Apparatus for mounting on conductive members

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CPC
H01L21/67144

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67144Apparatus for mounting on conductive members

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pick and placement of semiconductor chips based on nozzleless self-...
- Patent number 12,362,205
- Issue date Jul 15, 2025
- University of Southern California
- Eun Sok Kim
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device
- Patent number 12,341,035
- Issue date Jun 24, 2025
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guide unit, transfer assembly and die bonding apparatus including t...
- Patent number 12,334,381
- Issue date Jun 17, 2025
- Semes Co., Ltd.
- Do-Youn Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adjusting chip mounting position, apparatus, medium, and...
- Patent number 12,327,740
- Issue date Jun 10, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for correcting movement amount of bond...
- Patent number 12,308,273
- Issue date May 20, 2025
- Shinkawa Ltd.
- Makoto Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for protecting an optoelectronic device against electrostati...
- Patent number 12,300,521
- Issue date May 13, 2025
- Aledia
- Frédéric Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer system and a fixture thereof adaptable to performing level...
- Patent number 12,293,929
- Issue date May 6, 2025
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mass transfer of mini light-emitting diodes (mini-LEDs)...
- Patent number 12,289,932
- Issue date Apr 29, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating die attach systems
- Patent number 12,288,711
- Issue date Apr 29, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonding machine
- Patent number 12,272,584
- Issue date Apr 8, 2025
- SHENZHEN XINYICHANG TECHNOLOGY CO., LTD
- Xinrong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of adjusting a tilt between a bonding tool assembly and a s...
- Patent number 12,266,556
- Issue date Apr 1, 2025
- Kulicke and Soffa Industries, Inc.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for handling microelectronic devices
- Patent number 12,251,841
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Kuan Wei Tseng
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Multi-level micro-device tethers
- Patent number 12,249,532
- Issue date Mar 11, 2025
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer structure and manufacturing method thereof, transfer devic...
- Patent number 12,249,524
- Issue date Mar 11, 2025
- BOE Technology Group Co., Ltd.
- Yang Yue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for manufacturing display device and method for manufactu...
- Patent number 12,243,759
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Kisu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding system with heated automatic collet changer
- Patent number 12,237,202
- Issue date Feb 25, 2025
- MRSI Systems, LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-board cleaning of tooling parts in hybrid bonding tool
- Patent number 12,237,186
- Issue date Feb 25, 2025
- Applied Materials, Inc.
- Ruiping Wang
- B08 - CLEANING
Information Patent Grant
Component conveying instrument with an adjusting unit and method of...
- Patent number 12,211,721
- Issue date Jan 28, 2025
- Muehlbauer GmbH & Co. KG
- Rainer Miehlich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly board for use in a display manufacturing method
- Patent number 12,176,225
- Issue date Dec 24, 2024
- LG Electronics Inc.
- Changhyun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning unit and substrate processing apparatus including same
- Patent number 12,165,885
- Issue date Dec 10, 2024
- Semes Co., Ltd.
- Sok Taek Lim
- B08 - CLEANING
Information Patent Grant
Dispenser for micro LED suspension and method of transferring micro...
- Patent number 12,165,890
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device mass transfer tool
- Patent number 12,131,922
- Issue date Oct 29, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting method
- Patent number 12,125,887
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fencheng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive transfer stamp and method for transferring a semiconductor...
- Patent number 12,106,980
- Issue date Oct 1, 2024
- Osram Opto Semiconductors GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip transferring and device/module having gas guiding st...
- Patent number 12,106,981
- Issue date Oct 1, 2024
- MICRAFT SYSTEM PLUS CO., LTD.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAMP CLEANING DEVICE AND METHOD
- Publication number 20250235902
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- B08 - CLEANING
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20250233000
- Publication date Jul 17, 2025
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK AND PLACE APPARATUS
- Publication number 20250232991
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Minkyung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A S...
- Publication number 20250218841
- Publication date Jul 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew Tarabulski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING DISPLAY DEVICE
- Publication number 20250221125
- Publication date Jul 3, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jung Gun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAMP FOR TRANSFERRING LIGHT-EMITTING ELEMENTS AND METHOD FOR FABRI...
- Publication number 20250218820
- Publication date Jul 3, 2025
- LG Display Co., Ltd.
- Chan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD
- Publication number 20250210392
- Publication date Jun 26, 2025
- Intel Corporation
- Bhaskar Jyoti KRISHNATREYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS
- Publication number 20250201602
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gripper Head, Device, and Method for Handling and Varying the Spaci...
- Publication number 20250178847
- Publication date Jun 5, 2025
- BESI NETHERLANDS B.V.
- Mark Hermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Aligning Bonding Pads with Bonding Locations...
- Publication number 20250174594
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- Dwayne L. LaBrake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...
- Publication number 20250157978
- Publication date May 15, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20250160087
- Publication date May 15, 2025
- LG ELECTRONICS INC.
- Gunho KIM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...
- Publication number 20250140586
- Publication date May 1, 2025
- MIT SEMICONDUCTOR (TIAN JIN) CO., LTD.
- Kim Mone KWONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING MODULES
- Publication number 20250140772
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Christian Marc Lautensack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Precision Component Positioning
- Publication number 20250132177
- Publication date Apr 24, 2025
- Sangtera, Inc.
- Tairan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Optimizing Placement Process of Surface Mounters Based o...
- Publication number 20250131178
- Publication date Apr 24, 2025
- HARBIN INSTITUTE OF TECHNOLOGY
- Huijun GAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MONITORING APPARATUS FOR PACKAGE
- Publication number 20250125167
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Minyan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ELEMENT TRANSFER STAMP AND METHOD FOR MANUFACTURING...
- Publication number 20250125168
- Publication date Apr 17, 2025
- LG Display Co., Ltd.
- Bong Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK AND PLACE HEAD WITH AUTOMATIC PITCH ADJUSTMENT
- Publication number 20250114952
- Publication date Apr 10, 2025
- KLA Corporation
- Jimmy Vermeulen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
POSITIONING DEVICE AND MOUNTING DEVICE USING SAME
- Publication number 20250096016
- Publication date Mar 20, 2025
- TORAY ENGINEERING CO., LTD.
- Kenji HAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...
- Publication number 20250096017
- Publication date Mar 20, 2025
- PYXIS CF PTE. LTD.
- HWEE SENG CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD
- Publication number 20250069918
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO...
- Publication number 20250069919
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER
- Publication number 20250054785
- Publication date Feb 13, 2025
- Deca Technologies USA, Inc.
- Benedict SAN JOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...
- Publication number 20250038030
- Publication date Jan 30, 2025
- CANON KABUSIKI KAISHA
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR
- Publication number 20250022727
- Publication date Jan 16, 2025
- ASMPT SINGAPORE PTE. LTD
- Ka Shing KWAN
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for mounting on conductive members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pick and placement of semiconductor chips based on nozzleless self-...

