Apparatus for mounting on conductive members

Industry

CPC
H01L21/67144

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67144Apparatus for mounting on conductive members

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Die-bonding machine
- Patent number 12,272,584
- Issue date Apr 8, 2025
- SHENZHEN XINYICHANG TECHNOLOGY CO., LTD
- Xinrong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adjusting a tilt between a bonding tool assembly and a s...
- Patent number 12,266,556
- Issue date Apr 1, 2025
- Kulicke and Soffa Industries, Inc.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for handling microelectronic devices
- Patent number 12,251,841
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Kuan Wei Tseng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multi-level micro-device tethers
- Patent number 12,249,532
- Issue date Mar 11, 2025
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer structure and manufacturing method thereof, transfer devic...
- Patent number 12,249,524
- Issue date Mar 11, 2025
- BOE Technology Group Co., Ltd.
- Yang Yue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-board cleaning of tooling parts in hybrid bonding tool
- Patent number 12,237,186
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Ruiping Wang
- B08 - CLEANING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning unit and substrate processing apparatus including same
- Patent number 12,165,885
- Issue date Dec 10, 2024
- Semes Co., Ltd.
- Sok Taek Lim
- B08 - CLEANING
Information Patent Grant
Dispenser for micro LED suspension and method of transferring micro...
- Patent number 12,165,890
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device mass transfer tool
- Patent number 12,131,922
- Issue date Oct 29, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting method
- Patent number 12,125,887
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fencheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive transfer stamp and method for transferring a semiconductor...
- Patent number 12,106,980
- Issue date Oct 1, 2024
- Osram Opto Semiconductors GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collet structure and semiconductor fabricating apparatus including...
- Patent number 12,106,996
- Issue date Oct 1, 2024
- SK Hynix Inc.
- Jung Bum Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanofabrication and design techniques for 3D ICs and configurable A...
- Patent number 12,079,557
- Issue date Sep 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heater assembly and bonding head including same
- Patent number 12,082,313
- Issue date Sep 3, 2024
- Semes Co., Ltd.
- Soon Hyun Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High density pick and sequential place transfer process and tool
- Patent number 12,057,331
- Issue date Aug 6, 2024
- Apple Inc.
- Hyeun-Su Kim
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 12,057,337
- Issue date Aug 6, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor device and method of manu...
- Patent number 12,051,604
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection unit of a transfer device for transferring components be...
- Patent number 12,046,491
- Issue date Jul 23, 2024
- Muehlbauer GmbH & Co. KG
- Konrad Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip matching system and method thereof
- Patent number 12,046,494
- Issue date Jul 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device of micro-elements and manufacturing method thereof
- Patent number 12,027,408
- Issue date Jul 2, 2024
- CHENGDU VISTAR OPTOELECTRONICS CO., LTD.
- Bo Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20250096017
- Publication date Mar 20, 2025
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250069918
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO...
- Publication number 20250069919
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
- Publication number 20250022727
- Publication date Jan 16, 2025
- ASMPT SINGAPORE PTE. LTD
- Ka Shing KWAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
- Publication number 20250014921
- Publication date Jan 9, 2025
- SHINKAWA LTD.
- Kohei SEYAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20250015039
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Tatsuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD
- Publication number 20240429073
- Publication date Dec 26, 2024
- TOKYO ELECTRON LIMITED
- Susumu HAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...
- Publication number 20240429199
- Publication date Dec 26, 2024
- Intel Corporation
- Yi Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD
- Publication number 20240404864
- Publication date Dec 5, 2024
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED DISPLAY MANUFACTURING APPARATUS
- Publication number 20240395577
- Publication date Nov 28, 2024
- LG ELECTRONICS INC.
- Junghun RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY
- Publication number 20240395578
- Publication date Nov 28, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE
- Publication number 20240371664
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRA...
- Publication number 20240371663
- Publication date Nov 7, 2024
- ASTI GLOBAL INC., TAIWAN
- CHIEN-SHOU LIAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE PICK-UP APPARATUS AND METHODS FOR USING THE SAME
- Publication number 20240363388
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsin Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...
- Publication number 20240363446
- Publication date Oct 31, 2024
- Venkatakaushik VOLETI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING COMPONENTS TO SUBSTRATE POSTS
- Publication number 20240349431
- Publication date Oct 17, 2024
- X Display Company Technology Limited
- David Gomez
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240339335
- Publication date Oct 10, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC CHIP PICK-AND-PLACE APPARATUS AND FORMATION METHOD THEREOF
- Publication number 20240335958
- Publication date Oct 10, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Shan ZHAO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20240339345
- Publication date Oct 10, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MANIPULATING A MICROMETRIC DEVICE
- Publication number 20240332057
- Publication date Oct 3, 2024
- Aledia
- Hugues LEBRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE APPARATUS AND METHOD
- Publication number 20240321607
- Publication date Sep 26, 2024
- NEXPERIA B.V.
- Tim Ellenbroek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE AND MANUFACTURING METHOD
- Publication number 20240313152
- Publication date Sep 19, 2024
- Aledia
- Ivan-Christophe ROBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD
- Publication number 20240312813
- Publication date Sep 19, 2024
- NEXPERIA B.V.
- Johannes Hubertus Antonius van de Rijdt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240304475
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS GANG DIE BONDING ARRANGEMENT
- Publication number 20240304485
- Publication date Sep 12, 2024
- SHARPACK TECHNOLOGY PTE. LTD.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for mounting on conductive members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die-bonding machine

