,164,842
- Issue date Nov 2, 2021
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System for applying interface materials
- Patent number 11,014,203
- Issue date May 25, 2021
- Mark D. Kittel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining a surface-mount component to a substrate with sol...
- Patent number 10,879,211
- Issue date Dec 29, 2020
- RSM Electron Power, Inc.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for a semiconductor device having bi-material...
- Patent number 10,784,188
- Issue date Sep 22, 2020
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application mechanism, application apparatus, method for manufactur...
- Patent number 10,751,747
- Issue date Aug 25, 2020
- NTN Corporation
- Akihiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 10,741,519
- Issue date Aug 11, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,714,415
- Issue date Jul 14, 2020
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach processes for semiconductor packages
- Patent number 10,685,853
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejection device
- Patent number 10,632,491
- Issue date Apr 28, 2020
- Sekisui Chemical Co., Ltd.
- Michihisa Ueda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for manufacturing electronic device using devi...
- Patent number 10,461,058
- Issue date Oct 29, 2019
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki Kitazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed three-dimensional (3D) functional part and method of making
- Patent number 10,462,907
- Issue date Oct 29, 2019
- President and Fellows of Harvard College
- Jennifer A. Lewis
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 10,438,918
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for semiconductor device having bi-material d...
- Patent number 10,366,944
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,283,481
- Issue date May 7, 2019
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,444
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure including interconnecs and packaging method the...
- Patent number 10,236,273
- Issue date Mar 19, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...
- Publication number 20240371656
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Li KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240282611
- Publication date Aug 22, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...
- Publication number 20240153907
- Publication date May 9, 2024
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF
- Publication number 20230420406
- Publication date Dec 28, 2023
- KULICKE AND SOFFA HI-TECH CO., LTD.
- Lu-Min Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCING APPARATUS AND PRE-BONDING DEVICE
- Publication number 20220122939
- Publication date Apr 21, 2022
- GALLANT MICRO. MACHINING CO., LTD.
- TUN-CHIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP
- Publication number 20210335747
- Publication date Oct 28, 2021
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki KITAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210272924
- Publication date Sep 2, 2021
- KIOXIA Corporation
- Masaharu TAKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...
- Publication number 20210082868
- Publication date Mar 18, 2021
- RSM ELECTRON POWER, INC.
- Robert Conte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems And Methods Of Applying Materials to Components
- Publication number 20210028142
- Publication date Jan 28, 2021
- Laird Technologies, Inc.
- Jason L. STRADER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LID ATTACH PROCESS AND DISPENSER HEAD
- Publication number 20200286748
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200227329
- Publication date Jul 16, 2020
- Namics Corporation
- Hiroki MYODO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVI...
- Publication number 20200006279
- Publication date Jan 2, 2020
- Hiroyuki KITAZAWA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20190385971
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for a Semiconductor Device Having Bi-Material...
- Publication number 20190304881
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20190229086
- Publication date Jul 25, 2019
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190221509
- Publication date Jul 18, 2019
- RENESAS ELECTRONICS CORPORATION
- Eiji HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVI...
- Publication number 20190067237
- Publication date Feb 28, 2019
- SHASHIN KAGAKU CO., LTD.
- Hiroyuki KITAZAWA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...
- Publication number 20190060948
- Publication date Feb 28, 2019
- NTN CORPORATION
- Akihiro YAMANAKA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Systems And Methods Of Applying Thermal Interface Materials
- Publication number 20190013291
- Publication date Jan 10, 2019
- Laird Technologies, Inc.
- Jason L. STRADER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus for Semiconductor Device Having Bi-Material D...
- Publication number 20180277463
- Publication date Sep 27, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL...
- Publication number 20180277461
- Publication date Sep 27, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20180047699
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20170271306
- Publication date Sep 21, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Chong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS
- Publication number 20170175285
- Publication date Jun 22, 2017
- EBARA CORPORATION
- Yoshio MINAMI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR BONDING SUBSTRATES
- Publication number 20170117247
- Publication date Apr 27, 2017
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LID ATTACH PROCESSES FOR SEMICONDUCTOR PACKAGES
- Publication number 20170076960
- Publication date Mar 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EJECTION DEVICE
- Publication number 20160368015
- Publication date Dec 22, 2016
- Sekisui Chemical Co., Ltd.
- Michihisa Ueda
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF DISPENSING MATERIAL BASED ON EDGE DETECTION
- Publication number 20160321801
- Publication date Nov 3, 2016
- Illinois Tool Works Inc.
- Jonathan Joel Bloom
- G06 - COMPUTING CALCULATING COUNTING

Apparatus for manufacturing layer connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package having metal thermal interface material

Systems of applying materials to components

Substrate bonding apparatus and method of manufacturing a semicondu...

Lid attach process and dispenser head

Bonding apparatus and bonding method

Producing apparatus

Apparatus for manufacturing electronic device using device chip

Method of applying conductive adhesive and manufacturing device usi...

Semiconductor device

Bonding apparatus and bonding system

Method for producing an integral join and automatic placement machine

System for applying interface materials

Method of applying conductive adhesive and manufacturing device usi...

Device packaging facility and method, and device processing apparat...

Method of joining a surface-mount component to a substrate with sol...

Methods and apparatus for a semiconductor device having bi-material...

Systems and methods for improved delamination characteristics in a...

Application mechanism, application apparatus, method for manufactur...

Systems of applying materials to components

Semiconductor device and method of manufacturing the same

Lid attach processes for semiconductor packages

Liquid ejection device

Method for producing a connecting medium on an assembly partner, me...

Method and apparatus for manufacturing electronic device using devi...

Printed three-dimensional (3D) functional part and method of making

Bonding apparatus and bonding system

Methods and apparatus for semiconductor device having bi-material d...

Device packaging facility and method, and device processing apparat...

Semiconductor device and method of manufacturing the same

Packaging structure including interconnecs and packaging method the...

Patents Applicationslast 30 patents

METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

BONDING MATERIAL APPLICATION APPARATUS AND BONDING MATERIAL APPLICA...

FERROMAGNETIC CONTROL OF WAFER BONDING

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...

INTELLIGENT DISPENSING ADJUSTMENT SYSTEM AND METHOD THEREOF

PRODUCING APPARATUS AND PRE-BONDING DEVICE

APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVICE CHIP

BONDING APPARATUS AND BONDING METHOD

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOL...

Systems And Methods Of Applying Materials to Components

LID ATTACH PROCESS AND DISPENSER HEAD

SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVI...

BONDING APPARATUS AND BONDING SYSTEM

Methods and Apparatus for a Semiconductor Device Having Bi-Material...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE USING DEVI...

APPLICATION MECHANISM, APPLICATION APPARATUS, METHOD FOR MANUFACTUR...

Systems And Methods Of Applying Thermal Interface Materials

Methods and Apparatus for Semiconductor Device Having Bi-Material D...

METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL...

BONDING APPARATUS AND BONDING SYSTEM

PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF

PLATING APPARATUS

METHOD FOR BONDING SUBSTRATES

LID ATTACH PROCESSES FOR SEMICONDUCTOR PACKAGES

LIQUID EJECTION DEVICE

METHOD OF DISPENSING MATERIAL BASED ON EDGE DETECTION