Industry
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CPC
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H05K2203/00
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Sub Industries
H05K2203/01Tools for processing Objects used during processing
H05K2203/0104for patterning or coating
H05K2203/0108Male die used for patterning, punching or transferring
H05K2203/0113Female die used for patterning or transferring
H05K2203/0117Pattern shaped electrode used for patterning
H05K2203/0121Patterning
H05K2203/0126Dispenser
H05K2203/013Inkjet printing
H05K2203/0134Drum
H05K2203/0139Blade or squeegee
H05K2203/0143Using a roller Specific shape thereof Providing locally adhesive portions thereon
H05K2203/0147Carriers and holders
H05K2203/0152Temporary metallic carrier
H05K2203/0156Temporary polymeric carrier or foil
H05K2203/016Temporary inorganic, non-metallic carrier
H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing
H05K2203/0169Using a temporary frame during processing
H05K2203/0173Template for holding a PCB having mounted components thereon
H05K2203/0178Projectile
H05K2203/0182Using a temporary spacer element or stand-off during processing
H05K2203/0186Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
H05K2203/0191Using tape or non-metallic foil in a process
H05K2203/0195Tool for a process not provided for in H05K3/00
H05K2203/02Details related to mechanical or acoustic processing
H05K2203/0207Partly drilling through substrate until a controlled depth
H05K2203/0214Back-up or entry material
H05K2203/0221Perforating
H05K2203/0228Cutting, sawing, milling or shearing
H05K2203/0235Laminating followed by cutting or slicing perpendicular to plane of the laminate Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires
H05K2203/0242Cutting around hole
H05K2203/025Abrading
H05K2203/0257Brushing
H05K2203/0264Peeling insulating layer
H05K2203/0271Mechanical force other than pressure
H05K2203/0278Flat pressure
H05K2203/0285Using ultrasound
H05K2203/0292Using vibration
H05K2203/03Metal processing
H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface
H05K2203/0315Oxidising metal
H05K2203/0323Working metal substrate or core
H05K2203/033Punching metal foil
H05K2203/0338Transferring metal or conductive material other than a circuit pattern
H05K2203/0346Deburring, rounding, bevelling or smoothing conductor edges
H05K2203/0353Making conductive layer thin
H05K2203/0361Stripping a part of an upper metal layer to expose a lower metal layer
H05K2203/0369Etching selective parts of a metal substrate through part of its thickness
H05K2203/0376Etching temporary metallic carrier substrate
H05K2203/0384Etch stop layer
H05K2203/0392Pretreatment of metal
H05K2203/04Soldering or other types of metallurgic bonding
H05K2203/0405Solder foil, tape or wire
H05K2203/041Solder preforms in the shape of solder balls
H05K2203/0415Small preforms other than balls
H05K2203/042Remote solder depot on the PCB, the solder flowing to the connections from this depot
H05K2203/0425Solder powder or solder coated metal powder
H05K2203/043Reflowing of solder coated conductors, not during connection of components
H05K2203/0435Metal coated solder
H05K2203/044Solder dip coating, i.e. coating printed conductors
H05K2203/0445Removing excess solder on pads removing solder bridges
H05K2203/045Solder filled PTH during processing
H05K2203/0455PTH for surface mount device [SMD]
H05K2203/046Means for drawing solder
H05K2203/0465Shape of solder
H05K2203/047Soldering with different solders
H05K2203/0475Molten solder just before placing the component
H05K2203/048Self-alignment during soldering Terminals, pads or shape of solder adapted therefor
H05K2203/0485Tacky flux
H05K2203/049Wire bonding
H05K2203/0495Cold welding
H05K2203/05Patterning and lithography Masks Details of resist
H05K2203/0502Patterning and lithography
H05K2203/0505Double exposure of the same photosensitive layer
H05K2203/0508Flood exposure
H05K2203/0511Diffusion patterning
H05K2203/0514Photodevelopable thick film
H05K2203/0517Electrographic patterning
H05K2203/052Magnetographic patterning