Resin shaping device

Mounting device

Guide unit, transfer assembly and die bonding apparatus including t...

Method for adjusting chip mounting position, apparatus, medium, and...

Bonding apparatus and method for correcting movement amount of bond...

Method for protecting an optoelectronic device against electrostati...

Transfer system and a fixture thereof adaptable to performing level...

Method for mass transfer of mini light-emitting diodes (mini-LEDs)...

Methods of operating die attach systems

Die-bonding machine

Methods of adjusting a tilt between a bonding tool assembly and a s...

Component mounting system and component mounting method

Apparatuses for handling microelectronic devices

Multi-level micro-device tethers

Transfer structure and manufacturing method thereof, transfer devic...

Substrate for manufacturing display device and method for manufactu...

Die bonding system with heated automatic collet changer

On-board cleaning of tooling parts in hybrid bonding tool

Component conveying instrument with an adjusting unit and method of...

Assembly board for use in a display manufacturing method

Methods of parallel transfer of micro-devices using treatment

Cleaning unit and substrate processing apparatus including same

Dispenser for micro LED suspension and method of transferring micro...

Mounting device and mounting method

Micro device mass transfer tool

Chip-transferring system and chip-transferring method

Mounting apparatus and mounting method

Adhesive transfer stamp and method for transferring a semiconductor...

Method of chip transferring and device/module having gas guiding st...

Patents Applicationslast 30 patents

METHOD OF FABRICATING MICRO DEVICE PANEL

STAMP CLEANING DEVICE AND METHOD

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

PICK AND PLACE APPARATUS

METHODS OF ADJUSTING A TILT BETWEEN A BONDING TOOL ASSEMBLY AND A S...

METHOD AND APPARATUS FOR FABRICATING DISPLAY DEVICE

STAMP FOR TRANSFERRING LIGHT-EMITTING ELEMENTS AND METHOD FOR FABRI...

HANDLING ASSEMBLY, HANDLING SYSTEM AND METHOD

HYBRID BONDING APPARATUS

Gripper Head, Device, and Method for Handling and Varying the Spaci...

System and Method for Aligning Bonding Pads with Bonding Locations...

CHIP TRANSFER DEVICE, CHIP TRANSFER METHOD AND MAGNETIC DIE BONDING...

DEVICE FOR MANUFACTURING DISPLAY DEVICE

SYSTEM AND PROCESS FOR SORTING DIE FROM WAFER USING ANGLED WAFER TA...

METHOD FOR BUILDING MODULES

METHOD AND SYSTEM FOR DIE BONDING

Apparatus and Method for Precision Component Positioning

Method for Optimizing Placement Process of Surface Mounters Based o...

MONITORING APPARATUS FOR PACKAGE

LIGHT-EMITTING ELEMENT TRANSFER STAMP AND METHOD FOR MANUFACTURING...

PICK AND PLACE HEAD WITH AUTOMATIC PITCH ADJUSTMENT

POSITIONING DEVICE AND MOUNTING DEVICE USING SAME

APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER P...

METHOD OF BONDING CHIPS AND A SYSTEM FOR PERFORMING THE METHOD

DISPENSER FOR MICRO LED SUSPENSION AND METHOD OF TRANSFERRING MICRO...

METHOD OF SELECTIVE RELEASE OF COMPONENTS USING THERMAL RELEASE LAYER

DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...

SYSTEM INCLUDING AN ARRAY OF BONDING HEADS AND AN ARRAY OF DIE TRAN...

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

DIE BONDER HAVING A ROTARY BOND ARM ACTUATOR