Apparatus for manufacturing means for bonding

Industry

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H01L24/741

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/741Apparatus for manufacturing means for bonding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting components on a substrate
- Patent number 11,924,974
- Issue date Mar 5, 2024
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for transfer of micro-devices
- Patent number 11,843,025
- Issue date Dec 12, 2023
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 11,813,688
- Issue date Nov 14, 2023
- LASERSSEL CO., LTD.
- Jae Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 11,696,429
- Issue date Jul 4, 2023
- Besi Switzerland AG
- Norbert Bilewicz
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding apparatus and method and substrate bonding apparatus an...
- Patent number 11,600,593
- Issue date Mar 7, 2023
- Semes Co., Ltd.
- Hanglim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of attaching die to substrate using compliant die attach sy...
- Patent number 11,557,567
- Issue date Jan 17, 2023
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and manufacturing apparatus for stacked substr...
- Patent number 11,362,059
- Issue date Jun 14, 2022
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for transfer of micro-devices
- Patent number 11,251,226
- Issue date Feb 15, 2022
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant die attach systems having spring-driven bond tools
- Patent number 11,134,595
- Issue date Sep 28, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mounting components on a substrate
- Patent number 10,973,158
- Issue date Apr 6, 2021
- Besi Switzerland AG
- Norbert Bilewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus for three-dimensional molded sculptures
- Patent number 10,748,773
- Issue date Aug 18, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for transfer of micro-devices
- Patent number 10,692,923
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for correcting solder bump
- Patent number 10,681,822
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertically die-stacked bonder and method using the same
- Patent number 10,643,968
- Issue date May 5, 2020
- GALLANT MICRO. MACHNING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of micro-devices into system substrate
- Patent number 10,468,472
- Issue date Nov 5, 2019
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Vertically die-stacked bonder and method using the same
- Patent number 10,438,917
- Issue date Oct 8, 2019
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding flexible part including inclined leads
- Patent number 10,384,286
- Issue date Aug 20, 2019
- PROTEC CO., LTD.
- Moo Sup Shim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding device
- Patent number 10,361,166
- Issue date Jul 23, 2019
- Shinkawa Ltd.
- Osamu Kakutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for transfer of micro-devices
- Patent number 10,032,827
- Issue date Jul 24, 2018
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 9,974,191
- Issue date May 15, 2018
- Hitachi Kokusai Electric Inc.
- Yasutoshi Tsubota
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 9,859,244
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die coupled to a thermally co...
- Patent number 9,589,860
- Issue date Mar 7, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20240033840
- Publication date Feb 1, 2024
- LASERSSEL CO., LTD.
- Jae Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for mounting components on a substrate
- Publication number 20230284426
- Publication date Sep 7, 2023
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING
- Publication number 20230067088
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dynamic Bonding Gap Control and Tool for Wafer Bonding
- Publication number 20230019415
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR TRANSFER OF MICRO-DEVICES
- Publication number 20220165789
- Publication date May 26, 2022
- APPLIED MATERIALS, INC.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220045029
- Publication date Feb 10, 2022
- SEMES CO., LTD.
- Gil Yong MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20210392802
- Publication date Dec 16, 2021
- Assembleon B.V.
- Rudolphus H. Hoefs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting components on a substrate
- Publication number 20210195816
- Publication date Jun 24, 2021
- Besi Switzerland AG
- Norbert BILEWICZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES
- Publication number 20210013258
- Publication date Jan 14, 2021
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES
- Publication number 20200335344
- Publication date Oct 22, 2020
- LASERSSEL CO., LTD.
- Jae Joon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...
- Publication number 20200273836
- Publication date Aug 27, 2020
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND MEHOD AND SUBSTRATE BONDING APPARATUS AND...
- Publication number 20200126948
- Publication date Apr 23, 2020
- SEMES CO., LTD.
- HANGLIM LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...
- Publication number 20200077550
- Publication date Mar 5, 2020
- Assembleon B.V.
- Rudolphus H. Hoefs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY DIE-STACKED BONDER AND METHOD USING THE SAME
- Publication number 20190378811
- Publication date Dec 12, 2019
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES
- Publication number 20190244818
- Publication date Aug 8, 2019
- CRUCIAL MACHINES CO., LTD.
- Jae Joon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CORRECTION METHOD
- Publication number 20190132960
- Publication date May 2, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS
- Publication number 20190001426
- Publication date Jan 3, 2019
- PROTEC CO., LTD.
- MOO SUP SHIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY DIE-STACKED BONDER AND METHOD USING THE SAME
- Publication number 20180323165
- Publication date Nov 8, 2018
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES
- Publication number 20180315793
- Publication date Nov 1, 2018
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for mounting components on a substrate
- Publication number 20180317353
- Publication date Nov 1, 2018
- Besi Switzerland AG
- Norbert BILEWICZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS
- Publication number 20180164171
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- YOUNGHO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
- Publication number 20180151804
- Publication date May 31, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES
- Publication number 20180006083
- Publication date Jan 4, 2018
- Applied Materials, Inc.
- Mingwei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...
- Publication number 20170278817
- Publication date Sep 28, 2017
- International Business Machines Corporation
- Eric J. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE
- Publication number 20170053889
- Publication date Feb 23, 2017
- SHINKAWA LTD.
- OSAMU KAKUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATE...
- Publication number 20170023617
- Publication date Jan 26, 2017
- TRANSLARITY, INC.
- Jens Ruffler
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR EUTECTIC BONDING
- Publication number 20150235982
- Publication date Aug 20, 2015
- ROBERT BOSCH GmbH
- Ralf HAUSNER
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing means for bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Apparatus for mounting components on a substrate

