Applying catalyst before applying plating resist

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CPC
H05K2203/1407

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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H05K2203/1407Applying catalyst before applying plating resist

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having copper alloy sputter seed layer and high d...
- Patent number 11,037,802
- Issue date Jun 15, 2021
- Intel Corporation
- Robert Alan May
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit boards using backing foil
- Patent number 10,765,012
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fine line manufacturing
- Patent number 10,151,980
- Issue date Dec 11, 2018
- Atotech Deutschland GmbH
- David Thomas Baron
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multilayer circuit board manufacturing process
- Patent number 6,804,881
- Issue date Oct 19, 2004
- Shipley Company, L.L.C.
- Charles R. Shipley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 6,742,250
- Issue date Jun 1, 2004
- NGK Spark Plug Co., Ltd.
- Kazuyuki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module substrate sheet, semiconductor module substrat...
- Patent number 6,733,954
- Issue date May 11, 2004
- Nissha Printing Co., Ltd.
- Kunitoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer substrates
- Patent number 6,656,314
- Issue date Dec 2, 2003
- Hewlett-Packard Development Company, L.P.
- Hannsjorg Obermaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plated PTH barrels and methods for fabricating
- Patent number 6,630,743
- Issue date Oct 7, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sequential build circuit board plating process
- Patent number 6,582,581
- Issue date Jun 24, 2003
- Shipley Company, L.L.C.
- Robert L. Goldberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Base sheet for semiconductor module, method for manufacturing base...
- Patent number 6,573,028
- Issue date Jun 3, 2003
- Nissha Printing Co., Ltd.
- Kunitoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing same
- Patent number 6,563,057
- Issue date May 13, 2003
- NEC Toppan Circuit Solutions, Inc.
- Sinichi Hotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with same surface conductors of different res...
- Patent number 5,817,405
- Issue date Oct 6, 1998
- International Business Machines Corporation
- Anikumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuitized substrate using two different metall...
- Patent number 5,707,893
- Issue date Jan 13, 1998
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing high density multi-layer integrated circuit ca...
- Patent number 5,679,498
- Issue date Oct 21, 1997
- Motorola, Inc.
- Jonathon G. Greenwood
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for patterned metallization of a substrate surface
- Patent number 5,576,073
- Issue date Nov 19, 1996
- LPKF CAD/CAM Systeme GmbH
- Joerg Kickelhain
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacture of multilayer circuit board
- Patent number 5,334,488
- Issue date Aug 2, 1994
- Shipley Company Inc.
- Charles R. Shipley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing electrical circuits with precision surface fe...
- Patent number 5,284,548
- Issue date Feb 8, 1994
- Microelectronics and Computer Technology Corporation
- David H. Carey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of multilayer circuit board
- Patent number 5,246,817
- Issue date Sep 21, 1993
- Shipley Company, Inc.
- Charles R. Shipley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of external circuitization of a circuit panel
- Patent number 5,158,645
- Issue date Oct 27, 1992
- International Business Machines, Inc.
- Kathleen L. Covert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded article with partial metal plating and a process for produci...
- Patent number 5,015,519
- Issue date May 14, 1991
- Sankyo Kasei Kabushiki Kaisha
- Tetsuo Yumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conditioning a non-conductive substrate for subsequent selective de...
- Patent number 4,948,707
- Issue date Aug 14, 1990
- International Business Machines Corporation
- Robert W. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded article with partial metal plating and a process for produci...
- Patent number 4,908,259
- Issue date Mar 13, 1990
- Sankyo Kasei Kabushiki Kaisha
- Tetsuo Yumoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacture of multilayer circuit board
- Patent number 4,902,610
- Issue date Feb 20, 1990
- Shipley Company Inc.
- Charles R. Shipley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed circuit board
- Patent number 4,876,177
- Issue date Oct 24, 1989
- Hitachi, Ltd.
- Haruo Akahoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing residual precious metal catalyst from the surfa...
- Patent number 4,874,635
- Issue date Oct 17, 1989
- General Electric Company
- Bradley R. Karas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the production of printed circuit boards
- Patent number 4,830,714
- Issue date May 16, 1989
- Bayer Aktiengesellschaft
- Kirkor Sirinyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-additive process for printed circuit boards
- Publication number 20190014667
- Publication date Jan 10, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20150271924
- Publication date Sep 24, 2015
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140151897
- Publication date Jun 5, 2014
- Samsung Electro-mechanics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...
- Publication number 20130056247
- Publication date Mar 7, 2013
- PANASONIC CORPORATION
- Shingo Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTRIC CIRCUIT DEPOSITION
- Publication number 20110292622
- Publication date Dec 1, 2011
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Arjan Hovestad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Systems and Methods for Forming Conductive Traces on Plastic Substr...
- Publication number 20090023011
- Publication date Jan 22, 2009
- Hewlett-Packard Development Company, L.P.
- Sterling Chaffins
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20030209799
- Publication date Nov 13, 2003
- International Business Machines Corporation
- Roy H. Magnuson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor module substrate sheet, semiconductor module substrat...
- Publication number 20030157437
- Publication date Aug 21, 2003
- Kunitoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing wiring substrate
- Publication number 20030000083
- Publication date Jan 2, 2003
- NGK SPARK PLUG CO., LTD.
- Kazuyuki Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Copper plated PTH barrels and methods for fabricating
- Publication number 20020195716
- Publication date Dec 26, 2002
- International Business Machines Corporation
- Roy H. Magnuson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer substrates
- Publication number 20020176961
- Publication date Nov 28, 2002
- Hannsjorg Obermaier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed circuit board and method for manufacturing same
- Publication number 20020112885
- Publication date Aug 22, 2002
- Sinichi Hotta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Applying catalyst before applying plating resist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plated metallization structures

Process for fabrication of a printed circuit board using a semi-add...

Package substrate having copper alloy sputter seed layer and high d...

Process for printed circuit boards using backing foil

Plated metallization structures

Method for fine line manufacturing

Multilayer circuit board manufacturing process

Method of manufacturing wiring substrate

Semiconductor module substrate sheet, semiconductor module substrat...

Method of manufacturing multilayer substrates

Copper plated PTH barrels and methods for fabricating

Sequential build circuit board plating process

Base sheet for semiconductor module, method for manufacturing base...

Printed circuit board and method for manufacturing same

Circuitized substrate with same surface conductors of different res...

Method of making a circuitized substrate using two different metall...

Method for producing high density multi-layer integrated circuit ca...

Method for patterned metallization of a substrate surface

Method for manufacture of multilayer circuit board

Process for producing printed wiring board

Process for producing electrical circuits with precision surface fe...

Method for manufacture of multilayer circuit board

Method of external circuitization of a circuit panel

Molded article with partial metal plating and a process for produci...

Conditioning a non-conductive substrate for subsequent selective de...

Molded article with partial metal plating and a process for produci...

Method for manufacture of multilayer circuit board

Process for producing printed circuit board

Method for removing residual precious metal catalyst from the surfa...

Process for the production of printed circuit boards

Patents Applicationslast 30 patents

Semi-Additive Process for Printed Circuit Boards

Semi-additive process for printed circuit boards

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICON...

METHOD FOR ELECTRIC CIRCUIT DEPOSITION

Systems and Methods for Forming Conductive Traces on Plastic Substr...

Copper plated PTH barrels and methods for fabricating

Semiconductor module substrate sheet, semiconductor module substrat...

Method of manufacturing wiring substrate

Copper plated PTH barrels and methods for fabricating

Method of manufacturing multilayer substrates

Printed circuit board and method for manufacturing same