H05K2203/0522Using an adhesive pattern
H05K2203/0525Patterning by phototackifying or by photopatterning adhesive
H05K2203/0528Patterning during transfer, i.e. without preformed pattern
H05K2203/0531Decalcomania
H05K2203/0534Offset printing
H05K2203/0537Transfer of pre-fabricated insulating pattern
H05K2203/054Continuous temporary metal layer over resist
H05K2203/0542Continuous temporary metal layer over metal pattern
H05K2203/0545Pattern for applying drops or paste Applying a pattern made of drops or paste
H05K2203/0548Masks
H05K2203/0551Exposure mask directly printed on the PCB
H05K2203/0554Metal used as mask for etching vias
H05K2203/0557Non-printed masks
H05K2203/056Using an artwork
H05K2203/0562Details of resist
H05K2203/0565Resist used only for applying catalyst, not for plating itself
H05K2203/0568Resist used for applying paste, ink or powder
H05K2203/0571Dual purpose resist
H05K2203/0574Stacked resist layers used for different processes
H05K2203/0577Double layer of resist having the same pattern
H05K2203/058Additional resists used for the same purpose but in different areas
H05K2203/0582Coating by resist
H05K2203/0585Second resist used as mask for selective stripping of first resist
H05K2203/0588Second resist used as pattern over first resist
H05K2203/0591Organic non-polymeric coating
H05K2203/0594Insulating resist or coating with special shaped edges
H05K2203/0597Resist applied over the edges or sides of conductors
H05K2203/06Lamination
H05K2203/061of previously made multilayered subassemblies
H05K2203/063of preperforated insulating layer
H05K2203/065Binding insulating layers without adhesive
H05K2203/066Transfer laminating of insulating material
H05K2203/068Features of the lamination press or of the lamination process
H05K2203/07Treatments involving liquids
H05K2203/0703Plating
H05K2203/0706Inactivating or removing catalyst
H05K2203/0709Catalytic ink or adhesive for electroless plating
H05K2203/0713Plating poison
H05K2203/0716Metallic plating catalysts
H05K2203/072Electroless plating
H05K2203/0723Electroplating
H05K2203/0726Electroforming
H05K2203/073Displacement plating, substitution plating or immersion plating
H05K2203/0733Method for plating stud vias
H05K2203/0736Methods for applying liquids
H05K2203/074Features related to the fluid pressure
H05K2203/0743Mechanical agitation of fluid
H05K2203/0746Local treatment using a fluid jet
H05K2203/075Global treatment of printed circuits by fluid spraying
H05K2203/0753Reversing fluid direction
H05K2203/0756Uses of liquids
H05K2203/0759Forming a polymer layer by liquid coating
H05K2203/0763Treating individual holes or single row of holes
H05K2203/0766Rinsing
H05K2203/0769Dissolving insulating materials
H05K2203/0773Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler
H05K2203/0776Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
H05K2203/0779characterised by the specific liquids involved
H05K2203/0783Using solvent
H05K2203/0786Using an aqueous solution
H05K2203/0789Aqueous acid solution
H05K2203/0793Aqueous alkaline solution
H05K2203/0796Oxidant in aqueous solution
H05K2203/08Treatments involving gases
H05K2203/081Blowing of gas
H05K2203/082Suction
H05K2203/083Evaporation or sublimation of a compound
H05K2203/085Using vacuum or low pressure
H05K2203/086Using an inert gas
H05K2203/087Using a reactive gas
H05K2203/088Using a vapour or mist
H05K2203/09Treatments involving charged particles
H05K2203/092Particle beam
H05K2203/095Plasma
H05K2203/097Corona discharge
H05K2203/10Using electric, magnetic and electromagnetic fields Using laser light
H05K2203/101Using electrical induction
H05K2203/102Using microwaves
H05K2203/104Using magnetic force
H05K2203/105Using an electrical field Special methods of applying an electric potential
H05K2203/107Using laser light
H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths
H05K2203/11Treatments characterised by their effect
H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating
H05K2203/111Preheating
H05K2203/1115Resistance heating
H05K2203/1121Cooling
H05K2203/1126Firing