Methods for transfer of micro-devices

Laser bonding apparatus for three-dimensional molded sculptures

Apparatus and method for mounting components on a substrate

Method of applying conductive adhesive and manufacturing device usi...

Die bonding apparatus and method and substrate bonding apparatus an...

Methods of attaching die to substrate using compliant die attach sy...

Manufacturing method and manufacturing apparatus for stacked substr...

Systems and methods for transfer of micro-devices

Compliant die attach systems having spring-driven bond tools

Method of applying conductive adhesive and manufacturing device usi...

Apparatus and method for mounting components on a substrate

Method for bonding wafers and bonding tool

Laser bonding apparatus for three-dimensional molded sculptures

Systems and methods for transfer of micro-devices

Method for correcting solder bump

Vertically die-stacked bonder and method using the same

Bonding method

Integration of micro-devices into system substrate

Vertically die-stacked bonder and method using the same

Chip alignment utilizing superomniphobic surface treatment of silic...

Method for bonding flexible part including inclined leads

Bonding device

Systems and methods for transfer of micro-devices

Method of manufacturing semiconductor device, substrate processing...

Apparatus for eutectic bonding

Electronic devices with semiconductor die attached with sintered me...

Chip alignment utilizing superomniphobic surface treatment of silic...

Electronic devices with semiconductor die coupled to a thermally co...

Patents Applicationslast 30 patents

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

Apparatus for mounting components on a substrate

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

Dynamic Bonding Gap Control and Tool for Wafer Bonding

METHODS FOR TRANSFER OF MICRO-DEVICES

BONDING APPARATUS AND BONDING METHOD

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

Apparatus and method for mounting components on a substrate

SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL STRUCTURES

MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTR...

DIE BONDING APPARATUS AND MEHOD AND SUBSTRATE BONDING APPARATUS AND...

COMPLIANT DIE ATTACH TOOLS, DIE ATTACH SYSTEMS, AND METHODS OF USIN...

VERTICALLY DIE-STACKED BONDER AND METHOD USING THE SAME

LASER BONDING APPARATUS FOR THREE-DIMENSIONAL MOLDED SCULPTURES

METHOD FOR BONDING WAFERS AND BONDING TOOL

SOLDER BUMP CORRECTION METHOD

METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

VERTICALLY DIE-STACKED BONDER AND METHOD USING THE SAME

SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES

Apparatus and method for mounting components on a substrate

METHOD OF CORRECTING ESTIMATED FORCE OF BONDING APPARATUS

INTEGRATION OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

SYSTEMS AND METHODS FOR TRANSFER OF MICRO-DEVICES

CHIP ALIGNMENT UTILIZING SUPEROMNIPHOBIC SURFACE TREATMENT OF SILIC...

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

BONDING DEVICE

SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATE...

APPARATUS FOR EUTECTIC BONDING