Methods of adjusting a tilt between a bonding tool assembly and a s...

Component mounting system and component mounting method

Apparatuses for handling microelectronic devices

Multi-level micro-device tethers

Transfer structure and manufacturing method thereof, transfer devic...

Substrate for manufacturing display device and method for manufactu...

Die bonding system with heated automatic collet changer

On-board cleaning of tooling parts in hybrid bonding tool

Component conveying instrument with an adjusting unit and method of...

Assembly board for use in a display manufacturing method

Methods of parallel transfer of micro-devices using treatment

Cleaning unit and substrate processing apparatus including same

Dispenser for micro LED suspension and method of transferring micro...

Mounting device and mounting method

Micro device mass transfer tool

Chip-transferring system and chip-transferring method

Mounting apparatus and mounting method

Adhesive transfer stamp and method for transferring a semiconductor...

Method of chip transferring and device/module having gas guiding st...

Collet structure and semiconductor fabricating apparatus including...

Nanofabrication and design techniques for 3D ICs and configurable A...

Heater assembly and bonding head including same

High density pick and sequential place transfer process and tool

Chip transferring method and the apparatus thereof

Apparatus for manufacturing semiconductor device and method of manu...

Inspection unit of a transfer device for transferring components be...

Bonding head for mounting components and die bonder with such a bon...

Chip matching system and method thereof

Transfer device of micro-elements and manufacturing method thereof

Patents Applicationslast 30 patents

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR

MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM

BONDING DEVICE AND BONDING METHOD

PROCESSING SYSTEM, ELECTROSTATIC CARRIER, AND PROCESSING METHOD

METHODS AND APPARATUS FOR SELF-ALIGNING BATCH PICK AND PLACE DIE BO...

MICRO-ELEMENT, ALIGNMENT SYSTEM AND ASSEMBLING METHOD

MICRO-LED DISPLAY MANUFACTURING APPARATUS

TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

CHIP TRANSFERRING AND BONDING DEVICE

TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRA...

PACKAGE PICK-UP APPARATUS AND METHODS FOR USING THE SAME

Integrated Inspection for Enhanced Hybrid Bonding Yield in Advanced...

PRINTING COMPONENTS TO SUBSTRATE POSTS

SINTER BONDING SHEET

AUTOMATIC CHIP PICK-AND-PLACE APPARATUS AND FORMATION METHOD THEREOF

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

METHOD AND SYSTEM FOR MANIPULATING A MICROMETRIC DEVICE

PICK-AND-PLACE APPARATUS AND METHOD

OPTOELECTRONIC DEVICE AND MANUFACTURING METHOD

ELECTRONIC COMPONENT TRANSFER SYSTEM AND METHOD

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

FLUXLESS GANG DIE BONDING ARRANGEMENT