Apparatus for manufacturing strap connectors

Industry

CPC
H01L24/744

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/744Apparatus for manufacturing strap connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing a semicondu...
- Patent number 12,002,700
- Issue date Jun 4, 2024
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configuration and method for contacting circuit structure
- Patent number 7,245,026
- Issue date Jul 17, 2007
- Infineon Technologies AG
- Rudolf Lehner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...
- Publication number 20240021436
- Publication date Jan 18, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265243
- Publication date Aug 26, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi KURAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...
- Publication number 20200273833
- Publication date Aug 27, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Strap bonding machine and method of manufacturing a semiconductor d...
- Publication number 20060016855
- Publication date Jan 26, 2006
- Kabushiki Kaisha Toshiba
- Shigeru Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Configuration and method for the contacting of circuits
- Publication number 20020173081
- Publication date Nov 21, 2002
- Rudolf Lehner
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for manufacturing strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing a semicondu...

Semiconductor device

Clip bond semiconductor packages and assembly tools

Electronic module, method of manufacturing connector, and method of...

Semiconductor device

Electrode terminal, semiconductor device, and power conversion appa...

Configuration and method for contacting circuit structure

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CON...

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF...

Strap bonding machine and method of manufacturing a semiconductor d...

Configuration and method for the contacting of circuits