H05K2203/1131Sintering
H05K2203/1136Conversion of insulating material into conductive material
H05K2203/1142Conversion of conductive material into insulating material or into dissolvable compound
H05K2203/1147Sealing or impregnating
H05K2203/1152Replicating the surface structure of a sacrificial layer
H05K2203/1157Using means for chemical reduction
H05K2203/1163Chemical reaction
H05K2203/1168Graft-polymerization
H05K2203/1173Differences in wettability
H05K2203/1178Means for venting or for letting gases escape
H05K2203/1184Underetching
H05K2203/1189Pressing leads, bumps or a die through an insulating layer
H05K2203/1194Thermal treatment leading to a different chemical state of a material
H05K2203/12Using specific substances
H05K2203/121Metallo-organic compounds
H05K2203/122Organic non-polymeric compounds
H05K2203/124Heterocyclic organic compounds
H05K2203/125Inorganic compounds
H05K2203/127Lubricants
H05K2203/128Molten metals
H05K2203/13Moulding and encapsulation Deposition techniques Protective layers
H05K2203/1305Moulding and encapsulation
H05K2203/1311Foil encapsulation
H05K2203/1316Moulded encapsulation of mounted components
H05K2203/1322Encapsulation comprising more than one layer
H05K2203/1327Moulding over PCB locally or completely
H05K2203/1333Deposition techniques
H05K2203/1338Chemical vapour deposition
H05K2203/1344Spraying small metal particles or droplets of molten metal
H05K2203/135Electrophoretic deposition of insulating material
H05K2203/1355Powder coating of insulating material
H05K2203/1361Coating by immersion in coating bath
H05K2203/1366Spraying coating
H05K2203/1372Coating by using a liquid wave
H05K2203/1377Protective layers
H05K2203/1383Temporary protective insulating layer
H05K2203/1388Temporary protective conductive layer
H05K2203/1394Covering open PTHs
H05K2203/14Related to the order of processing steps
H05K2203/1407Applying catalyst before applying plating resist
H05K2203/1415Applying catalyst after applying plating resist
H05K2203/1423Applying catalyst before etching
H05K2203/143Treating holes before another process
H05K2203/1438Treating holes after another process
H05K2203/1446Treatment after insertion of lead into hole
H05K2203/1453Applying the circuit pattern before another process
H05K2203/1461Applying or finishing the circuit pattern after another process
H05K2203/1469Circuit made after mounting or encapsulation of the components
H05K2203/1476Same or similar kind of process performed in phases
H05K2203/1484Simultaneous treatments
H05K2203/1492Periodical treatments
H05K2203/15Position of the PCB during processing
H05K2203/1509Horizontally held PCB
H05K2203/1518Vertically held PCB
H05K2203/1527Obliquely held PCB
H05K2203/1536Temporarily stacked PCBs
H05K2203/1545Continuous processing
H05K2203/1554Rotating or turning the PCB in a continuous manner
H05K2203/1563Reversing the PCB
H05K2203/1572Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides
H05K2203/1581Treating the backside of the PCB
H05K2203/159Using gravitational force Processing against the gravity direction Using centrifugal force
H05K2203/16Inspection Monitoring Aligning
H05K2203/161Using chemical substances
H05K2203/162Testing a finished product
H05K2203/163Monitoring a manufacturing process
H05K2203/165Stabilizing
H05K2203/166Alignment or registration Control of registration
H05K2203/167Using mechanical means for positioning, alignment or registration
H05K2203/168Wrong mounting prevention
H05K2203/17Post-manufacturing processes
H05K2203/171Tuning
H05K2203/173Adding connections between adjacent pads or conductors
H05K2203/175Configurations of connections suitable for easy deletion
H05K2203/176Removing, replacing or disconnecting component Easily removable component
H05K2203/178Demolishing
H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
H05K2203/302Bending a rigid substrate Breaking rigid substrates by bending
H05K2203/304Protecting a component during manufacturing
H05K2203/306Lifting the component during or after mounting Increasing the gap between component and PCB
H05K2203/308Sacrificial means